FR2480554A1 - Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques - Google Patents
Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques Download PDFInfo
- Publication number
- FR2480554A1 FR2480554A1 FR8008396A FR8008396A FR2480554A1 FR 2480554 A1 FR2480554 A1 FR 2480554A1 FR 8008396 A FR8008396 A FR 8008396A FR 8008396 A FR8008396 A FR 8008396A FR 2480554 A1 FR2480554 A1 FR 2480554A1
- Authority
- FR
- France
- Prior art keywords
- holes
- conductive
- core
- printed circuit
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 23
- 239000004033 plastic Substances 0.000 title abstract description 10
- 229920003023 plastic Polymers 0.000 title abstract description 10
- 239000011888 foil Substances 0.000 title abstract 5
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 27
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000004080 punching Methods 0.000 claims abstract description 8
- 230000001464 adherent effect Effects 0.000 claims abstract description 5
- 239000011230 binding agent Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000806 elastomer Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000013528 metallic particle Substances 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 230000035939 shock Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000002923 metal particle Substances 0.000 description 3
- 238000011112 process operation Methods 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8008396A FR2480554A1 (fr) | 1980-04-15 | 1980-04-15 | Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8008396A FR2480554A1 (fr) | 1980-04-15 | 1980-04-15 | Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2480554A1 true FR2480554A1 (fr) | 1981-10-16 |
| FR2480554B1 FR2480554B1 (enExample) | 1984-03-23 |
Family
ID=9240886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8008396A Granted FR2480554A1 (fr) | 1980-04-15 | 1980-04-15 | Procede pour la fabrication de circuits imprimes devant recevoir des composants electriques et electroniques |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2480554A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993026144A1 (de) * | 1992-06-15 | 1993-12-23 | Dyconex Patente Ag | Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen |
| EP1367876A1 (de) * | 2002-05-31 | 2003-12-03 | Festo Ag & Co. | Verdrahtungsträger einschliesslich Herstellungsverfahren und damit ausgestattetes elektrisches Gerät |
| WO2006013145A1 (de) * | 2004-08-03 | 2006-02-09 | Endress+Hauser Gmbh+Co. Kg | Leiterplatte mit smd-bauteilen und mindestens einem bedrahteten bauteil sowie ein verfahren zum bestücken, befestigen und elektrischen kontaktieren der bauteile |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2912747A (en) * | 1955-11-07 | 1959-11-17 | Erie Resistor Corp | Method of making printed circuit panels |
| US3040119A (en) * | 1960-12-27 | 1962-06-19 | Granzow Clarence Edward | Electric circuit board |
| US3971610A (en) * | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
-
1980
- 1980-04-15 FR FR8008396A patent/FR2480554A1/fr active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2912747A (en) * | 1955-11-07 | 1959-11-17 | Erie Resistor Corp | Method of making printed circuit panels |
| US3040119A (en) * | 1960-12-27 | 1962-06-19 | Granzow Clarence Edward | Electric circuit board |
| US3971610A (en) * | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
Non-Patent Citations (1)
| Title |
|---|
| EXBK/64 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993026144A1 (de) * | 1992-06-15 | 1993-12-23 | Dyconex Patente Ag | Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen |
| EP1367876A1 (de) * | 2002-05-31 | 2003-12-03 | Festo Ag & Co. | Verdrahtungsträger einschliesslich Herstellungsverfahren und damit ausgestattetes elektrisches Gerät |
| WO2006013145A1 (de) * | 2004-08-03 | 2006-02-09 | Endress+Hauser Gmbh+Co. Kg | Leiterplatte mit smd-bauteilen und mindestens einem bedrahteten bauteil sowie ein verfahren zum bestücken, befestigen und elektrischen kontaktieren der bauteile |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2480554B1 (enExample) | 1984-03-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |