FR2479714B1 - Procede de fabrication de microfils, dispositif pour la mise en oeuvre dudit procede et microfils obtenus par ledit procede - Google Patents
Procede de fabrication de microfils, dispositif pour la mise en oeuvre dudit procede et microfils obtenus par ledit procedeInfo
- Publication number
- FR2479714B1 FR2479714B1 FR8106653A FR8106653A FR2479714B1 FR 2479714 B1 FR2479714 B1 FR 2479714B1 FR 8106653 A FR8106653 A FR 8106653A FR 8106653 A FR8106653 A FR 8106653A FR 2479714 B1 FR2479714 B1 FR 2479714B1
- Authority
- FR
- France
- Prior art keywords
- microwires
- carrying
- manufacturing
- manufacturing microwires
- microwires obtained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title 3
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C3/00—Profiling tools for metal drawing; Combinations of dies and mandrels
- B21C3/02—Dies; Selection of material therefor; Cleaning thereof
- B21C3/06—Dies; Selection of material therefor; Cleaning thereof with adjustable section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B15/00—Arrangements for performing additional metal-working operations specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills
- B21B2015/0028—Drawing the rolled product
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01041—Niobium [Nb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal Extraction Processes (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2898658 | 1980-04-03 | ||
| SU802898659A SU1058661A1 (ru) | 1980-04-03 | 1980-04-03 | Устройство дл волочени микропроволоки |
| SU802898652A SU1058659A1 (ru) | 1980-04-03 | 1980-04-03 | Устройство дл волочени микропроволоки |
| SU802898653A SU1058660A1 (ru) | 1980-04-03 | 1980-04-03 | Устройство дл волочени микропроволоки |
| SU802898655A SU1066691A2 (ru) | 1980-04-03 | 1980-04-03 | Устройство дл волочени микропроволоки |
| SU802926251A SU1058662A1 (ru) | 1980-06-04 | 1980-06-04 | Устройство дл волочени микропроволоки |
| SU802926253A SU1058663A1 (ru) | 1980-06-04 | 1980-06-04 | Устройство дл волочени микропроволоки |
| SU2926252 | 1980-06-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2479714A1 FR2479714A1 (fr) | 1981-10-09 |
| FR2479714B1 true FR2479714B1 (fr) | 1985-11-29 |
Family
ID=27573854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8106653A Expired FR2479714B1 (fr) | 1980-04-03 | 1981-04-02 | Procede de fabrication de microfils, dispositif pour la mise en oeuvre dudit procede et microfils obtenus par ledit procede |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR2479714B1 (fr) |
| IT (1) | IT1169238B (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH660696A5 (en) * | 1983-07-28 | 1987-06-15 | Bruss Polt I | Apparatus for the production of microwire |
| FR2606304B1 (fr) * | 1986-11-07 | 1991-12-27 | Bruss Polt I | Procede et dispositif de dressage d'un fil metallique |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1618515A (en) * | 1921-05-28 | 1927-02-22 | William C Coryell | Metal working |
| US2092188A (en) * | 1935-07-05 | 1937-09-07 | Simons Aaron | Process and apparatus for drawing metal strips |
| DE837988C (de) * | 1951-01-20 | 1952-05-05 | Otto Busselmeier Dipl Ing | Verfahren und Vorrichtung zur Herstellung von Draht, insbesondere Metalldraht |
| ES344113A1 (es) * | 1966-08-22 | 1968-09-16 | Rotary Profile Anstalt | Un metodo y aparato para la formacion de articulos metali- cos de palanquillas o piezas en bruto. |
| DE2037889C3 (de) * | 1970-07-27 | 1979-04-05 | Brunswick Corp., Chicago, Ill. (V.St.A.) | Verfahren zum Herstellen von Metallfaden |
| US3955390A (en) * | 1973-02-21 | 1976-05-11 | Brunswick Corporation | Twist drawn wire, process and apparatus for making same |
| US3883371A (en) * | 1973-02-21 | 1975-05-13 | Brunswick Corp | Twist drawn wire |
-
1981
- 1981-04-02 FR FR8106653A patent/FR2479714B1/fr not_active Expired
- 1981-04-03 IT IT20927/81A patent/IT1169238B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| IT1169238B (it) | 1987-05-27 |
| FR2479714A1 (fr) | 1981-10-09 |
| IT8120927A0 (it) | 1981-04-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |