FR2457058A1 - Appareil et procede pour mettre en place des composants sur un circuit electronique - Google Patents

Appareil et procede pour mettre en place des composants sur un circuit electronique

Info

Publication number
FR2457058A1
FR2457058A1 FR8010634A FR8010634A FR2457058A1 FR 2457058 A1 FR2457058 A1 FR 2457058A1 FR 8010634 A FR8010634 A FR 8010634A FR 8010634 A FR8010634 A FR 8010634A FR 2457058 A1 FR2457058 A1 FR 2457058A1
Authority
FR
France
Prior art keywords
components
electronic circuit
well
placed under
reception means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8010634A
Other languages
English (en)
Other versions
FR2457058B1 (fr
Inventor
Iwao Ichijawa
Kenichiro Kaimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of FR2457058A1 publication Critical patent/FR2457058A1/fr
Application granted granted Critical
Publication of FR2457058B1 publication Critical patent/FR2457058B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Chutes (AREA)

Abstract

A.APPAREIL ET PROCEDE POUR METTRE EN PLACE DES COMPOSANTS SUR UN CIRCUIT ELECTRONIQUE. B.APPAREIL COMPORTANT DES TREMIES CONTENANT LES COMPOSANTS A DISTRIBUER, CES TREMIES ALIMENTANT PAR DES TUBES UN MOYEN DE RECEPTION 3 COMPORTANT DES ORGANES DE GUIDAGE 15, EN FORME DE BOTTES, QUI PEUVENT PIVOTER LATERALEMENT POUR ORIENTER CORRECTEMENT LES COMPOSANTS A DISTRIBUER, SUIVANT DEUX DIRECTIONS PERPENDICULAIRES X, Y AINSI QU'UN OBTURATEUR MOBILE 25 PLACE SOUS LE MOYEN DE RECEPTION 3, AINSI QU'UN GABARIT 5 PLACE SOUS L'OBTURATEUR 25 ET COMPORTANT DES LOGEMENTS DE PROFONDEUR APPROPRIEE POUR QU'AU NIVEAU SUPERIEUR DES COMPOSANTS 40 QU'IL RECOIT CEUX-CI SOIENT A FLEUR POUR PERMETTRE LA MISE EN PLACE DE LA PLAQUE DU CIRCUIT IMPRIME ET LE COLLAGE DES COMPOSANTS.
FR8010634A 1979-05-12 1980-05-12 Appareil et procede pour mettre en place des composants sur un circuit electronique Granted FR2457058A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5820279A JPS55150241A (en) 1979-05-12 1979-05-12 Apparatus for disposing chiplike part

Publications (2)

Publication Number Publication Date
FR2457058A1 true FR2457058A1 (fr) 1980-12-12
FR2457058B1 FR2457058B1 (fr) 1985-01-11

Family

ID=13077436

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8010634A Granted FR2457058A1 (fr) 1979-05-12 1980-05-12 Appareil et procede pour mettre en place des composants sur un circuit electronique

Country Status (6)

Country Link
JP (1) JPS55150241A (fr)
CA (1) CA1137652A (fr)
DE (1) DE3017677A1 (fr)
FR (1) FR2457058A1 (fr)
GB (1) GB2051019B (fr)
NL (1) NL8002730A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844794A (ja) * 1981-09-10 1983-03-15 ソニー株式会社 回路基板に対するチツプ状部品のマウント方法
JP4855238B2 (ja) * 2006-02-14 2012-01-18 山田電機製造株式会社 アキュムレータ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1064127B (de) * 1956-02-04 1959-08-27 Blaupunkt Werke Gmbh Verfahren zur Bestueckung von sogenannten gedruckten Schaltungen mit Schaltungselementen
FR1440431A (fr) * 1964-07-16 1966-05-27 Philips Nv Dispositif pour enficher des pièces détachées électriques dans un panneau de montage
US3963456A (en) * 1973-10-15 1976-06-15 Sony Corporation Automatic assembly apparatus for inserting electronic connecting pins to and/or for mounting electronic parts on printed circuit boards

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649000B2 (fr) * 1974-07-20 1981-11-19

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1064127B (de) * 1956-02-04 1959-08-27 Blaupunkt Werke Gmbh Verfahren zur Bestueckung von sogenannten gedruckten Schaltungen mit Schaltungselementen
FR1440431A (fr) * 1964-07-16 1966-05-27 Philips Nv Dispositif pour enficher des pièces détachées électriques dans un panneau de montage
US3963456A (en) * 1973-10-15 1976-06-15 Sony Corporation Automatic assembly apparatus for inserting electronic connecting pins to and/or for mounting electronic parts on printed circuit boards

Also Published As

Publication number Publication date
GB2051019A (en) 1981-01-14
JPS6316920B2 (fr) 1988-04-11
FR2457058B1 (fr) 1985-01-11
NL8002730A (nl) 1980-11-14
JPS55150241A (en) 1980-11-22
DE3017677A1 (de) 1980-11-13
GB2051019B (en) 1982-12-22
CA1137652A (fr) 1982-12-14

Similar Documents

Publication Publication Date Title
DE2861528D1 (en) Method for making self-aligned integrated semiconductor devices
DE3484954D1 (de) Vorrichtung zum pressformen.
DE3480813D1 (de) Vorrichtung zum bilden von saetzen.
DE3578663D1 (de) Vorrichtung zum herstellen von in mehreren richtungen gebogenen gegenstaenden.
JPS56153347A (en) Device and method for matching accurately base material to center line
NZ185935A (en) Irrigation apparatus water supplied by capilliary action from container placed in ground
JPS51118641A (en) Fertilization device for soil by feeding water
FR2460152B1 (fr) Procede et dispositif d'elimination de la mousse a la surface d'un liquide, en particulier sur un produit de remplissage liquide, par exemple, le lait
FR2457058A1 (fr) Appareil et procede pour mettre en place des composants sur un circuit electronique
DE3762714D1 (de) Vorrichtung zum pressschweissen paketierter metallfolien.
FR2513178B1 (fr) Procede et dispositif pour le placage de pieces moulees
ZA829253B (en) An apparatus for improving the gravity drainage in screen belt presses
AT387923B (de) Vorrichtung zum verdichten von koernigen formstoffen
GB2102262B (en) An apparatus for planting seeds in drills at predetermined intervals
DE3670738D1 (de) Vorrichtung zur justierung eines netzwerkes in einem integrierten halbleiterkreis.
ATE11231T1 (de) Vorrichtung zum herstellen moussierender getraenke.
DE3381232D1 (de) Vorrichtung zum herstellen und abgeben von ungefuellten schlauchhuellen an einem sammelplatz.
ATA259782A (de) Vorrichtung zur anaeroben abwasserreinigung
FR2438898A1 (fr) Dispositif pour irradier des animaux d'essai
JPS5360572A (en) Ultrasonic wire bonding device
JPS5252490A (en) Welding method and apparatus for lamp lead wire
JPS5287982A (en) Resin molding method of semiconductor elements
JPS5729203A (en) Planting device in transplanter
JPS57208906A (en) Transplanting hole forming apparatus in transplanter
JPS57170107A (en) Press apparatus in seedling transplanting machine

Legal Events

Date Code Title Description
ST Notification of lapse