FR2457912A1 - Procede d'electro-deposition d'un metal sur un substrat - Google Patents

Procede d'electro-deposition d'un metal sur un substrat

Info

Publication number
FR2457912A1
FR2457912A1 FR8012123A FR8012123A FR2457912A1 FR 2457912 A1 FR2457912 A1 FR 2457912A1 FR 8012123 A FR8012123 A FR 8012123A FR 8012123 A FR8012123 A FR 8012123A FR 2457912 A1 FR2457912 A1 FR 2457912A1
Authority
FR
France
Prior art keywords
metal
electrode
substrate
point
electro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8012123A
Other languages
English (en)
Other versions
FR2457912B1 (fr
Inventor
Kiyoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Publication of FR2457912A1 publication Critical patent/FR2457912A1/fr
Application granted granted Critical
Publication of FR2457912B1 publication Critical patent/FR2457912B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'INVENTION CONCERNE UN PROCEDE DE DEPOT PAR VOIE ELECTROLYTIQUE D'UN METAL SUR UN SUBSTRAT, EN PARTICULIER SUR UNE SURFACE COURBE. LA POINTE 17A DE L'ELECTRODE 17 EST DEPLACEE LE LONG DE LA SURFACE COURBE DE LA PIECE 1 A REVETIR, SELON LA LOI G GLSINA, G ETANT LA DISTANCE ENTRE LA POINTE DE L'ELECTRODE ET LE POINT D'INTERSECTION DE L'AXE DE L'ELECTRODE AVEC LADITE SURFACE, A ETANT L'ANGLE ENTRE CET AXE ET UNE TANGENTE A LADITE SURFACE AU POINT D'INTERSECTION, GS ETANT UNE CONSTANTE REPRESENTANT UNE DISTANCE DE REFERENCE ENTRE LA SURFACE ET L'ELECTRODE. L'INVENTION S'APPLIQUE AU DEPOT ELECTROLYTIQUE DE METAL SUR DES SURFACES INCURVEES.
FR8012123A 1979-06-01 1980-05-30 Procede d'electro-deposition d'un metal sur un substrat Expired FR2457912B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54067483A JPS6056238B2 (ja) 1979-06-01 1979-06-01 電気メツキ方法

Publications (2)

Publication Number Publication Date
FR2457912A1 true FR2457912A1 (fr) 1980-12-26
FR2457912B1 FR2457912B1 (fr) 1985-08-23

Family

ID=13346261

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8012123A Expired FR2457912B1 (fr) 1979-06-01 1980-05-30 Procede d'electro-deposition d'un metal sur un substrat

Country Status (6)

