JPH07248350A - Inspection device and inspection method for circuit board - Google Patents

Abstract

PURPOSE:To inspect boards different in width dimensions by supporting a large number of conductive pins extending in the vertical direction with an intermediary pin device, making a part or more freely mountable and demountable, and forming a housing space of a carrying mechanism by removing them. CONSTITUTION:In an intermediary pin device 40, a large number of l conductive pins 41 respectively extending in the vertical direction are arranged in lattice point positions corresponding to an undeside electrode 33 on a pitch changing board 31. Horizontal base end side support plate 42 and central support plate 43 to respectively insert and support them are arranged in a lower side base end part and a central part of the respective pins 41, and the pins 41 in an area just under a movable range of a carrying mechanism 10 are inserted and installed in through holes of the support plates 42 and 43, and are made freely mountable and demountable. When a circuit board is inspected, the pins 41 in an area by only a width dimension of one carrying member 11 in the carrying mechanism 10 are removed, and a housing space is formed. Thereby, the device can cope with circuit boards having width dimensions of various sizes.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention conveys a circuit board to be inspected to an inspection area by a conveyance mechanism and clamps both sides of the circuit board by an upper inspection jig and a lower inspection jig. A circuit board inspection apparatus for inspecting the electrically connected state of the circuit board by achieving a state in which the conductive contact portions on both sides of the board are electrically connected to the tester, and a circuit board inspection method by the inspection apparatus. It is about.

[0002]

2. Description of the Related Art Generally, for a printed circuit board on which an integrated circuit or the like is mounted, it is necessary to confirm that the wiring pattern of the circuit board has desired performance before mounting the integrated circuit or the like. For that reason, the electrical characteristics thereof are inspected. As an inspection apparatus for inspecting such a circuit board, there is known an inspection apparatus including a transfer mechanism that transfers a circuit board to be inspected to be inspected to an inspection area.

FIG. 10 is an explanatory view showing the basic construction of an example of a conventional circuit board inspection apparatus. In this circuit board inspection device, the circuit board 1 to be inspected is
In this figure, a transport mechanism 90 for transporting to the inspection area is provided along a transport path extending in the horizontal direction perpendicular to the paper surface. The transport mechanism 90 of this example includes one transport member 91 provided on one side of the transport passage and another transport member 92 provided on the other side of the transport passage.
1 is constituted by one guide rail 93 having an L-shaped cross section that guides one side edge of the circuit board 1 to be inspected, and one conveyor belt 94 that runs with one side edge of the circuit board 1 to be inspected, The other transport member 92 has another L-shaped guide rail 95 for guiding the other side edge of the circuit board 1 to be inspected,
The other side edge of the circuit board 1 to be inspected is placed on the one conveyor belt 94 and the other conveyor belt 96 that travels integrally.

The one carrying member 91 and the other carrying member 92 are provided so as to be movable in a horizontal direction perpendicular to the carrying direction of the circuit board 1 to be inspected and in a direction in which they are in contact with each other. Thus, each of the transport members 91 and 92 can be displaced to a position outside the inspected circuit board 1 in order to put the inspected circuit board 1 in a free state for inspection. It is in a state in which it is possible to move to a traveling position corresponding to the circuit boards to be inspected having different width dimensions.

In the inspection area, the conveyed inspection target circuit board 1 is detached from the transfer mechanism 90 to be in a free state, and the lower inspection jig for further pinching the inspection target circuit board 1 from the vertical direction. 97 and upper inspection jig 9
8 are arranged, and these are connected to an inspection circuit (not shown) of the tester.

In the circuit board inspection apparatus having such a configuration, the circuit board 1 to be inspected to be inspected is conveyed to the inspection area by one conveyance member 91 and the other conveyance member 92 of the conveyance mechanism 90 and stopped. After that, for example, when the lower side inspection jig 97 rises, the circuit board 1 to be inspected is pushed upward and separated from the transfer mechanism 90, while one transfer member 91 and the other transfer member in the transfer mechanism 90 are removed. When 92 is displaced outward in the width direction of the inspected circuit board 1 to the position outside the lower inspection jig 97, the inspected circuit board 1 becomes free, and the lower inspection jig 97 is further raised. By doing so, the circuit board 1 to be inspected is pinched between the lower inspection jig 97 and the upper inspection jig 98, and the conductive contact portions on both sides of the inspected circuit board 1 are the inspection circuits of the tester. Electrically accomplished connected state, the tester in this state, the circuit board 1 to be inspected
Inspection is performed.

In the above, if the one transport member 91 and the other transport member 92 are not displaced, they become obstacles and are inspected by the lower side inspection jig 97 and the upper side inspection jig 98. The circuit board 1 cannot be pinched.

According to such a circuit board inspection apparatus,
Since the circuit board 1 to be inspected can be quickly placed in the inspection area by the transport mechanism 90, the time required for setting the circuit board 1 to be inspected for inspection is short, and a large number of circuit boards to be inspected can be obtained. Can be performed with high time efficiency.

In practice, therefore, the width dimension of the circuit board to be inspected to be inspected is not constant, so that the lower side inspection jig 97 and the upper side inspection jig 98 have the maximum width dimension. It is necessary to cover an inspection area having a width corresponding to the inspection circuit board.

[0010]

However, when inspecting a circuit board to be inspected having a width dimension smaller than the widths of the inspection regions of the lower side inspection jig 97 and the upper side inspection jig 98, one of Since it is necessary to displace the conveying member 91 and the other conveying member 92 to both outsides of the lower side inspection jig 97 and the upper side inspection jig 98, respectively, the displacement distance between them becomes large. It takes a long time to complete the displacement of the transport member 91 and the other transport member 92, which causes a problem of low time efficiency.

Further, in the conventional inspection apparatus, since the lower inspection jig 97 and the upper inspection jig 98 are constructed exclusively for the specific circuit board 1 to be inspected, the wiring patterns are different. In order to inspect the circuit board to be inspected, there is a problem that it is necessary to change the entire inspection jig corresponding to the circuit board to be inspected.

The present invention has been made based on the above circumstances. A first object of the present invention is to perform a high inspection time for each circuit board having different width dimensions. It is an object of the present invention to provide a circuit board inspection device that can be achieved with high efficiency. A second object of the present invention is to provide a circuit board inspecting apparatus which can commonly use a main part of an inspection jig even for different types of circuit boards. A third object of the present invention is to provide a circuit board inspection apparatus and an inspection method capable of suitably inspecting circuit boards having different width dimensions.

[0013]

A circuit board inspection apparatus of the present invention has a transfer mechanism for transferring a circuit board to be inspected to an inspection area, and an upper side inspection jig and a lower side inspection jig are provided in the inspection area. A device for inspecting a circuit board by pinching both sides of the circuit board with a tool, wherein the lower side inspection jig includes a lower board side connector that is in contact with the lower surface of the circuit board and an intermediary pin device. A tester side connector for electrically connecting the lower board side connector to a tester, wherein the lower board side connector is provided so as to be separable from the intermediate pin device, and the intermediate pin device is , Has a large number of conductive pins supported so as to extend in the vertical direction, at least a part of the conductive pins is detachably provided, and at least a part of the removable conductive pins is removed. By being removed, characterized in that the accommodating space of the transport mechanism is formed in the intermediary pin system.

In the circuit board inspection apparatus of the present invention,
The transfer mechanism is provided so as to be movable in a horizontal direction perpendicular to the transfer direction of the circuit board in the transfer mechanism movable range, and all the conductive pins in a region directly below the transfer mechanism movable range are detachably provided. Is preferred.

A circuit board inspection method according to the present invention is a circuit board inspection method using the circuit board inspection apparatus described above,
It is characterized in that an inspection is executed in a state where a space for accommodating the transport mechanism is formed by removing only a part of the conductive pin in the movable range of the transport mechanism, and the remaining conductive pin remains.

[0016]

According to the above construction, by removing the detachable conductive pin in the intermediary pin device, the accommodating space of the transfer mechanism can be formed in the intermediary pin device. Therefore, the circuits having different width dimensions can be formed. In order to inspect the board, even when the width direction position of the transfer mechanism is changed according to the size of the width dimension, the displacement distance required to separate the transfer mechanism from the circuit board is always small. As a result, in a very short time after the circuit board arrives at the inspection area, the circuit board is clamped by the upper inspection jig and the lower inspection jig, and the inspection ready state is achieved. Therefore, high time efficiency can be obtained in the inspection of the circuit board.

Further, since the lower board side connector is provided so as to be separable from the intermediary pin device, in the lower side inspection jig, when inspecting a circuit board having a different wiring pattern, only the lower board side connector is used. Need only be replaced with one that corresponds to the wiring pattern on the circuit board, so that it is not necessary to replace the intermediary pin device and the lower tester-side connector, which are the main parts of the lower inspection jig, and they can be used in common.

Further, since all the conductive pins in the region directly below the movable range of the transport mechanism of the transport mechanism are detachably provided, the position of the accommodating space can be arbitrarily set in the region directly below the movable range of the transport mechanism. Since it can be selected, it can be suitably applied to circuit boards having various width dimensions.

Further, the circuit board is clamped in a region outside the region in which the accommodating space is formed in the intermediary pin device, with the conductive pin remaining, so that the lower inspection jig and the upper inspection jig. Since the clamping force exerted by and can be that of the pressure distribution averaged over the entire area where the conductive pin exists, the circuit board is clamped by the pressure distribution averaged over it. As a result, the circuit board can be inspected with high reliability.

[0020]

Embodiments of the circuit board inspection apparatus of the present invention will be described below. FIG. 1 is an explanatory sectional view showing a configuration of a main part in an example of a circuit board inspection apparatus according to the present invention. The circuit board inspection apparatus is provided with a transfer mechanism 10 for transferring the circuit board 1 to be inspected to the inspection area along a transfer path extending in the horizontal direction perpendicular to the paper surface of FIG. A lower side inspection jig 20 and an upper side inspection jig 70 that pinch both surfaces of the conveyed circuit board 1 to be inspected in the vertical direction are arranged in the area.

The transport mechanism 10 in the illustrated example comprises one transport member 11 provided on one side of the transport passage and another transport member 12 provided on the other side of the transport passage. Reference numeral 11 denotes one guide rail 13 having an L-shaped cross-section that guides one side edge of the circuit board 1 to be inspected, and one conveyor belt 1 that runs with one side edge of the circuit board 1 to be inspected.
4, the other conveying member 12 mounts the other guide rail 15 having an L-shaped cross section for guiding the other side edge of the circuit board 1 to be inspected, and the other side edge of the circuit board 1 to be inspected. It is configured as one of the conveyor belts 14 and the other conveyor belt 16 that travels integrally.

The position of one conveying member 11 in the width direction of the circuit board 1 to be inspected (hereinafter referred to as "travel position").
Is movable in a direction in which the other transport member 12 is in contact with and separated from the other transport member 12 as a reference. The movable range of the traveling position of the one transport member 11 is such that the distance from the other transport member 12 is the width of the circuit board to be inspected having the smallest width dimension of the circuit boards to be inspected to be inspected. The distance from the closest position having the size corresponding to the dimension to the other transport member 12 corresponds to the width dimension of the circuit board to be inspected having the largest width dimension among the circuit boards to be inspected. The range is up to the most distant position, which is the size, so that the circuit boards 1 having different width dimensions can be dealt with.

Further, each of the one carrying member 11 and the other carrying member 12 has both side edges of the circuit board 1 to be inspected in a horizontal direction perpendicular to the carrying direction of the circuit board 1 to be inspected from the traveling position. It is possible to displace each of them to the outside.

In the inspection area, a lower inspection jig 20 is arranged below the transport passage. In the lower inspection jig 20 in the illustrated example, one outer edge of the lower conveyance jig 1 is the other conveyance member 1 whose traveling position is not moved in the conveyance mechanism 10.
It is provided along the line 2. This lower side inspection jig 20
Is a lower board-side connector 30 having a width equivalent to the width d of the circuit board 1 to be inspected, and a lower tester-side connector 50 connected to a tester inspection circuit (not shown).
And a lower substrate side connector 30 and a lower tester side connector 50, and an intermediate pin device 40 that electrically connects the contacts of the both, and the lower substrate side connector 30 and the intermediate pin device 40 are separated. It is possible.

As shown in FIG. 2, the lower board side connector 30 includes a first anisotropic conductive sheet 35 having elasticity and arranged on the lower surface side of the circuit board 1 to be inspected, and a pitch conversion board 31. The second anisotropic conductive sheet 36 having elasticity arranged on the lower surface side of the pitch conversion board 31 is stacked in this order.

An upper surface electrode 32 is formed on the upper surface of the pitch conversion board 31 facing the inspected circuit board 1 in accordance with a pattern corresponding to the arrangement of the inspected electrodes 2 on the lower surface of the inspected circuit board 1, and pitch conversion is performed. On the lower surface of the opposite side of the board 31, the lower surface electrodes 33 electrically connected to the upper surface electrodes 32 in a corresponding relationship are arranged in a standardized lattice point position, that is, in a so-called universal arrangement state. Has been done.

Each of the first anisotropic conductive sheet 35 and the second anisotropic conductive sheet 36 is formed with a conductive path forming portion having a conductive path only in the thickness direction thereof. Here, as the first anisotropic conductive sheet 35 or the second anisotropic conductive sheet 36, one in which each conductive path forming portion is formed in a projection shape in the thickness direction on at least one surface thereof has high electrical conductivity. It is preferable in that the contact stability is exhibited.

A plurality of positioning pins 37 are provided on the lower board side connector 30 so as to pass through the first anisotropic conductive sheet 35, the pitch conversion board 31 and the second anisotropic conductive sheet 36, respectively. It is slidable.

In this example, the intermediary pin device 40 is
As shown in FIG. 3, a width equivalent to the width d of the circuit board 1 to be inspected is provided on one side (to the left in FIGS. 1 and 3) in which the movable region of one transport member whose traveling position is moved expands. It is arranged in a state in which it spreads out and covers the area of which the total width D is 2d.

In the intermediary pin device 40, as shown in FIG. 4, a large number of conductive pins 4 each extending vertically.
1 are arranged in a lattice point position corresponding to the lower surface electrode 33 of the pitch conversion board 31, and each conductive pin 4 is provided.
A horizontal base end side support plate 42 for inserting and supporting the respective conductive pins is provided at the base end portion on the lower side of 1. Each conductive pin 4
A horizontal central support plate 43 that inserts and supports each conductive pin 41 is provided in the central portion of 1, and at least the conductive pin 41 in the region immediately below the movable range of the transport mechanism among all the conductive pins 41 is It is mounted by inserting it into the through holes of the proximal support plate 42 and the central support plate 43,
It is detachably attached so that it can be removed by pulling it out from the through hole. The other conductive pins 41 may be fixed or may be removable. Further, the dimension of the conductive pin has, for example, an outer diameter of 0.5.
It is about 2.0 mm and its total length is 20 to 100 mm.

The central support plate 43 is connected to the base end side support plate 42 by an appropriate spring mechanism 45. For example, from the raised position located near the center of the conductive pin 41 to the base end side support plate 42. Is provided so as to be able to be pressed against a spring force in a lowered position (shown by a broken line) close to.

Of these many conductive pins 41, a region (hereinafter, referred to as a region facing the lower substrate side connector 30).
It is called an "inspection area." With respect to each of the conductive pins 41 in), the upper end portion thereof is brought into contact with the lower surface of the anisotropic conductive sheet 36 in the lower board-side connector 30.

Further, in the illustrated example, a horizontal tip side support plate 44 having a width equal to the width d of the circuit board 1 to be inspected is provided at the level of the tip portion on the upper side of the conductive pin 41 in the inspection execution area. Is provided so as to insert and support the conductive pin 41. The tip side support plate 44 is provided so as to be separable from other members in the intermediary pin device 40, and the lower board side connector 30 is provided by the positioning pin 37, for example. Is combined with.

The lower tester-side connector 50 is provided with a third anisotropic conductive sheet 61 having elasticity arranged so as to abut on the base end of the conductive pin 41 in the intermediary pin device 40.
An electrode branch distribution plate 55 arranged on the lower surface side of the third anisotropic conductive sheet 61, and an elastic fourth anisotropic conductive plate arranged on the lower surface side of the electrode branched distribution plate 55. And the inspection electrode plate device 51 disposed on the lower surface side of the fourth anisotropic conductive sheet 62, which are twice as wide as the width d of the circuit board 1 to be inspected. It is arranged so as to cover the area of 2d.

As shown in FIG. 5, the lower surface electrodes 3 of the pitch conversion board 31 are provided on the upper surfaces of the electrode branching / distributing plates 55, respectively.
3, the upper surface connecting electrodes 56 are formed in a state of being arranged in a grid pattern corresponding to 3, that is, all the grid point positions, and the upper surface connecting electrodes 56 are formed on the lower surface of the electrode branching / distributing plate 55.
The lower surface connection electrode 57 is formed in the same state as. In the electrode branch distribution plate 55, as will be described later, 2
Corresponding pair of upper connection electrodes 56 in one functional area
Is formed in a multi-layered structure for using as a common electrode, the upper surface connection electrode 56 and the lower surface connection electrode 57 are electrically connected in a specific relationship.

FIG. 6 is an explanatory view showing a connecting electrode element 60 used as the electrode branching / distributing plate 55. The connection electrode element 60 is formed by forming connection electrodes p at standard grid point positions arranged in the vertical and horizontal directions on one surface of a rectangular plate-shaped insulating substrate according to a so-called universal arrangement. The connecting electrode element 60 has two functional areas A and B each having a rectangular shape, the area on one surface of which is divided into two, as shown by the chain line, and each width is d. A and functional area B
In each of the above, the connection electrodes p are arranged vertically and horizontally in the same pattern arrangement.

Now, in each of the functional areas A and B,
In order to specify the connection electrodes p arranged in m rows in the vertical direction and n columns in the horizontal direction at specific positions, the address display of the connection electrodes p in the position of the m-th row and the n-th column is (m, n), and When the functional area is specified, symbols A and B indicating the functional area are added to the head of the address display. For example, the connection electrode at the first row and first column in the functional area A is represented by A (1,1).

The connection electrodes p at corresponding positions in each of the functional areas A and B of the connection electrode element 60 are electrically connected to each other by a connection member. That is, although the connection electrode p having the same address display (m, n) exists in each of the functional regions A and B, the two connection electrodes p having the same address display are electrically connected to each other. . This connection electrode electrically connected to each other is referred to as "common electrode" in this specification, and P
It will be represented by (m, n). Therefore, a certain common electrode P (m, n) is connected to the connection electrodes A (m, n) and B as two branched terminals that are electrically connected.
(M, n). The connection electrode p of the connection electrode element 60 forms the upper surface connection electrode 56 of the electrode branching / distributing plate 55. Further, in the illustrated example, the lower substrate side connector 30 is arranged at a position corresponding to the functional region B of the electrode branching / distributing plate 55.

As shown in FIG. 7, the inspection electrodes 52 are formed on the upper surface of the inspection electrode plate device 51 in a state of being arranged at all the lattice point positions corresponding to the lower surface connection electrodes 57 of the electrode branching distribution plate 55. This inspection electrode 52 is connected to an external lead terminal portion 54 formed at one end of the inspection electrode plate device 51 by a wiring circuit 53, and each terminal of the external lead terminal portion 54 is detachably connected. Connector 6
It is connected via 5 to a tester inspection circuit (not shown).

Each of the third anisotropic conductive sheet 61 and the fourth anisotropic conductive sheet 62 has a conductive path forming portion having conductive paths only in the thickness direction thereof. Similar to the second anisotropic conductive sheet 36, it is preferable that the conductive path forming portion is formed in a projection shape in the thickness direction on at least one surface thereof.

Reference numeral 66 is a pressing plate for pressing the inspection electrode plate device 51 of the lower inspection jig 20 upward to raise it, which is detachably provided to a pressing mechanism (not shown).
Further, it is preferable that the pressing plate 66 is provided so that the reference level in the pressing direction, that is, the reference level at which the pressing operation is not started is adjustable.

In the inspection area, an upper inspection jig 70 is arranged above the transport passage. This upper side inspection jig 70 has a structure substantially corresponding to the lower side inspection jig 20, and has an upper board side connector 71 having a width similar to the width d of the circuit board 1 to be inspected and a tester inspection. An intermediary pin device 8 for electrically connecting the contacts of the upper tester side connector 75 connected to the circuit, the upper board side connector 71 and the upper tester side connector 75 to each other.
It is composed of 0 and.

The upper board side connector 71 is provided with an elastic first anisotropic conductive sheet 72 disposed on the upper surface side of the circuit board 1 to be inspected, a pitch conversion board 74, and an upper surface of the pitch conversion board 74. The second anisotropic conductive sheet 73 disposed on the side is stacked in this order from the bottom. These correspond to the first anisotropic conductive sheet 35, the pitch conversion board 31, and the second anisotropic conductive sheet 36 in the lower board side connector 30, respectively.

The intermediary pin device 80 includes a large number of conductive pins 81 extending in the vertical direction, and a horizontal base provided on the upper base end portion of each conductive pin 81 for inserting and supporting each conductive pin 81. An end side support plate 82, a horizontal central support plate 83 provided in the central portion of each conductive pin 81 and supporting each conductive pin 81, and a lower end portion of each conductive pin 81 are provided. It is configured by a horizontal tip side support plate 84 that inserts and supports each conductive pin 81. They are,
These correspond to the conductive pin 41, the base end side support plate 42, the center support plate 43, and the tip end side support plate 44 in the intermediate pin device 40 of the lower side inspection jig 20, respectively.

As shown in FIG. 8, each conductive pin 81 of the intermediary pin device 80 has a spherical engagement with a diameter larger than the through hole 85 of the central support plate 83 at the upper part of the portion through which the central support plate 83 is inserted. The portion 86 is formed, whereby the conductive pin 81 is formed.
Are held by the central support plate 83 so as not to drop downward. In addition, the tip side support plate 84 is provided for all the conductive pins 81.
Is provided so as to be inserted and supported.

The upper tester-side connector 75 is provided with a third anisotropic conductive sheet 76 having elasticity and arranged at the base end of the conductive pin 81 in the intermediary pin device 80, and the third anisotropic conductive sheet 76. The electrode branching / distributing plate 77 disposed on the upper surface of the electrode, the fourth anisotropic conductive sheet 78 having elasticity disposed on the upper surface of the electrode branching / distributing plate 77, and the fourth anisotropic conductive sheet 78.
The inspection electrode plate device 79 is provided on the upper surface of the anisotropic conductive sheet 78, and the connector 87 is provided at one end of the inspection electrode plate device 79. These correspond to the third anisotropic conductive sheet, the electrode branch distribution plate 55, the fourth anisotropic conductive sheet 62 and the inspection electrode plate device 51 in the lower tester side connector 50, respectively.

The above-mentioned upper inspection jig 70 may be fixed to a fixed base, and like the lower inspection jig 20, the inspection electrodes of the upper inspection jig 70 may be fixed. The plate device 79 may be provided with a pressing plate for pressing the plate device 79 downward to lower the plate device 79 so that the plate device 79 can be lowered.

In the circuit board inspection device having the above-described structure, the intermediate pin device 4 in the lower inspection jig 20 is used.
One of the transport pins 11 is accommodated by removing the conductive pin 41 in a region that is adjacent to the inspection execution region and is larger than the width of the one transport member 11 among the multiple conductive pins of 0. A storage space S is formed.

In the above-described circuit board inspection apparatus, when the circuit board 1 to be inspected is transferred to the inspection area by the transfer mechanism 10, the central support plate 43 of the intermediate pin device 40 is in the lowered position. Then, the inspection electrode plate device of the lower tester-side connector 50 is pressed upward by the pressing plate 66, and the lower-side inspection jig 20 is raised, whereby the circuit board 1 to be inspected is positioned by the positioning pins 37 to the lower-board-side connector 30. Is pushed up in a state of being positioned with respect to one another, and in synchronism with this, both the one transport member 11 and the other transport member 12 of the transport mechanism 10 are displaced from their traveling positions to both sides, and one transport member is moved. 1
The first and the other transport members 12 are located outside the circuit board 1 to be inspected. As a result, the circuit board 1 to be inspected is separated from the transport mechanism 10 and is in a free state in which it can be pinched by the lower side inspection jig 20 and the upper side inspection jig 70. Then, the circuit board 1 to be inspected is pinched between the lower side inspection jig 20 and the upper side inspection jig 70 by further raising the lower side inspection jig 20. At this time, one of the transport members 11 of the transport mechanism 10 is relatively housed in the housing space S of the ascending intermediary pin device 40.

In this way, each of the inspected electrodes on both the lower surface and the upper surface of the inspected circuit board 1 is inspected by the inspected electrode 52 of the inspected electrode plate apparatus 41 and the inspected electrode plate apparatus 78 in the lower tester side connector 50. By being electrically connected to the electrodes, a state of being electrically connected to the test circuit of the tester is achieved, and a desired test is performed in this state.

According to the circuit board inspection apparatus of the above-described embodiment, the removable conductive pin 41 of the intermediate pin apparatus 40 of the lower inspection jig 20 is removed, so that one of the transfer mechanisms 10 of the intermediate pin apparatus 40 is removed. Since the accommodation space S for the transport member 11 can be formed, the transport mechanism 10 according to the size of the width dimension of the circuit board 1 to be inspected has different width dimensions. Even when the traveling position of the one transport member 11 is changed, the displacement distance required to separate the one transport member 11 from the circuit board 1 to be inspected can be always sufficiently small, and as a result, the displacement distance can be reduced. An inspection preparation completion state in which the circuit board 1 to be inspected is pinched by the upper side inspection jig 70 and the lower side inspection jig 20 within an extremely short time after the inspection circuit board 1 reaches the inspection area. It is possible to achieve, high time efficiency in circuit board inspection is obtained.

Further, since the lower board side connector 30 is provided so as to be separable from the intermediary pin device 40, in the lower side inspection jig 20, when inspecting a circuit board to be inspected having a different wiring pattern, Lower board side connector 3
Since only 0 should be replaced with one that corresponds to the wiring pattern of the circuit board to be inspected, it is not necessary to replace the intermediary pin device 40 and the lower tester side connector 50, which are the main parts of the lower side inspection jig 20, and are commonly used. Can be used.

Then, the transport member 1 in the transport mechanism 10
By making all the conductive pins 41 in the region immediately below the movable range of the first transport mechanism detachable, the position of the accommodation space S can be arbitrarily selected in the region directly below the movable range of the transport mechanism, so that various positions can be selected. The circuit board 1 to be inspected having a large width dimension can be suitably dealt with.

Also, the electrode branching / distributing plate 55 of the above-mentioned embodiment.
In the above, the upper surface connecting electrodes 56 are formed in the same arrangement state in the two functional regions, and the upper surface connecting electrodes 56 at corresponding positions in each functional region are electrically connected to each other by the wiring circuit 53. Since it is connected to the lower surface connection electrode 57 in the state of being used as a common electrode, the upper surface connection electrode 56 that is electrically connected to the conductive pin 41 in a certain intermediary pin device 40 exists in each of the functional regions, and accordingly the conductive area Electrical connection between the pin 41 and the inspection electrode 52 of the inspection electrode plate device 51 can be performed with a large degree of freedom. As a result, even if the electrode 2 to be inspected on the circuit board 1 to be inspected is formed in a very high-density state at a specific location, a common electrode of a functional region separated from the location is provided. By utilizing, that is, by using, so to speak, the connection electrodes at positions dispersed by the common electrode, it is possible to easily achieve the required electrical connection and perform a highly reliable test. You can

Further, in the illustrated example, since the pitch conversion boards 31 and 74, which are themselves rigid, and the electrode branching / distributing devices 55 and 77 are provided with elastic anisotropically conductive sheets on both sides, these are used. As a result, the warp and the distortion caused by the deformation are absorbed, and as a result, the pressing force applied to the lower inspection jig 20 and the upper inspection jig 70 by the pressing plate 66 can be relaxed.

In the above, among the conductive pins 41 in the intermediary pin device 40, the conductive pins that are always used for electrical connection in the inspection of the inspected circuit board 1, that is, the inspected circuit board to be inspected The conductive pin in the inspection execution region when inspecting the circuit board to be inspected having the smallest width dimension does not need to be detachable, and may be fixed to the base end side support plate 42, for example.

When inspecting a circuit board using the above-mentioned inspection device, in the intermediary pin device 40, for example, the conductive pin in a region having a size corresponding to the width dimension of the one transport member 11 itself in the transport mechanism 10. 41 is removed to form the accommodating space S, but the conductive pins 41 in the region outside this region are left as they are to form the residual conductive pin group 46, and the inspection is performed in this state. It is preferable to adopt the method.

In this inspection method, the sum of the thickness of the lower board-side connector 30 and the thickness of the upper board-side connector 71 in a state of being pinched on the tip of the conductive pin 41 in the residual conductive pin group 46 is obtained. It is preferable to arrange the spacer 47 having the same thickness.

According to such a circuit board inspection method,
By forming the residual conductive pin group 46 in which the conductive pins 41 remain in the region outside the partial region where the accommodation space S is formed in the intermediary pin device 40, the lower inspection jig 20 and the upper portion The clamping force applied to the circuit board 1 to be inspected by the side inspection jig 70 can be a pressure distribution averaged over the entire area where the conductive pins 41 are present. Are pinched by the averaged pressure distribution over the whole, and as a result, the circuit board 1 to be inspected can be inspected with high reliability.

In the above embodiment, the traveling position of the other conveying member 12 of the conveying mechanism 10 is set as the reference position, one conveying member 11 is movable within the movable range of the conveying mechanism, and the lower side inspection jig 20 is used. One outer edge of each of the upper side inspection jig 70 and the upper side inspection jig 70 is arranged in accordance with the reference position. In the present invention, for example, the central position in the width direction of the conveyance path, that is, the conveyance member 11 and the conveyance member in the conveyance mechanism 10. The center position with respect to 12 is set as a reference position, and both the one conveyance member 11 and the other conveyance member 12 are movable in the movable mechanism movable range in a direction of coming into contact with and separated from the reference position. The center of each of the upper inspection jigs 70 may be arranged according to the reference position.

In such a case, the lower inspection jig 20
Regarding the accommodation space in the intermediary pin device 40, as shown in FIG. 9, the accommodation space S1 of the one transport member 11 is shown.
In addition to the storage space S for storing the other transport member 12,
By forming 2, the one conveying member 11 and the other conveying member 1 when the lower inspection jig 20 is lifted up.
2 are respectively accommodated, so that the displacement distance of each of the one transport member 11 and the other transport member 12 can be shortened.

Further, the accommodation space S1 and the accommodation space S
2 on the outer side of each of the residual conductive pin groups 46a and 46b.
By forming the, the clamping pressure applied to the circuit board 1 to be inspected by the lower inspection jig 20 and the upper inspection jig 70 is averaged over the entire area in which the conductive pin 41 exists. As a result, high reliability can be obtained in the inspection of the circuit board.

In the circuit board inspection apparatus of the present invention,
The transport mechanism is not limited to the transport mechanism shown in the above embodiment, and various types can be used. For example, the carrier mechanism may be a carrier that moves on one of the guide rails and on the other of the guide rails while holding the circuit board 1 to be inspected at both side edges, or may have another configuration. .

[0064]

According to the circuit board inspection apparatus of the present invention,
By removing the detachable conductive pin in the intermediary pin device, a space for accommodating the transfer mechanism can be formed in the intermediary pin device. Therefore, in order to inspect circuit boards of different width dimensions, Even when the position in the width direction of the transfer mechanism is changed according to the size of the width dimension, the displacement distance required for detaching the transfer mechanism from the circuit board can always be reduced, and as a result, the circuit board Within a very short time after arriving at the inspection area,
Since the circuit board can achieve the inspection ready state in which it is clamped by the upper inspection jig and the lower inspection jig,
High time efficiency is obtained in the inspection of the circuit board.

Further, since the lower board side connector is provided so as to be separable from the intermediary pin device, in the lower side inspection jig, when inspecting a circuit board having a different wiring pattern, only the lower board side connector is used. Need only be replaced with one that corresponds to the wiring pattern on the circuit board, so that it is not necessary to replace the intermediary pin device and the lower tester-side connector, which are the main parts of the lower inspection jig, and they can be used in common.

By making all the conductive pins in the region directly below the movable range of the transport mechanism detachable, the position of the accommodating space can be arbitrarily selected in the region immediately below the movable range of the transport mechanism. Therefore, it is possible to cope with circuit boards having various width dimensions.

According to the circuit board inspection method of the present invention, in the circuit board inspection apparatus described above, the circuit is performed in a state where only a part of the conductive pins in the intermediary pin device is removed and the remaining conductive pins remain. By pinching the substrate, the pinching force applied by the lower inspection jig and the upper inspection jig can be made to have a pressure distribution averaged over the entire area where the conductive pin exists. The circuit board is clamped by the pressure distribution averaged over the entire circuit board, and as a result, the circuit board can be inspected with high reliability.

[Brief description of drawings]

FIG. 1 is an explanatory sectional view showing a configuration of a main part in an example of a circuit board inspection apparatus of the present invention.

FIG. 2 is an explanatory cross-sectional view showing the configuration of an example of a lower board side connector.

FIG. 3 is an explanatory diagram showing a positional relationship among a circuit board to be inspected, a lower board side connector, and an intermediate pin device.

FIG. 4 is an explanatory cross-sectional view showing the configuration of an example of an intermediate pin device.

FIG. 5 is an explanatory cross-sectional view showing the configuration of an example of an electrode branch distribution plate.

FIG. 6 is an explanatory diagram of a test electrode element used as an electrode branch distribution plate.

FIG. 7 is an explanatory cross-sectional view showing the configuration of an example of an inspection electrode plate device.

FIG. 8 is an explanatory cross-sectional view showing an example of a conductive pin of the intermediary pin device in the upper inspection jig.

FIG. 9 is an explanatory sectional view showing a configuration of a main part in another example of the circuit board inspection apparatus of the present invention.

FIG. 10 is an explanatory diagram showing a basic configuration of an example of a conventional circuit board inspection device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Inspected circuit board 2 Inspected electrode 10 Transport mechanism 11 One transport member 12 The other transport member 13 One guide rail 14 One transport belt 15 The other guide rail 16 The other guide rail 20 Lower side inspection jig 30 Lower part Board side connector 31 Pitch conversion board 32 Upper surface electrode 33 Lower surface electrode 35 First anisotropic conductive sheet 36 Second anisotropic conductive sheet 37 Positioning pin 40 Mediation pin device 41 Conductive pin 42 Base end side support plate 43 Central support Plate 44 tip side support plate 45 spring mechanism 46, 46a,
46b Residual conductive pin group 47 Spacer 50 Lower tester side connector 51 Test electrode plate device 52 Test electrode 53 Wiring circuit 54 External extraction end 55 Electrode branching distribution plate 56 Top connection electrode 57 Bottom connection electrode 58 Wiring circuit 60 Connection electrode element 61st 3 anisotropic conductive sheet 62 4th anisotropic conductive sheet 65 connector 70 upper side inspection jig 71 upper board side connector 72 first anisotropic conductive sheet 73 second anisotropic conductive sheet 74 pitch conversion Board 75 Upper tester side connector 76 Third anisotropic conductive sheet 77 Fourth anisotropic conductive sheet 78 Inspection electrode plate device 79 Electrode branching distribution plate 80 Intermediary pin device 81 Conductive pin 82 Base end support plate 83 Central support Plate 84 Tip side support plate 85 Through hole 86 Locking part 87 Connector S, S1, S Accommodating space p connecting electrodes

Claims (3)

[Claims] 1. A circuit having a transfer mechanism for transferring a circuit board to be inspected to an inspection area, in which both sides of the circuit board are pressed by an upper inspection jig and a lower inspection jig in the inspection area. A board inspection device, in which the lower side inspection jig electrically connects the lower board side connector, which contacts the lower surface of the circuit board, and this lower board side connector to the tester via the intermediary pin device. The tester side connector of the above, the lower board side connector is provided to be separable from the intermediary pin device, the intermediary pin device includes a large number of conductive pins supported to extend in the vertical direction. In the intermediary pin device, at least a part of the conductive pin is detachably provided, and at least a part of the removable conductive pin is removed. Inspection apparatus for circuit board, characterized in that containment space feed mechanism is formed. 2. The transfer mechanism is provided so as to be movable in a horizontal direction at a right angle to a transfer direction of a circuit board in a movable range of the transfer mechanism, and all conductive pins in a region directly below the movable range of the transfer mechanism are detachable. The circuit board inspection apparatus according to claim 1, wherein the circuit board inspection apparatus is provided in the circuit board. 3. The circuit board inspection method by the circuit board inspection apparatus according to claim 2, wherein only a part of the conductive pin in the movable range of the transfer mechanism is removed, whereby the accommodation space of the transfer mechanism is increased. A method for inspecting a circuit board, comprising: performing an inspection in a state in which the conductive pins that have been formed are left.