JPS57201169A - Holder for extremely thin fragile deformable wafer used in grinder - Google Patents

Holder for extremely thin fragile deformable wafer used in grinder

Info

Publication number
JPS57201169A
JPS57201169A JP57084680A JP8468082A JPS57201169A JP S57201169 A JPS57201169 A JP S57201169A JP 57084680 A JP57084680 A JP 57084680A JP 8468082 A JP8468082 A JP 8468082A JP S57201169 A JPS57201169 A JP S57201169A
Authority
JP
Japan
Prior art keywords
grinder
holder
extremely thin
wafer used
thin fragile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57084680A
Other languages
English (en)
Japanese (ja)
Inventor
Guriseru Riyushian
Buradon Gaburieru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PROCEDES EQUIP SCIENCES IND
Purosede E Ekipuman Puuru Re Shiansu E Randeyusutori SA Pe Eru E Esu I
Original Assignee
PROCEDES EQUIP SCIENCES IND
Purosede E Ekipuman Puuru Re Shiansu E Randeyusutori SA Pe Eru E Esu I
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PROCEDES EQUIP SCIENCES IND, Purosede E Ekipuman Puuru Re Shiansu E Randeyusutori SA Pe Eru E Esu I filed Critical PROCEDES EQUIP SCIENCES IND
Publication of JPS57201169A publication Critical patent/JPS57201169A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP57084680A 1981-05-18 1982-05-18 Holder for extremely thin fragile deformable wafer used in grinder Pending JPS57201169A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8110182A FR2505713A1 (fr) 1981-05-18 1981-05-18 Porte-plaquette pour machines a polir des plaquettes minces, fragiles et deformables

Publications (1)

Publication Number Publication Date
JPS57201169A true JPS57201169A (en) 1982-12-09

Family

ID=9258756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57084680A Pending JPS57201169A (en) 1981-05-18 1982-05-18 Holder for extremely thin fragile deformable wafer used in grinder

Country Status (2)

Country Link
JP (1) JPS57201169A (enrdf_load_stackoverflow)
FR (1) FR2505713A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997856U (ja) * 1982-12-18 1984-07-03 豊田工機株式会社 ラツプ装置
JPS63124460U (enrdf_load_stackoverflow) * 1987-02-07 1988-08-12
JP2007053949A (ja) * 2005-08-24 2007-03-08 Shimano Inc 玉の柄及びその口栓

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58184727A (ja) * 1982-04-23 1983-10-28 Disco Abrasive Sys Ltd シリコンウェ−ハの面を研削する方法
JP2610703B2 (ja) * 1990-09-05 1997-05-14 住友電気工業株式会社 半導体素子の製造方法
EP0805000A1 (en) * 1996-05-02 1997-11-05 MEMC Electronic Materials, Inc. Semiconductor wafer post-polish clean and dry method and apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977130A (en) * 1975-05-12 1976-08-31 Semimetals, Inc. Removal-compensating polishing apparatus
US4194324A (en) * 1978-01-16 1980-03-25 Siltec Corporation Semiconductor wafer polishing machine and wafer carrier therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5997856U (ja) * 1982-12-18 1984-07-03 豊田工機株式会社 ラツプ装置
JPS63124460U (enrdf_load_stackoverflow) * 1987-02-07 1988-08-12
JP2007053949A (ja) * 2005-08-24 2007-03-08 Shimano Inc 玉の柄及びその口栓

Also Published As

Publication number Publication date
FR2505713A1 (fr) 1982-11-19
FR2505713B1 (enrdf_load_stackoverflow) 1985-01-11

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