Country Link
US (1) US4269672A (fr)
JP (1) JPS6056238B2 (fr)
DE (1) DE3020824C2 (fr)
FR (1) FR2457912B1 (fr)
GB (1) GB2052562B (fr)
IT (1) IT1127490B (fr)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
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IL64705A0 (en) * 1981-01-13 1982-03-31 Metafuse Ltd Process and apparatus for treating electrically conductive matrices and products produced by the process
US4364802A (en) * 1981-03-05 1982-12-21 Inoue-Japax Research Incorporated Scanning electrode vibration electrodeposition method
FR2501730B1 (fr) * 1981-03-13 1986-01-24 Inoue Japax Res Procede et dispositif d'electro-deposition a electrode de balayage vibrante
US4430167A (en) * 1981-08-07 1984-02-07 Inoue-Japax Research Incorporated Method of and apparatus for electrodepositing a metal on a substrate
GB2104918B (en) * 1981-08-19 1984-12-19 Inoue Japax Res Electrodepositing a metal on a conductive surface
JPS5931882A (ja) * 1982-08-12 1984-02-21 Sonitsukusu:Kk 浴中表面処理方法及びその装置
US20100038121A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US20100044079A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
AU6531600A (en) * 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US6746589B2 (en) * 2000-09-20 2004-06-08 Ebara Corporation Plating method and plating apparatus
US7626179B2 (en) * 2005-09-30 2009-12-01 Virgin Island Microsystems, Inc. Electron beam induced resonance
US7586097B2 (en) 2006-01-05 2009-09-08 Virgin Islands Microsystems, Inc. Switching micro-resonant structures using at least one director
US7791290B2 (en) 2005-09-30 2010-09-07 Virgin Islands Microsystems, Inc. Ultra-small resonating charged particle beam modulator
KR20080084812A (ko) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스
US20070200646A1 (en) * 2006-02-28 2007-08-30 Virgin Island Microsystems, Inc. Method for coupling out of a magnetic device
DE102006010808B4 (de) * 2006-03-07 2009-08-13 BEGO Bremer Goldschlägerei Wilh. Herbst GmbH & Co. KG Vorrichtung, System, Verfahren, Computerprogramm und Datenträger zur elektrophoretischen Abscheidung mit einer beweglichen Elektrode
US7876793B2 (en) * 2006-04-26 2011-01-25 Virgin Islands Microsystems, Inc. Micro free electron laser (FEL)
US8188431B2 (en) 2006-05-05 2012-05-29 Jonathan Gorrell Integration of vacuum microelectronic device with integrated circuit
US20070258720A1 (en) * 2006-05-05 2007-11-08 Virgin Islands Microsystems, Inc. Inter-chip optical communication
US7732786B2 (en) 2006-05-05 2010-06-08 Virgin Islands Microsystems, Inc. Coupling energy in a plasmon wave to an electron beam
US20070257273A1 (en) * 2006-05-05 2007-11-08 Virgin Island Microsystems, Inc. Novel optical cover for optical chip
US7728397B2 (en) * 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Coupled nano-resonating energy emitting structures
US7986113B2 (en) 2006-05-05 2011-07-26 Virgin Islands Microsystems, Inc. Selectable frequency light emitter
US7728702B2 (en) 2006-05-05 2010-06-01 Virgin Islands Microsystems, Inc. Shielding of integrated circuit package with high-permeability magnetic material
WO2008036423A2 (fr) 2006-09-24 2008-03-27 Shocking Technologies, Inc. Matériau diélectrique commutable par application de tension à réponse graduée en tension, et son procédé de fabrication
US7990336B2 (en) 2007-06-19 2011-08-02 Virgin Islands Microsystems, Inc. Microwave coupled excitation of solid state resonant arrays
ES2342518B1 (es) * 2007-10-27 2011-01-17 Universidad De Las Palmas De Gran Canaria Sistema robotico de orientacion y soporte catodico en maquina de electroconformado.
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
CN102550132A (zh) 2009-03-26 2012-07-04 肖克科技有限公司 具有电压可切换电介质材料的元件
US20110198544A1 (en) * 2010-02-18 2011-08-18 Lex Kosowsky EMI Voltage Switchable Dielectric Materials Having Nanophase Materials
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
CN110273167A (zh) 2013-03-15 2019-09-24 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
CA2905575C (fr) 2013-03-15 2022-07-12 Modumetal, Inc. Procede et appareil d'application en continu de revetements metalliques nanostratifies
BR112017005464A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc método e aparelho para aplicar continuamente revestimentos de metal nanolaminado
AR102068A1 (es) 2014-09-18 2017-02-01 Modumetal Inc Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva
CN109963966B (zh) 2016-09-14 2022-10-11 莫杜美拓有限公司 用于可靠、高通量、复杂电场生成的系统以及由其生产涂层的方法
WO2018085591A1 (fr) 2016-11-02 2018-05-11 Modumetal, Inc. Structures d'emballage à couches d'interface de haute densité de topologie optimisée
CA3060619A1 (fr) * 2017-04-21 2018-10-25 Modumetal, Inc. Articles tubulaires dotes de revetements deposes par electrodeposition et systemes et procedes de production desdits articles
CN112272717B (zh) 2018-04-27 2024-01-05 莫杜美拓有限公司 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810829A (en) * 1972-06-28 1974-05-14 Nasa Scanning nozzle plating system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB259900A (en) * 1925-10-17 1927-02-03 Siemens Ag Improved method of and means for producing galvanic chromium coatings on hollow bodies, especially on narrow tubes
US1733404A (en) * 1926-03-15 1929-10-29 Frank A Fahrenwald Process and apparatus for electroplating tubes
US2206908A (en) * 1938-11-05 1940-07-09 Raymond L Lunt Method for electroplating molds for rubber articles

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810829A (en) * 1972-06-28 1974-05-14 Nasa Scanning nozzle plating system

Also Published As

Publication number Publication date
GB2052562A (en) 1981-01-28
IT8048862A0 (it) 1980-06-02
DE3020824A1 (de) 1980-12-11
DE3020824C2 (de) 1984-11-29
GB2052562B (en) 1983-01-06
FR2457912B1 (fr) 1985-08-23
JPS6056238B2 (ja) 1985-12-09
IT1127490B (it) 1986-05-21
JPS55161092A (en) 1980-12-15
US4269672A (en) 1981-05-26

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