FR2480554A1 - Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques - Google Patents

Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques Download PDF

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Publication number
FR2480554A1
FR2480554A1 FR8008396A FR8008396A FR2480554A1 FR 2480554 A1 FR2480554 A1 FR 2480554A1 FR 8008396 A FR8008396 A FR 8008396A FR 8008396 A FR8008396 A FR 8008396A FR 2480554 A1 FR2480554 A1 FR 2480554A1
Authority
FR
France
Prior art keywords
holes
conductive
core
printed circuit
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8008396A
Other languages
English (en)
French (fr)
Other versions
FR2480554B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR8008396A priority Critical patent/FR2480554A1/fr
Publication of FR2480554A1 publication Critical patent/FR2480554A1/fr
Application granted granted Critical
Publication of FR2480554B1 publication Critical patent/FR2480554B1/fr
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FR8008396A 1980-04-15 1980-04-15 Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques Granted FR2480554A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8008396A FR2480554A1 (fr) 1980-04-15 1980-04-15 Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8008396A FR2480554A1 (fr) 1980-04-15 1980-04-15 Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques

Publications (2)

Publication Number Publication Date
FR2480554A1 true FR2480554A1 (fr) 1981-10-16
FR2480554B1 FR2480554B1 (enExample) 1984-03-23

Family

ID=9240886

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8008396A Granted FR2480554A1 (fr) 1980-04-15 1980-04-15 Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques

Country Status (1)

Country Link
FR (1) FR2480554A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993026144A1 (de) * 1992-06-15 1993-12-23 Dyconex Patente Ag Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen
EP1367876A1 (de) * 2002-05-31 2003-12-03 Festo Ag & Co. Verdrahtungsträger einschliesslich Herstellungsverfahren und damit ausgestattetes elektrisches Gerät
WO2006013145A1 (de) * 2004-08-03 2006-02-09 Endress+Hauser Gmbh+Co. Kg Leiterplatte mit smd-bauteilen und mindestens einem bedrahteten bauteil sowie ein verfahren zum bestücken, befestigen und elektrischen kontaktieren der bauteile

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2912747A (en) * 1955-11-07 1959-11-17 Erie Resistor Corp Method of making printed circuit panels
US3040119A (en) * 1960-12-27 1962-06-19 Granzow Clarence Edward Electric circuit board
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2912747A (en) * 1955-11-07 1959-11-17 Erie Resistor Corp Method of making printed circuit panels
US3040119A (en) * 1960-12-27 1962-06-19 Granzow Clarence Edward Electric circuit board
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/64 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993026144A1 (de) * 1992-06-15 1993-12-23 Dyconex Patente Ag Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen
EP1367876A1 (de) * 2002-05-31 2003-12-03 Festo Ag & Co. Verdrahtungsträger einschliesslich Herstellungsverfahren und damit ausgestattetes elektrisches Gerät
WO2006013145A1 (de) * 2004-08-03 2006-02-09 Endress+Hauser Gmbh+Co. Kg Leiterplatte mit smd-bauteilen und mindestens einem bedrahteten bauteil sowie ein verfahren zum bestücken, befestigen und elektrischen kontaktieren der bauteile

Also Published As

Publication number Publication date
FR2480554B1 (enExample) 1984-03-23

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