FR2485796A1 - Resistance electrique chauffante et tete d'imprimante thermique comportant de telles resistances chauffantes - Google Patents

Resistance electrique chauffante et tete d'imprimante thermique comportant de telles resistances chauffantes Download PDF

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Publication number
FR2485796A1
FR2485796A1 FR8013967A FR8013967A FR2485796A1 FR 2485796 A1 FR2485796 A1 FR 2485796A1 FR 8013967 A FR8013967 A FR 8013967A FR 8013967 A FR8013967 A FR 8013967A FR 2485796 A1 FR2485796 A1 FR 2485796A1
Authority
FR
France
Prior art keywords
layer
temperature
resistivity
resistors
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8013967A
Other languages
English (en)
French (fr)
Other versions
FR2485796B1 (enExample
Inventor
Christian Val
Didier Pribat
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8013967A priority Critical patent/FR2485796A1/fr
Priority to DE8181400923T priority patent/DE3165766D1/de
Priority to EP81400923A priority patent/EP0044756B1/fr
Priority to US06/274,376 priority patent/US4413170A/en
Publication of FR2485796A1 publication Critical patent/FR2485796A1/fr
Application granted granted Critical
Publication of FR2485796B1 publication Critical patent/FR2485796B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33515—Heater layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33535—Substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3355—Structure of thermal heads characterised by materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors

Landscapes

  • Electronic Switches (AREA)
FR8013967A 1980-06-24 1980-06-24 Resistance electrique chauffante et tete d'imprimante thermique comportant de telles resistances chauffantes Granted FR2485796A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR8013967A FR2485796A1 (fr) 1980-06-24 1980-06-24 Resistance electrique chauffante et tete d'imprimante thermique comportant de telles resistances chauffantes
DE8181400923T DE3165766D1 (en) 1980-06-24 1981-06-11 Heating resistor and thermal printing head using such a heating resistor
EP81400923A EP0044756B1 (fr) 1980-06-24 1981-06-11 Résistance électrique chauffante et tête d'imprimante thermique comportant de telles résistances chauffantes
US06/274,376 US4413170A (en) 1980-06-24 1981-06-17 Thermal printing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8013967A FR2485796A1 (fr) 1980-06-24 1980-06-24 Resistance electrique chauffante et tete d'imprimante thermique comportant de telles resistances chauffantes

Publications (2)

Publication Number Publication Date
FR2485796A1 true FR2485796A1 (fr) 1981-12-31
FR2485796B1 FR2485796B1 (enExample) 1983-07-22

Family

ID=9243445

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8013967A Granted FR2485796A1 (fr) 1980-06-24 1980-06-24 Resistance electrique chauffante et tete d'imprimante thermique comportant de telles resistances chauffantes

Country Status (4)

