GB2051019A - Placing circuit elements on circuit boards - Google Patents
Placing circuit elements on circuit boards Download PDFInfo
- Publication number
- GB2051019A GB2051019A GB8015463A GB8015463A GB2051019A GB 2051019 A GB2051019 A GB 2051019A GB 8015463 A GB8015463 A GB 8015463A GB 8015463 A GB8015463 A GB 8015463A GB 2051019 A GB2051019 A GB 2051019A
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit elements
- shutter
- storage means
- plate
- template
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Chutes (AREA)
Abstract
In apparatus for placing chip type circuit elements 40 on a printed circuit board the elements 40 are supplied from hoppers and are laterally turned for placing the elements 40 on a template 5. The apparatus includes a storage plate 3 for temporarily storing the elements 40, a movable shutter 25 placed under the storage plate 3 so that the elements 40 in the storage plate 3 can be laterally turned, and the template 5 placed under the shutter 25 to receive the elements 40 dropped from the storage plate 3 when the shutter 25 is removed. A method of bonding the elements 40 placed on the template 5 onto the circuit board 43 is also disclosed. <IMAGE>
Description
SPECIFICATION
Placing circuit elements on circuit boards
This invention relates to placing circuit elements on circuit boards.
Chip type circuit elements such as resistors, capacitors and diodes have becomewell known and comprise a bare bulk material provided with electrodes. They are often used for hybrid integrated circuits and conventionally they have been mounted one by one on a printed circuit board. To reduce the cost of this operation, attempts have been made to array the circuit elements at predetermined positions by conveying them through cylindrical pipes under gravity or by air pressure. When cylindrical lead less or chip type elements are conveyed through cylindrical pipes, however, they are supplied in a vertically oriented attitude and need to be turned sideways by some means. Moreover, unless they are turned sideways in the same direction, the polar elements such as diodes will not be properly arrayed.
According to the present invention there is provided an apparatus for placing chip type circuit elements on a circuit board, the apparatus comprising: hoppers for storing a plurality of cylindrical chip type circuit elements; a plurality of storage means for temporarily accommodating circuit elements sent from said hoppers; a movable shutter placed under said storage means to receive said circuit elements accommodated in each storage means; and a template which is placed under said shutter and which has a plurality of receiving portions corresponding in numbertothe number of said storage means; whereby when said shutter is moved by a predetermined distance, said circuit elements are laterally turned in said plurality of storage means, and when said shutter means is removed from said storage means, said circuit elements are allowed to fall onto said receiving portions of said template.
According to the present invention there is also provided a method of bonding chip type circuit elements onto a printed circuit board, the method comprising: feeding a plurality of cylindrical chip type circuit elements to a plurality of storage means; temporarily storing each of said chip type circuit elements in a respective said storage means; laterally turning said chip type circuit elements in said storage means by shifting a shutter which is placed under said storage means; dropping said chip type circuit elements onto a template provided under said shutter by removing said shutter; and placing a printed circuit board to which adhesive resin has been applied on the chip type circuit elements which are positioned on said template in such a manner that said adhesive resin contacts said chip type circuit elements.
The invention will now be described by way of example with reference to the accompanying drawings, in which:
Figure 1 is a front view schematically illustrating an embodiment of the invention in an apparatus for placing chip type circuit elements when manufacturing hybrid integrated circuits;
Figure 2 is a cross-sectional view illustrating, on an enlarged scale, portions of the embodiment;
Figure 3 is a perspective view of a guide for laterally turning the circuit elements;
Figure 4 is a cross-sectional view of a temporary storage plate when Figure 2 is viewed from the direction ofthe line IV-IV;
Figure 5 is a cross-sectional view like that of Figure 2, which illustrates the operation for laterally turning the circuit elements;
Figure 6 is a front view illustrating a lower portion of the apparatus;
Figure 7 is a side view thereof;;
Figure 8 is a cross-sectional view along the line Vlil-Vlli of Figure 6;
Figure 9 is a perspective view illustrating the supporting of a shutter;
Figure 10 is a cross-sectional view of a template;
Figure 11 is a plan view illustrating a portion thereof;
Figure 12 is a cross-sectional view of the template on which is placed a printed circuit board;
Figure 13 is a cross-sectional view illustrating a modified template; and
Figure 14 is a cross-sectional view illustrating another modified template.
The embodiment to be described is applied to an apparatus for arraying the circuit elements when producing hybrid integrated circuits. Small chip type circuit elements are supplied from hoppers and are guided to predetermined positions on a template via arraying means. Also, adhesive resin is printed beforehand on predetermined positions on a printed circuit board. The circuit board is then placed on the template holding the circuit elements, so that the chip type circuit elements are transferred to the side of the circuit board carrying the adhesive resin.
Then, the adhesive resin is hardened by light and heat temporarily to secure the circuit elements. Caplike lead portions or electrodes at both ends of the chip type circuit elements are then electrically connected to electrically conductive patterns of the circuit board by solder dipping, thereby to form a required circuit.
Figure 1 shows an apparatus in which chip type circuit elements 40 which are selected and extracted from hoppers H by extraction devices E and which are allowed to fall through pipes 1, are guided onto a temporary storage plate 3 via a magazine 2.
Although Figure 1 shows only one hopper H, each of the pipes 1 is connected to a hopper H. The circuit elements 40 guided onto the storage plate 3 are turned sideways by a shutter that will be mentioned later, and are received into each of circuit element accommodating recesses of a template 5 when the shutter is opened. A printed circuit board is then placed on the template 5, the circuit board carrying an adhesive resin as mentioned above, and are transferred to the circuit board.
The magazine 2 comprises an upper plate 6, a lower plate 7, and pipes 8 which communicate the upper plate 6 with the lower plate 7.
The upper plate 6 of the magazine 2 is so disposed that a connection plate 9 is placed thereon.
Moreover, circuit element-passing apertures formed in the connection plate 9 and communicating with the pipes 1 match with the circuit element-passing apertures formed in the upper plate 6, whereby circuit elements 40 which have fallen while being guided by the pipes 1 are introduced into the pipes 8 of the magazine 2 passing through the apertures formed in the connection plate 9 and through the apertures formed in the upper plate 6 of the magazine 2. The lower ends of the pipes 8 of the magazines 2 are connected to the lower plate 7 through connection pipes 10, and the circuit elements 40 which have fallen through the pipes 8 are guided into the storage plate 3 via the connection pipes 10.
The storage plate 3 is supported by a frame 11 which is so supported as to move in the right and left directions in Figure 1 by two rods 12 attached to the back thereof. Therefore, the storage plate 3 and the lower plate 7 move in the right and left directions in
Figure 1 together with the frame 11.
The pair of upper and lower plates 6 and 7 forming the magazine 2 are coupled together by frames 13 as indicated by dot-dash lines in Figure 1. By connecting the upper plate 6 and the lower plate 7 by the frames 13, the magazine 2 can be constructed as a unitary structure. When the upper plate 6 is disconnected from the connection plate 9, the lower plate 7 is disconnected from the storage plate 3, and when the magazine 2 is then moved towards the left in
Figure 1 by moving the frame 11, the whole assem
bly of the magazine 2 can be removed from the production system. In using embodiments of the invention, predetermined magazines 2 are prepared depending upon the circuit boards to be manufactured, and the magazines 2 are correspondingly replaced depending on the circuit board to be manufactured.Accordingly, the pipes 8 need not be connected again when the circuit boards are to be changed.
The storage plate 3 disposed beneath the lower plate 7 of the magazine 2 has a boot-like guide 15 for laterally turning the circuit elements as shown in
Figures 2 and 3. The guide 15 is cylindrically formed at its upper portion as shown in Figure 3, and its lower end is extended like a boot. A projecting portion 14 is formed at the lower end and extends in a direction at right angles to the length of the cylindrical portion. Referring to Figure 2, the projecting portion 14 of one guide 15 is shown, but the projecting portion 14 of another guide 15 is not shown because it is oriented in a direction perpendicular to the surface of the paper. This can be seen from Figure 4.
Thus, the projecting portions 14 of the guides 15 extend in different directions independently of each other. The upper and lower ends of the guide 15 are open. The upper end of the guide 15 is supported by a holder plate 16 which forms the storage plate 3.
Namely, circuit element-passing apertures 17 are formed in the holder plate 16 to fit to the upper ends of the guides 15, as well as to fit to circuit element
passing apertures 18 formed in the lower plate 7.
The connection tubes 10 are fitted to the circuit element-passing apertures 18. Moreover, the lower end of the guide 15 is held by a fastening plate 19. As shown in Figure 4, rectangular apertures 20 of a shape nearly the same to the lower end of the guides 15 are formed in the fastening plate 19. Ridged fastening portions 21 are formed at the front and rear edges of the apertures 20. Owing to the fastening portions 21, the guides 15 are detachably fastened to the fastening plate 19. The lower surface of the fastening plate 19 is placed on a bottom plate 22 ofthe storage plate 3. Apertures 23 of nearly the same size as the rectangular apertures 20 are formed in the bottom plate 22 and are matched with the apertures 20.The apertures 20 and 23 formed in the fastening plate 19 and in the bottom plate 22 are oriented in eitherthe lengthwise direction or in the width direction of the storage plate 3. Moreover, a spacer 24 is disposed between the holder plate 16 and the fastening plate 19 ofthe storage plate 3.
A shutter 25 is movably disposed beneath the storage plate 3 will be described below with reference to Figures 6 to 9. The shutter 25 comprises a stainless steel plate of thickness 0.1 mm to 0.15 mm and is supported by a frame 26 so constructed asto move in the lengthwise direction as well as in the width direction of the storage plate 3. The frame 26 is slidably supported by a pair of rods 27 and is allowed to move in the right and left directions in
Figure 6. The ends of the rods 27 are fastened to a pair of rod support members 28. The rod support members 28 are slidably supported by rods 29, and are allowed to move in the right and left directions in
Figure 7.Thus, the shutter 25 is capable of moving in the lengthwise direction and in the widthwise direction of the storage plate 3 due to the rods 27 and rods 29, which extend in directions at right angles to each other.
The shutter 25 is supported by the frame 26 in a stretched manner, being pulled with a predetermined tensile force. Referring to Figures 8 and 9, the edges of the shutter 25 in the width direction are fastened by clamp holders 30 which comprise a pair of upper and lower narrow plates 31 and 32. A groove 33 of semicircular cross-section is formed in the lower surface of the upper plate 31, and a ridge 34 of semicircular cross-section is formed on the upper surface of the lower plate 32. The plates 31 and 32 are fastened together by clamp bolts 35 with an edge of the shutter 25 sandwiched between the groove 33 and the ridge 34.
Moreover, the clamp holders 30 holding the shutter 25 are each attached to a respective tension holder 37 by tension-adjusting bolts 36. The tensionadjusting bolts 36 and the clamp bolts 35 are arrayed alternately. The tension holder 37 is fastened to the outer side of the opposing sides of the frame 26 which is of U-shape, and a projecting piece 38 is integrally formed on the tension holder 37 to extend in the lengthwise direction thereof. The top edge of the projecting piece 38 has a curved shape in crosssection so that it will not scar the shutter 25 made of stainless steel. Moreover, the top of the projecting piece 38 protrudes slightly above the upper surface of the frame 26.Accordingly, when the clamp holder 30 is fastened to the tension holder 37 by the bolts 36, increased tensile force is exerted on the shutter 25, which is in contact with the projecting piece 38 of the tension holder 37 and the shutter 25 is stretched across the frame 26 under a strong tensile force.
