FR2446307A1 - Composition de revetement protectrice utilisable dans la fabrication de panneaux de circuits imprimes - Google Patents

Composition de revetement protectrice utilisable dans la fabrication de panneaux de circuits imprimes

Info

Publication number
FR2446307A1
FR2446307A1 FR8000677A FR8000677A FR2446307A1 FR 2446307 A1 FR2446307 A1 FR 2446307A1 FR 8000677 A FR8000677 A FR 8000677A FR 8000677 A FR8000677 A FR 8000677A FR 2446307 A1 FR2446307 A1 FR 2446307A1
Authority
FR
France
Prior art keywords
copper
thermosetting resin
solder
prodn
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8000677A
Other languages
English (en)
Other versions
FR2446307B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2446307A1 publication Critical patent/FR2446307A1/fr
Application granted granted Critical
Publication of FR2446307B1 publication Critical patent/FR2446307B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Composition de revêtement protectrice utilisable dans la fabrication de panneaux de circuits imprimés, composition comprenant une résine ou une composition de résines thermodurcissables et un agent durcisseur en solution dans un solvant, la résine ou la composition de résines étant solide à des températures de 60 degrés C ou moins et ayant un degré de fonctionnalité de 3 ou plus. Cette composition de revêtement est initialement à l'état de solution très visqueuse ou de gel mou, et elle passe directement par durcissement, sans ou pratiquement sans se liquéfier, de cet etat initial à l'état final solide. Utilisation pour la formation de masques pour soudure dans la fabrication de panneaux de circuits imprimés ayant une résolution de 0,25 mm ou moins des lignes et espaces. Les revêtements protecteurs formés résistent bien aux bains de cuivrage électrolytique ainsi qu'aux chocs thermiques d'une opération de soudure, et ils adhèrent bien à des substrats isolants ou métalliques.
FR8000677A 1979-01-12 1980-01-14 Composition de revetement protectrice utilisable dans la fabrication de panneaux de circuits imprimes Granted FR2446307A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US309979A 1979-01-12 1979-01-12
US10334079A 1979-12-13 1979-12-13

Publications (2)

Publication Number Publication Date
FR2446307A1 true FR2446307A1 (fr) 1980-08-08
FR2446307B1 FR2446307B1 (fr) 1983-11-04

Family

ID=26671314

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8000677A Granted FR2446307A1 (fr) 1979-01-12 1980-01-14 Composition de revetement protectrice utilisable dans la fabrication de panneaux de circuits imprimes

Country Status (2)

Country Link
AU (1) AU532004B2 (fr)
FR (1) FR2446307A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU615792B2 (en) * 1988-09-13 1991-10-10 Amp-Akzo Corporation Photoimageable permanent resist

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1483065A (fr) * 1965-05-14 1967-06-02 Dynamit Nobel Ag Procédé de production de corps façonnés et de revêtements par réaction d'époxydes avec des polyamines
GB1098600A (en) * 1965-05-14 1968-01-10 Dynamit Nobel Ag Process for the production of moulded elements or coatings based on amine cured polyepoxides
FR2089863A5 (en) * 1970-04-21 1972-01-07 Rca Corp Chemical treatment of uncured adhesiveimproving bond
US3682785A (en) * 1971-03-30 1972-08-08 Rca Corp Process for forming an isolated circuit pattern on a conductive substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1483065A (fr) * 1965-05-14 1967-06-02 Dynamit Nobel Ag Procédé de production de corps façonnés et de revêtements par réaction d'époxydes avec des polyamines
GB1098600A (en) * 1965-05-14 1968-01-10 Dynamit Nobel Ag Process for the production of moulded elements or coatings based on amine cured polyepoxides
FR2089863A5 (en) * 1970-04-21 1972-01-07 Rca Corp Chemical treatment of uncured adhesiveimproving bond
US3682785A (en) * 1971-03-30 1972-08-08 Rca Corp Process for forming an isolated circuit pattern on a conductive substrate

Also Published As

Publication number Publication date
AU532004B2 (en) 1983-09-15
AU5455680A (en) 1980-07-17
FR2446307B1 (fr) 1983-11-04

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Legal Events

Date Code Title Description
TP Transmission of property
TP Transmission of property
ST Notification of lapse