Country Link
US (1) US4413170A (enExample)
EP (1) EP0044756B1 (enExample)
DE (1) DE3165766D1 (enExample)
FR (1) FR2485796A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4484823A (en) * 1981-01-17 1984-11-27 Fag Kugelfischer Georg Schafer & Co. Method of determining the boiling point of a liquid
JPS5949985A (ja) * 1982-09-14 1984-03-22 Toshiba Corp 感熱印字方式
JPS60104351A (ja) * 1983-11-12 1985-06-08 Victor Co Of Japan Ltd 感熱転写記録方法
JPS60184858A (ja) * 1984-03-02 1985-09-20 Hitachi Ltd サ−マルヘツド
US4528539A (en) * 1984-06-28 1985-07-09 Eaton Corporation Reduced-size thermal overload relay
JPS6186269A (ja) * 1984-10-04 1986-05-01 Tdk Corp サ−マルヘツド
GB8521931D0 (en) * 1985-09-04 1985-10-09 British Aerospace Thermal image producing device
FR2591801B1 (fr) * 1985-12-17 1988-10-14 Inf Milit Spatiale Aeronaut Boitier d'encapsulation d'un circuit electronique
US4947189A (en) * 1989-05-12 1990-08-07 Eastman Kodak Company Bubble jet print head having improved resistive heater and electrode construction
FR2688629A1 (fr) * 1992-03-10 1993-09-17 Thomson Csf Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices.
JPH05275161A (ja) * 1992-03-26 1993-10-22 Rohm Co Ltd ライン型加熱体
US5408070A (en) * 1992-11-09 1995-04-18 American Roller Company Ceramic heater roller with thermal regulating layer
FR2709020B1 (fr) * 1993-08-13 1995-09-08 Thomson Csf Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant.
DE4328791C2 (de) * 1993-08-26 1997-07-17 Siemens Matsushita Components Hybrid-Thermistortemperaturfühler
BE1007868A3 (nl) * 1993-12-10 1995-11-07 Koninkl Philips Electronics Nv Elektrische weerstand.
FR2719967B1 (fr) * 1994-05-10 1996-06-07 Thomson Csf Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés.
FR2780808B1 (fr) 1998-07-03 2001-08-10 Thomson Csf Dispositif a emission de champ et procedes de fabrication
FR2802706B1 (fr) * 1999-12-15 2002-03-01 3D Plus Sa Procede et dispositif d'interconnexion en trois dimensions de composants electroniques
FR2875672B1 (fr) * 2004-09-21 2007-05-11 3D Plus Sa Sa Dispositif electronique avec repartiteur de chaleur integre
FR2894070B1 (fr) * 2005-11-30 2008-04-11 3D Plus Sa Sa Module electronique 3d
FR2895568B1 (fr) * 2005-12-23 2008-02-08 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2905198B1 (fr) * 2006-08-22 2008-10-17 3D Plus Sa Sa Procede de fabrication collective de modules electroniques 3d
FR2923081B1 (fr) * 2007-10-26 2009-12-11 3D Plus Procede d'interconnexion verticale de modules electroniques 3d par des vias.
FR2943176B1 (fr) 2009-03-10 2011-08-05 3D Plus Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee
US8143559B2 (en) * 2009-09-01 2012-03-27 Advance Thermo Control, Ltd. Heating pad with temperature control and safety protection device
JP6930696B2 (ja) * 2016-10-14 2021-09-01 ローム株式会社 サーマルプリントヘッド

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2220139A5 (enExample) * 1973-03-01 1974-09-27 Bosch Gmbh Robert
FR2311410A1 (fr) * 1975-05-13 1976-12-10 Thomson Csf Circuit de commutation integre, matrice de commutation et circuits logiques utilisant ledit circuit

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2915724A (en) * 1957-06-06 1959-12-01 Minnesota Mining & Mfg Electrical device
US3973106A (en) * 1974-11-15 1976-08-03 Hewlett-Packard Company Thin film thermal print head
US4213030A (en) * 1977-07-21 1980-07-15 Kyoto Ceramic Kabushiki Kaisha Silicon-semiconductor-type thermal head
US4246468A (en) * 1978-01-30 1981-01-20 Raychem Corporation Electrical devices containing PTC elements
US4206541A (en) * 1978-06-26 1980-06-10 Extel Corporation Method of manufacturing thin film thermal print heads

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2220139A5 (enExample) * 1973-03-01 1974-09-27 Bosch Gmbh Robert
FR2311410A1 (fr) * 1975-05-13 1976-12-10 Thomson Csf Circuit de commutation integre, matrice de commutation et circuits logiques utilisant ledit circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
DE3165766D1 (en) 1984-10-04
FR2485796B1 (enExample) 1983-07-22
US4413170A (en) 1983-11-01
EP0044756B1 (fr) 1984-08-29
EP0044756A2 (fr) 1982-01-27
EP0044756A3 (en) 1982-02-10

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Legal Events

Date Code Title Description
ST Notification of lapse