Therefore, sufficient flatness is obtained even although the plate forming the shutter 25 is thin, and slack of the shutter 25 is effectively eliminated. Also, due to high degree of flatness, the shutter 25 can be brought very close to the storage plate 3 while reducing the clearance between the shutter 25 and the template 5.
The template 5 disposed beneath the shutter 25 is described below. As shown in Figure 10, the template 5 comprises two plates 41 and 42 which are laminated together. Recesses 39 are formed in the template 5 to accommodate chip type circuit elements 40. Each circuit element 40 has a pair of electrodes 40a and 40b, and is formed nearly in a cylindrical shape. Figure 10 illustrates the template 5 for accommodating two kinds of chip circuit element 40 having dissimilar diameters; the recesses 39 for accommodating circuit elements 40 of a small diameter consist of apertures formed in the upper plate 41 only. The recesses 39 for accommodating circuit elements 40 having a large diameter consist of apertures formed in the upper plate 41 and recesses formed in the lower plate 42.Thus, the depth of the recesses 39 is varied depending upon the sizes of the circuit elements 40 so that, when a printed circuit board 43 with an adhesive agent 45 is placed on the template 5, the individual circuit elements 40 contact the circuit board 43 with nearly the same contact pressure irrespective of the size of the circuit elements 40. In other words, the circuit elements 40 accommodated in the recesses 39 of the template 5 project by nearly equal heights irrespective of the diameter.
As illustrated in Figures 11 and 12, notches 44 are formed in each recesses 39 of the template Son both sides in the direction of its width in an opposing manner. When the circuit board 43 with the adhesive agent 45 is placed on the template 5, the notches 44 act so that the adhesive agent 45 will not adhere onto the template 5. The circuit elements 40 have cylindrical shapes and cap-like connection terminals or electrodes at both ends. Therefore, a central portion on the lengthwise direction of each circuit element 40, is adhered to the adhesive agent 45 on the circuit board 43 and the circuit elements 40 are transferred from the template 5 to the circuit board 43.
Hence, the notches 44 are formed at positions corresponding to the bodies of the chip type circuit elements 40.
It can be seen in Figure 10 that the recesses 39 for accommodating large circuit elements 40 are constituted by apertures formed in the upper plate 41 and recesses portions formed in the lower plate 42, so that the height of large circuit elements 40 is adjusted relative to that of small circuit elements 40.
As seen in Figure 13, the template 5 may be composed of many, for example, five thin plates 46: In this case, the number of plates 46 providing apertures is changed depending upon the size of the circuit elements 40, thereby to form recesses 39 of a depth corresponding to the diameters of the circuit elements 40. By emplying such a template 5, the heights of the circuit elements 40 can be adjusted to be nearly level irrespective of the size of the circuit elements 40, as shown in Figure 13. Moreover, as shown in Figure 14, the width of the recesses 39 formed in the template 5 may be varied so that the heights of the circuit elements 40 accommodated in the recesses 39 are adjusted to be nearly level. In this case, the circuit elements 40 do not come into complete contact with the bottom of the recesses 39 but are floating.To form recesses 39 in the template 5, it is necessary to form apertures or recessed portions in the plates which form the template 5. The apertures or recessed portions should preferably be formed by chemical etching, as this helps maintain high precision without developing burrs, and further makes it possible to form many apertures or recessed portions in one operation.
As shown in Figures 1, 6,7 and 8, the template 5 is placed in position on a holder plate 47 which is so constructed as to descend with the template 5 placed thereon when the circuit elements 40 are properly accommodated in the template 5. Accordingly, the template 5 is separated from the storage plate 3 and the shutter 25 and is lowered to a position where the next operation is effected, that is, where the circuit board 43 is placed thereon.
The operation of the apparatus will now be described.
Referring to Figure 1, the chip type circuit elements 40 supplied from the hoppers H reach the magazine 2 through the pipes 1, falling freely and being guided along the pipes 8 of the magazine 2, pass through the connection pipes 10 to which are connected the pipes 8, and reach the storage plate 3 which is illustrated in Figure 2. The circuit elements 40 are then guided to the guides 15 for laterallyturn- ing the circuit elements 40, after they have passed through the apertures 17 formed in the holder plate 16 of the storage plate 3. Up to this stage, the circuit elements 40 are allowed to fall freely. The circuit elements 40 move in an axial direction. Accordingly, the circuit elements 40 introduced into the guides 15 maintain a vertical attitude as shown in Figure 2.The circuit elements 40 which are in contact with the upper surface of the shutter 25 are temporarily held in the storage plate 3.
in this condition, the shutter 25 is moved so that the circuit elements 40 are turned laterally. The circuit elements 40 are turned laterally when the frame 26 supporting the shutter 25 is moved in the right and left directions in Figure 6, being guided by the rods 27, so that the shutter 25 is reciprocally moved in the direction X in Figure 4. As the shutter 25 moves in the direction X, the circuit elements 40 in the guides 15 of which the projecting portions 14 are oriented in the direction X, are first turned laterally as represented by the guide 15 on the left side of
Figure 2.Thus as the shutter 25 is caused to move leftwards, the circuit element 40 in the guide 15 on the left side of Figure 5 turns laterally because its bottom end is tripped. in this case, the circuit element 40 is allowed to turn so that the lower end enters into the projecting portion 14, but the upper end is not permitted to enter the projecting portion 14 of the guide 15. Therefore, using this apparatus, polar circuit elements 40 such as polar capacitors and diodes can be properly arrayed. The stroke for reciprocally moving the shutter 25 to turn the circuit elements 40 laterally needs be slightly greaterthan the length of the circuit elements 40, and may be a very small stroke relative to the whole apparatus.
When the circuit elements 40 are held in the guides 15 oriented symmetrically to the guide 15 on the left side of Figure 2, that is, when the circuit elements 40 are held in the guides 15 whose projecting portions 14 are oriented towards the right, such circuits elements 40 are turned laterally when the shutter 25 is caused to move towards the right.
Thus the circuit elements 40 in the guide 15 supported in the apertures 20 elongated in the direction
X in Figure 4, are all caused to turn laterally. The shutter 25 is then caused to move reciprocally in the direction Yin Figure 4. The reciprocal movement of the shutter 25 is caused by moving the rod support members 28 in the right and left directions along the rods 29 as shown in Figure 7. Accompanying this movement, the frame 26 moves in the same direction together with the rods 27. Then, as the shutter 25 moves in the direction Yin Figure 4, the circuit elements 40 held in the guides 15 which are supported by the apertures elongated in the direction Y, are all caused to turn laterally. Thus, the circuit elements 40 in the guides oriented in the direction X or
Y are all turned laterally.Moreover, since the shutter 25 is still interposed between the storage plate 3 and the template 5, the circuit elements 40 are guided by their side surfaces by the guides 15 and are supported at their lower surfaces by the shutter 25.
Next, the shutter 25 is moved substantially towards the left or the right in Figure 6 together with the frame 16 along the rods 27 and the shutter 25 is opened. The moving stroke of the shutter 25 in this case is slightly greater than the total length of the storage plate 3, and is sufficient to separate the shutter 25 completely from the lower portion of the storage plate 3. The frame 26 for supporting the shutter 25 has an open side as shown in Figure 9, so that the movement is not interrupted. As the shutter 25 moves, the circuit elements 40 which had been supported by the shutter 25 are allowed to fall onto the recesses 39 in the template 5 which is disposed beneath the storage plate 3.
The shutter 25 is made of a very thin plate as mentioned earlier, and is supported with a high degree of flatness due to the application of a predetermined tensile force. Therefore, the template 5 is disposed very close to the storage plate 3. Accordingly, a portion of a circuit element 40 which protrudes beyond the recesses 39 of the template 5 is guided by an opening in the lower end of the guide 15 which is held by the storage plate 3 or is guided by an edge of an aperture 23 in the bottom plate 22 of the storage plate 3, such that the circuit element 40 is very reliably guided into the recess 39 formed in the template 5. In other words, after the shutter 25 has been opened, the circuit elements 40 are guided by the guides 15 and are accommodated in position in the recesses 39 of the template 5.
After the laterally turned circuit elements 40 have been properly held in the recesses 39, the template 5 is lowered together with the holder plate 47 and sepa rates away from the storage plate 3. Thereafter, as shown in Figure 12, a circuit board 43 with the adhesive resin 45 thereon is placed on the template 5 which is taken out of the apparatus. Here, since the notches 44 have been formed on both sides of the recesses 39 of the template 5, the adhesive agent 45 does not adhere onto the template 5. Moreover, since the circuit board 43 placed on the template 5 is pressed onto the template 5 with a predetermined force, the circuit elements 40 in the recesses 39 of the template 5 are attached to the circuit board 43 by the adhesive agent 45. Thereafter, the combination of the template 5 and the circuit board 43 is turned upside down, so that the circuit board 43 is located on the lower side and the template 5 on the upper side. If the template 5 is then removed, circuit elements 40 are transferred from the template 5 to the circuit board 43. As the adhesive agent 45 has not been hardened, however, the circuit board 43 is then introduced into an optical hardening furnace and a thermal hardening furnace to harden the adhesive agent 45. Therefore, the circuit elements 40 are temporarily fastened to the circuit board 43. Then, the cap-like electrodes.atthe ends of the circuit elements 40 are connected to the electrically conductive patterns of the circuit board 43 by solder dipping, thereby to form a required hybrid integrated circuit.
Claims (14)
1. An apparatus for placing chip type circuit elements on a circuit board, the apparatus comprising: hoppers for storing a plurality of cylindrical chip type circuit elements; a plurality of storage means fortemporarily accommodating circuit elements sent from said hoppers; a movable shutter placed under said storage means to receive said circuit elements accommodated in each storage means; and a template which is placed under said shutter and which has a plurality of receiving portions corresponding in the number of said storage means; whereby when said shutter is moved by a predetermined distance, said circuit elements are laterally turned in said plurality of storage means, and when said shutter means is removed from said storage means, said circuit elements are allowed to fall onto said receiving portions of said template.
2. An apparatus according to claim 1 wherein each said storage means has a cylindrical portion and a projecting portion which extends in a direction at right angles to the length of said cylindrical portion, such that when said shutter is moved by a predetermined distance in the extending direction of said projecting portion, said circuit elements are laterally turned in the direction in which said shutter has moved.
3. An apparatus according to claim 1 wherein said storage means include at least two kinds of guides, the guides of one type having a cylindrical portion and a projecting portion which extends in a first direction at right angles to the length of said cylindrical portion, and the guides of another type having a cylindrical portion and a projecting portion which extends in second direction which is different from said first direction but at right angles to the length of said cylindrical portion, said apparatus further comprising a first guide means which guides said shutter in a first direction and a second guide means which guides said shutter in a second direction, so that when said shutter is moved by predetermined distances in the first and second directions, the circuit elements in said first and second guides are laterally turned in the first and second directions, respectively.
4. An apparatus according to claim 3 wherein said shutter comprises a support member which is movably supported on said first guide means, and a shutter plate mounted on said support member.
5. An apparatus according to claim 3 wherein said shutter has means for adjusting the tensile force exerted on the shutter plate, said means being provided between said shutter plate and said support member.
6. An apparatus according to claim 1 wherein said template comprises at least a first plate and a second plate, and said receiving portions are formed in said first plate.
7. An apparatus according to claim 1 wherein said template comprises at least a first plate and a second plate, and said receiving portions are holes having dissimilar depths corresponding to the sizes of the circuit elements fed from said storage means.
8. An apparatus according to claim 6 or claim 7 wherein said receiving portions have such depths that the top surfaces of the circuit elements fed from said storage means are level.
9. An apparatus according to claim 8 wherein the holes are formed in the first plate and the second plate has recessed portions in positions corresponding to said holes.
10. An apparatus according to claim 1 further comprising means for guiding said storage means in a predetermined direction with a frame, a plurality of pipes connecting said hoppers to said storage means and for conveying said circuit elements from said hoppers, and means for supporting said pipes.
11. An apparatus according to claim 1 further comprising means for supporting said templates, and guide means for separating said support means from said storage means and from said shutter.
12. A method of bonding chip type circuit elements onto a printed circuit board, the method comprising: feeding a plurality of cylindrical chip type circuit elements to a plurality of storage means; temporarily storing each of said chip type circuit elements in a respective said storage means; laterally turning said chip type circuit elements in said storage means by shifting a shutter which is placed under said storage means; dropping said chip type circuit elements onto a template provided under said shutter by removing said shutter; and placing a printed circuit board to which adhesive resin has been applied on the chip type circuit elements which are positioned on said template in such a manner that said adhesive resin contacts said chip type circuit elements.
13. An apparatus for placing chip type circuit elements on a circuit board, the apparatus being substantially as hereinbefore described with refer ence to Figures 1 to 11 and 1 2 or 13 or 14 of the accompanying drawings.
14. A method of bonding chip type circuit elements onto a printed circuit board, the method being substantially as hereinbefore described with refer ence to Fig u res 1 to 11 and 12 or 13 or 14 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5820279A JPS55150241A (en) | 1979-05-12 | 1979-05-12 | Apparatus for disposing chiplike part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2051019A true GB2051019A (en) | 1981-01-14 |
| GB2051019B GB2051019B (en) | 1982-12-22 |
Family
ID=13077436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8015463A Expired GB2051019B (en) | 1979-05-12 | 1980-05-09 | Olacing circuit elements on circuit boards |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS55150241A (en) |
| CA (1) | CA1137652A (en) |
| DE (1) | DE3017677A1 (en) |
| FR (1) | FR2457058A1 (en) |
| GB (1) | GB2051019B (en) |
| NL (1) | NL8002730A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844794A (en) * | 1981-09-10 | 1983-03-15 | ソニー株式会社 | Method of mounting chip part on circuit board |
| JP4855238B2 (en) * | 2006-02-14 | 2012-01-18 | 山田電機製造株式会社 | accumulator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1064574B (en) * | 1956-02-04 | 1959-09-03 | Blaupunkt Werke Gmbh | Circuit element for use in so-called printed circuits |
| FR1440431A (en) * | 1964-07-16 | 1966-05-27 | Philips Nv | Device for inserting electrical spare parts into an assembly panel |
| JPS5537879B2 (en) * | 1973-10-15 | 1980-09-30 | ||
| JPS5649000B2 (en) * | 1974-07-20 | 1981-11-19 |
-
1979
- 1979-05-12 JP JP5820279A patent/JPS55150241A/en active Granted
-
1980
- 1980-04-01 CA CA000348984A patent/CA1137652A/en not_active Expired
- 1980-05-08 DE DE19803017677 patent/DE3017677A1/en not_active Withdrawn
- 1980-05-09 GB GB8015463A patent/GB2051019B/en not_active Expired
- 1980-05-12 NL NL8002730A patent/NL8002730A/en not_active Application Discontinuation
- 1980-05-12 FR FR8010634A patent/FR2457058A1/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3017677A1 (en) | 1980-11-13 |
| CA1137652A (en) | 1982-12-14 |
| JPS55150241A (en) | 1980-11-22 |
| JPS6316920B2 (en) | 1988-04-11 |
| FR2457058A1 (en) | 1980-12-12 |
| FR2457058B1 (en) | 1985-01-11 |
| NL8002730A (en) | 1980-11-14 |
| GB2051019B (en) | 1982-12-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |