FR2505713A1 - Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables - Google Patents

Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables Download PDF

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Publication number
FR2505713A1
FR2505713A1 FR8110182A FR8110182A FR2505713A1 FR 2505713 A1 FR2505713 A1 FR 2505713A1 FR 8110182 A FR8110182 A FR 8110182A FR 8110182 A FR8110182 A FR 8110182A FR 2505713 A1 FR2505713 A1 FR 2505713A1
Authority
FR
France
Prior art keywords
disc
tissue
face
rack
polishing machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8110182A
Other languages
English (en)
French (fr)
Other versions
FR2505713B1 (enrdf_load_stackoverflow
Inventor
Lucien Grisel
Gabriel Bouladon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PROCEDES EQUIP SCIENCES IND SA
Original Assignee
PROCEDES EQUIP SCIENCES IND SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PROCEDES EQUIP SCIENCES IND SA filed Critical PROCEDES EQUIP SCIENCES IND SA
Priority to FR8110182A priority Critical patent/FR2505713A1/fr
Priority to JP57084680A priority patent/JPS57201169A/ja
Publication of FR2505713A1 publication Critical patent/FR2505713A1/fr
Application granted granted Critical
Publication of FR2505713B1 publication Critical patent/FR2505713B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR8110182A 1981-05-18 1981-05-18 Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables Granted FR2505713A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8110182A FR2505713A1 (fr) 1981-05-18 1981-05-18 Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables
JP57084680A JPS57201169A (en) 1981-05-18 1982-05-18 Holder for extremely thin fragile deformable wafer used in grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8110182A FR2505713A1 (fr) 1981-05-18 1981-05-18 Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables

Publications (2)

Publication Number Publication Date
FR2505713A1 true FR2505713A1 (fr) 1982-11-19
FR2505713B1 FR2505713B1 (enrdf_load_stackoverflow) 1985-01-11

Family

ID=9258756

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8110182A Granted FR2505713A1 (fr) 1981-05-18 1981-05-18 Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables

Country Status (2)

Country Link
JP (1) JPS57201169A (enrdf_load_stackoverflow)
FR (1) FR2505713A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4947598A (en) * 1982-04-23 1990-08-14 Disco Abrasive Systems, Ltd. Method for grinding the surface of a semiconductor wafer
US5122481A (en) * 1990-09-05 1992-06-16 Sumitomo Electric Industries, Ltd. Semiconductor element manufacturing process using sequential grinding and chemical etching steps
EP0805000A1 (en) * 1996-05-02 1997-11-05 MEMC Electronic Materials, Inc. Semiconductor wafer post-polish clean and dry method and apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997856U (ja) * 1982-12-18 1984-07-03 豊田工機株式会社 ラツプ装置
JPS63124460U (enrdf_load_stackoverflow) * 1987-02-07 1988-08-12
JP2007053949A (ja) * 2005-08-24 2007-03-08 Shimano Inc 玉の柄及びその口栓

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977130A (en) * 1975-05-12 1976-08-31 Semimetals, Inc. Removal-compensating polishing apparatus
US4194324A (en) * 1978-01-16 1980-03-25 Siltec Corporation Semiconductor wafer polishing machine and wafer carrier therefor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977130A (en) * 1975-05-12 1976-08-31 Semimetals, Inc. Removal-compensating polishing apparatus
US4194324A (en) * 1978-01-16 1980-03-25 Siltec Corporation Semiconductor wafer polishing machine and wafer carrier therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 6, novembre 1979, pages 2303,2304, New York (USA); *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4947598A (en) * 1982-04-23 1990-08-14 Disco Abrasive Systems, Ltd. Method for grinding the surface of a semiconductor wafer
US5122481A (en) * 1990-09-05 1992-06-16 Sumitomo Electric Industries, Ltd. Semiconductor element manufacturing process using sequential grinding and chemical etching steps
EP0805000A1 (en) * 1996-05-02 1997-11-05 MEMC Electronic Materials, Inc. Semiconductor wafer post-polish clean and dry method and apparatus

Also Published As

Publication number Publication date
FR2505713B1 (enrdf_load_stackoverflow) 1985-01-11
JPS57201169A (en) 1982-12-09

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Legal Events

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