FR2426743A1 - Procede et dispositif de revetement metallique par depot sous forme de vapeurs - Google Patents
Procede et dispositif de revetement metallique par depot sous forme de vapeursInfo
- Publication number
- FR2426743A1 FR2426743A1 FR7913339A FR7913339A FR2426743A1 FR 2426743 A1 FR2426743 A1 FR 2426743A1 FR 7913339 A FR7913339 A FR 7913339A FR 7913339 A FR7913339 A FR 7913339A FR 2426743 A1 FR2426743 A1 FR 2426743A1
- Authority
- FR
- France
- Prior art keywords
- aluminum
- triisobutylaluminum
- parts
- argon
- vapors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 3
- 239000011248 coating agent Substances 0.000 title abstract 2
- 238000000576 coating method Methods 0.000 title abstract 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract 6
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 abstract 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 4
- 229910052782 aluminium Inorganic materials 0.000 abstract 4
- 229910052786 argon Inorganic materials 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 3
- 238000006243 chemical reaction Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract 2
- 238000000197 pyrolysis Methods 0.000 abstract 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000009827 uniform distribution Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
- C23C16/20—Deposition of aluminium only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB22633/78A GB1594399A (en) | 1978-05-25 | 1978-05-25 | Metal deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2426743A1 true FR2426743A1 (fr) | 1979-12-21 |
| FR2426743B1 FR2426743B1 (US07655688-20100202-C00086.png) | 1983-08-26 |
Family
ID=10182595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7913339A Granted FR2426743A1 (fr) | 1978-05-25 | 1979-05-25 | Procede et dispositif de revetement metallique par depot sous forme de vapeurs |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS54163793A (US07655688-20100202-C00086.png) |
| FR (1) | FR2426743A1 (US07655688-20100202-C00086.png) |
| GB (1) | GB1594399A (US07655688-20100202-C00086.png) |
| IT (1) | IT1192727B (US07655688-20100202-C00086.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5985857A (ja) * | 1982-11-08 | 1984-05-17 | Semiconductor Energy Lab Co Ltd | アルミニユ−ム被膜の作製方法 |
| DE3666230D1 (en) * | 1985-05-03 | 1989-11-16 | American Telephone & Telegraph | Method of making a device comprising a patterned aluminum layer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2921868A (en) * | 1956-06-07 | 1960-01-19 | Union Carbide Corp | Aluminum gas plating of various substrates |
| FR1210117A (fr) * | 1958-09-02 | 1960-03-07 | Ohio Commw Eng Co | Dépôt d'aluminium à partir d'un composé gazeux, en particulier du triisobutyle d'aluminium |
| FR1405106A (fr) * | 1964-08-26 | 1965-07-02 | Union Carbide Corp | Procédé pour déposer des revêtements métallliques dans des trous, des tubes, des fentes, des fissures et autres cavités analogues |
-
1978
- 1978-05-25 GB GB22633/78A patent/GB1594399A/en not_active Expired
-
1979
- 1979-05-17 IT IT22732/79A patent/IT1192727B/it active
- 1979-05-25 FR FR7913339A patent/FR2426743A1/fr active Granted
- 1979-05-25 JP JP6488579A patent/JPS54163793A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2921868A (en) * | 1956-06-07 | 1960-01-19 | Union Carbide Corp | Aluminum gas plating of various substrates |
| FR1210117A (fr) * | 1958-09-02 | 1960-03-07 | Ohio Commw Eng Co | Dépôt d'aluminium à partir d'un composé gazeux, en particulier du triisobutyle d'aluminium |
| FR1405106A (fr) * | 1964-08-26 | 1965-07-02 | Union Carbide Corp | Procédé pour déposer des revêtements métallliques dans des trous, des tubes, des fentes, des fissures et autres cavités analogues |
Non-Patent Citations (1)
| Title |
|---|
| EXBK/68 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS641550B2 (US07655688-20100202-C00086.png) | 1989-01-11 |
| IT1192727B (it) | 1988-05-04 |
| IT7922732A0 (it) | 1979-05-17 |
| FR2426743B1 (US07655688-20100202-C00086.png) | 1983-08-26 |
| GB1594399A (en) | 1981-07-30 |
| JPS54163793A (en) | 1979-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2847320A (en) | Method for gas plating with aluminum organo compounds | |
| FR2426745A1 (fr) | Procede de revetement metallique par depot sous forme de vapeurs, pour la formation de trajets conducteurs sur un corps semi-conducteur | |
| Archer | The plasma-assisted chemical vapour deposition of TiC, TiN and TiCxN1− x | |
| FR2402475A1 (fr) | Dispositif et procede de traitement thermique de materiaux carbones organiques | |
| FR2577944A1 (fr) | Revetements de surface durs de metaux dans des lits fluidises | |
| FR2376821A1 (fr) | Procede de fabrication de silicium tres pur | |
| FR2419335A1 (fr) | Procede de depot d'un revetement sur du verre | |
| DE59304904D1 (de) | Verfahren zum beschichten eines substrats mit einem eine glanzwirkung hervorrufenden material | |
| US4351855A (en) | Noncrucible method of and apparatus for the vapor deposition of material upon a substrate using voltaic arc in vacuum | |
| FR2354390A1 (fr) | Procede non polluant pour traitements de surfaces metalliques | |
| KR101162077B1 (ko) | 액상/기상 증착 공정에 의한 기재(들)의 금속화 | |
| US3202537A (en) | Method of metal plating by fluidized bed | |
| KR920004614A (ko) | 트위스트 드릴 피복용 cvd 다이아몬드 | |
| FR2382491A1 (fr) | Procede d'extinction de coke a sec et dispositif pour sa mise en oeuvre | |
| FR2426743A1 (fr) | Procede et dispositif de revetement metallique par depot sous forme de vapeurs | |
| US3702780A (en) | Process of plating by pyrolytic deposition | |
| US2704728A (en) | Gas plating metal objects with copper acetylacetonate | |
| AU8176882A (en) | Refining of molten aluminium with vapourised organic halogen derivatives in an inert carrier gas | |
| GB1306768A (en) | Apparatus for plating heat-resistant articles | |
| JP3388736B2 (ja) | 複覆工具並びにその製造方法及び装置 | |
| US4438153A (en) | Method of and apparatus for the vapor deposition of material upon a substrate | |
| US3754529A (en) | Apparatus for continuously depositing beryllia through vaporization of a basic formate | |
| US3414428A (en) | Chromizing compositions and methods and continuous production of chromium halides for chromizing | |
| US3447951A (en) | Cyclone separation of particles in vapor coating | |
| US3282243A (en) | Movable means comprising vapor-plating nozzle and exhaust |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |