FR2485263A1 - Assemblage de chassis pour maintenir ensemble sous une pression elastique un empilage de composants electriques - Google Patents
Assemblage de chassis pour maintenir ensemble sous une pression elastique un empilage de composants electriques Download PDFInfo
- Publication number
- FR2485263A1 FR2485263A1 FR8103882A FR8103882A FR2485263A1 FR 2485263 A1 FR2485263 A1 FR 2485263A1 FR 8103882 A FR8103882 A FR 8103882A FR 8103882 A FR8103882 A FR 8103882A FR 2485263 A1 FR2485263 A1 FR 2485263A1
- Authority
- FR
- France
- Prior art keywords
- stack
- devices
- members
- stacking
- stops
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Die Bonding (AREA)
- Battery Mounting, Suspending (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12468980A | 1980-02-26 | 1980-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2485263A1 true FR2485263A1 (fr) | 1981-12-24 |
Family
ID=22416286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8103882A Withdrawn FR2485263A1 (fr) | 1980-02-26 | 1981-02-26 | Assemblage de chassis pour maintenir ensemble sous une pression elastique un empilage de composants electriques |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS56133862A (it) |
| KR (1) | KR830005723A (it) |
| BR (1) | BR8101069A (it) |
| ES (1) | ES267972Y (it) |
| FR (1) | FR2485263A1 (it) |
| IT (1) | IT1168486B (it) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2529387A1 (fr) * | 1982-06-29 | 1983-12-30 | Jeumont Schneider | Montage de pastilles semi-conductrices de puissance |
| CN108206152A (zh) * | 2018-01-04 | 2018-06-26 | 许继集团有限公司 | 一种igbt取换方法及实施该方法的igbt取换装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5529586B2 (it) * | 1974-02-20 | 1980-08-05 |
-
1981
- 1981-02-23 BR BR8101069A patent/BR8101069A/pt unknown
- 1981-02-26 KR KR1019810000640A patent/KR830005723A/ko unknown
- 1981-02-26 IT IT41537/81A patent/IT1168486B/it active
- 1981-02-26 ES ES1981267972U patent/ES267972Y/es not_active Expired
- 1981-02-26 FR FR8103882A patent/FR2485263A1/fr not_active Withdrawn
- 1981-02-26 JP JP2622581A patent/JPS56133862A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2529387A1 (fr) * | 1982-06-29 | 1983-12-30 | Jeumont Schneider | Montage de pastilles semi-conductrices de puissance |
| CN108206152A (zh) * | 2018-01-04 | 2018-06-26 | 许继集团有限公司 | 一种igbt取换方法及实施该方法的igbt取换装置 |
| CN108206152B (zh) * | 2018-01-04 | 2021-05-18 | 许继集团有限公司 | 一种igbt取换方法及实施该方法的igbt取换装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| IT8141537A0 (it) | 1981-02-26 |
| KR830005723A (ko) | 1983-09-09 |
| IT1168486B (it) | 1987-05-20 |
| ES267972U (es) | 1983-05-01 |
| BR8101069A (pt) | 1981-09-01 |
| ES267972Y (es) | 1983-11-16 |
| IT8141537A1 (it) | 1982-08-26 |
| JPS5738032B2 (it) | 1982-08-13 |
| JPS56133862A (en) | 1981-10-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse | ||
| AR | Application made for restoration | ||
| BR | Restoration of rights | ||
| ST | Notification of lapse |