FR2490917A1 - Boitier pour circuit electrique et procede de fabrication - Google Patents

Boitier pour circuit electrique et procede de fabrication Download PDF

Info

Publication number
FR2490917A1
FR2490917A1 FR8018941A FR8018941A FR2490917A1 FR 2490917 A1 FR2490917 A1 FR 2490917A1 FR 8018941 A FR8018941 A FR 8018941A FR 8018941 A FR8018941 A FR 8018941A FR 2490917 A1 FR2490917 A1 FR 2490917A1
Authority
FR
France
Prior art keywords
molding compound
printed circuit
circuit
matrix
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8018941A
Other languages
English (en)
French (fr)
Other versions
FR2490917B1 (enExample
Inventor
M De Smirnoff
A Jouvet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Freescale Semiconducteurs France SAS
Original Assignee
Motorola Semiconducteurs SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Semiconducteurs SA filed Critical Motorola Semiconducteurs SA
Priority to FR8018941A priority Critical patent/FR2490917A1/fr
Publication of FR2490917A1 publication Critical patent/FR2490917A1/fr
Application granted granted Critical
Publication of FR2490917B1 publication Critical patent/FR2490917B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
FR8018941A 1980-09-02 1980-09-02 Boitier pour circuit electrique et procede de fabrication Granted FR2490917A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8018941A FR2490917A1 (fr) 1980-09-02 1980-09-02 Boitier pour circuit electrique et procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8018941A FR2490917A1 (fr) 1980-09-02 1980-09-02 Boitier pour circuit electrique et procede de fabrication

Publications (2)

Publication Number Publication Date
FR2490917A1 true FR2490917A1 (fr) 1982-03-26
FR2490917B1 FR2490917B1 (enExample) 1985-01-04

Family

ID=9245575

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8018941A Granted FR2490917A1 (fr) 1980-09-02 1980-09-02 Boitier pour circuit electrique et procede de fabrication

Country Status (1)

Country Link
FR (1) FR2490917A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2545653A1 (fr) * 1983-05-04 1984-11-09 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
EP0620591A1 (en) * 1993-04-12 1994-10-19 Delco Electronics Corporation Silicone over-mould of a flip-chip device
EP0969502A3 (en) * 1998-07-02 2006-03-01 Murata Manufacturing Co., Ltd. Resin encapsulated electronic parts and method of manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2818080A1 (de) * 1977-04-26 1978-11-09 Tokyo Shibaura Electric Co Verkapselte halbleitereinrichtung
DE2916954A1 (de) * 1978-04-26 1979-10-31 Tokyo Shibaura Electric Co In kunststoff eingebettete halbleitervorrichtung
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2818080A1 (de) * 1977-04-26 1978-11-09 Tokyo Shibaura Electric Co Verkapselte halbleitereinrichtung
DE2916954A1 (de) * 1978-04-26 1979-10-31 Tokyo Shibaura Electric Co In kunststoff eingebettete halbleitervorrichtung
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2545653A1 (fr) * 1983-05-04 1984-11-09 Pichot Michel Procede et dispositif d'encapsulation de circuits integres
EP0620591A1 (en) * 1993-04-12 1994-10-19 Delco Electronics Corporation Silicone over-mould of a flip-chip device
EP0969502A3 (en) * 1998-07-02 2006-03-01 Murata Manufacturing Co., Ltd. Resin encapsulated electronic parts and method of manufacturing the same

Also Published As

Publication number Publication date
FR2490917B1 (enExample) 1985-01-04

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