BR8101069A - Conjunto de armacao para unir entre si,sob pressao resiliente,componentes eletricos,em pilha - Google Patents

Conjunto de armacao para unir entre si,sob pressao resiliente,componentes eletricos,em pilha

Info

Publication number
BR8101069A
BR8101069A BR8101069A BR8101069A BR8101069A BR 8101069 A BR8101069 A BR 8101069A BR 8101069 A BR8101069 A BR 8101069A BR 8101069 A BR8101069 A BR 8101069A BR 8101069 A BR8101069 A BR 8101069A
Authority
BR
Brazil
Prior art keywords
stack
connect
electrical components
armature assembly
resilient pressure
Prior art date
Application number
BR8101069A
Other languages
English (en)
Inventor
W Romanczuk
W Watkins
P Reiter
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of BR8101069A publication Critical patent/BR8101069A/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
  • Rectifiers (AREA)
  • Battery Mounting, Suspending (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BR8101069A 1980-02-26 1981-02-23 Conjunto de armacao para unir entre si,sob pressao resiliente,componentes eletricos,em pilha BR8101069A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12468980A 1980-02-26 1980-02-26

Publications (1)

Publication Number Publication Date
BR8101069A true BR8101069A (pt) 1981-09-01

Family

ID=22416286

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8101069A BR8101069A (pt) 1980-02-26 1981-02-23 Conjunto de armacao para unir entre si,sob pressao resiliente,componentes eletricos,em pilha

Country Status (6)

Country Link
JP (1) JPS56133862A (pt)
KR (1) KR830005723A (pt)
BR (1) BR8101069A (pt)
ES (1) ES267972Y (pt)
FR (1) FR2485263A1 (pt)
IT (1) IT1168486B (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2529387B1 (fr) * 1982-06-29 1985-09-06 Jeumont Schneider Montage de pastilles semi-conductrices de puissance
CN108206152B (zh) * 2018-01-04 2021-05-18 许继集团有限公司 一种igbt取换方法及实施该方法的igbt取换装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529586B2 (pt) * 1974-02-20 1980-08-05

Also Published As

Publication number Publication date
ES267972Y (es) 1983-11-16
JPS56133862A (en) 1981-10-20
IT8141537A1 (it) 1982-08-26
KR830005723A (ko) 1983-09-09
IT8141537A0 (it) 1981-02-26
FR2485263A1 (fr) 1981-12-24
JPS5738032B2 (pt) 1982-08-13
ES267972U (es) 1983-05-01
IT1168486B (it) 1987-05-20

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