FR2479639A1 - Dispositif d'assemblage entre composants electroniques de caracteristiques mecaniques differentes et son procede de realisation - Google Patents
Dispositif d'assemblage entre composants electroniques de caracteristiques mecaniques differentes et son procede de realisation Download PDFInfo
- Publication number
- FR2479639A1 FR2479639A1 FR8006611A FR8006611A FR2479639A1 FR 2479639 A1 FR2479639 A1 FR 2479639A1 FR 8006611 A FR8006611 A FR 8006611A FR 8006611 A FR8006611 A FR 8006611A FR 2479639 A1 FR2479639 A1 FR 2479639A1
- Authority
- FR
- France
- Prior art keywords
- bridges
- component
- substrate
- connections
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 15
- 239000002184 metal Substances 0.000 title claims description 15
- 239000000758 substrate Substances 0.000 title abstract description 52
- 238000000034 method Methods 0.000 title abstract description 5
- 229910000679 solder Inorganic materials 0.000 title abstract description 4
- 239000003292 glue Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000004090 dissolution Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- 230000000873 masking effect Effects 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 239000011368 organic material Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 19
- 229910052802 copper Inorganic materials 0.000 abstract description 18
- 239000010949 copper Substances 0.000 abstract description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 12
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 10
- 238000001465 metallisation Methods 0.000 abstract description 9
- 229910052759 nickel Inorganic materials 0.000 abstract description 6
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000008602 contraction Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 description 11
- 229910052804 chromium Inorganic materials 0.000 description 6
- 239000011651 chromium Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8006611A FR2479639A1 (fr) | 1980-03-25 | 1980-03-25 | Dispositif d'assemblage entre composants electroniques de caracteristiques mecaniques differentes et son procede de realisation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8006611A FR2479639A1 (fr) | 1980-03-25 | 1980-03-25 | Dispositif d'assemblage entre composants electroniques de caracteristiques mecaniques differentes et son procede de realisation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2479639A1 true FR2479639A1 (fr) | 1981-10-02 |
| FR2479639B1 FR2479639B1 (cg-RX-API-DMAC7.html) | 1984-02-17 |
Family
ID=9240074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8006611A Granted FR2479639A1 (fr) | 1980-03-25 | 1980-03-25 | Dispositif d'assemblage entre composants electroniques de caracteristiques mecaniques differentes et son procede de realisation |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2479639A1 (cg-RX-API-DMAC7.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2487153A1 (fr) * | 1980-07-17 | 1982-01-22 | Sony Corp | Panneau de circuit imprime |
| EP0263277A3 (en) * | 1986-10-06 | 1989-03-15 | International Business Machines Corporation | A flexible electrical connection and method of making same |
| EP0352183A1 (fr) * | 1988-07-20 | 1990-01-24 | Matra Marconi Space France | Procédé de montage de micro-composants électroniques sur un support et produit intermédiaire |
| EP0355965A3 (en) * | 1988-08-16 | 1991-08-07 | DELCO ELECTRONICS CORPORATION (a Delaware corp.) | A method of achieving selective inhibition and control of adhesion in thick-film conductors |
| US5122929A (en) * | 1988-08-16 | 1992-06-16 | Delco Electronics Corporation | Method of achieving selective inhibition and control of adhesion in thick-film conductors |
| US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1419773A (fr) * | 1964-10-19 | 1965-12-03 | Cie Des Produits Elementaires | Procédé permettant la réalisation de contacts électriques saillants à la surface d'agencements de plaquettes isolantes porteuses de réseaux de conducteurs métalliques |
| FR1532026A (fr) * | 1966-06-23 | 1968-07-05 | Int Standard Electric Corp | Procédé de fabrication d'un montage de circuit électrique |
| FR2331891A1 (fr) * | 1975-11-13 | 1977-06-10 | Tektronix Inc | Contact electrique et procede de fabrication de celui-ci |
-
1980
- 1980-03-25 FR FR8006611A patent/FR2479639A1/fr active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1419773A (fr) * | 1964-10-19 | 1965-12-03 | Cie Des Produits Elementaires | Procédé permettant la réalisation de contacts électriques saillants à la surface d'agencements de plaquettes isolantes porteuses de réseaux de conducteurs métalliques |
| FR1532026A (fr) * | 1966-06-23 | 1968-07-05 | Int Standard Electric Corp | Procédé de fabrication d'un montage de circuit électrique |
| FR2331891A1 (fr) * | 1975-11-13 | 1977-06-10 | Tektronix Inc | Contact electrique et procede de fabrication de celui-ci |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2487153A1 (fr) * | 1980-07-17 | 1982-01-22 | Sony Corp | Panneau de circuit imprime |
| EP0263277A3 (en) * | 1986-10-06 | 1989-03-15 | International Business Machines Corporation | A flexible electrical connection and method of making same |
| EP0352183A1 (fr) * | 1988-07-20 | 1990-01-24 | Matra Marconi Space France | Procédé de montage de micro-composants électroniques sur un support et produit intermédiaire |
| FR2634616A1 (fr) * | 1988-07-20 | 1990-01-26 | Matra | Procede de montage de micro-composants electroniques sur un support et produit realisable par le procede |
| EP0355965A3 (en) * | 1988-08-16 | 1991-08-07 | DELCO ELECTRONICS CORPORATION (a Delaware corp.) | A method of achieving selective inhibition and control of adhesion in thick-film conductors |
| US5122929A (en) * | 1988-08-16 | 1992-06-16 | Delco Electronics Corporation | Method of achieving selective inhibition and control of adhesion in thick-film conductors |
| US8359740B2 (en) | 2008-12-19 | 2013-01-29 | 3D Plus | Process for the wafer-scale fabrication of electronic modules for surface mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2479639B1 (cg-RX-API-DMAC7.html) | 1984-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |