FR2393640A1 - Element composite fabrique par la technique de la metallurgie des poudres - Google Patents
Element composite fabrique par la technique de la metallurgie des poudresInfo
- Publication number
- FR2393640A1 FR2393640A1 FR787817382A FR7817382A FR2393640A1 FR 2393640 A1 FR2393640 A1 FR 2393640A1 FR 787817382 A FR787817382 A FR 787817382A FR 7817382 A FR7817382 A FR 7817382A FR 2393640 A1 FR2393640 A1 FR 2393640A1
- Authority
- FR
- France
- Prior art keywords
- metal powder
- degrees
- particles
- compressed
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004663 powder metallurgy Methods 0.000 title 1
- 239000000843 powder Substances 0.000 abstract 12
- 239000002184 metal Substances 0.000 abstract 9
- 239000002245 particle Substances 0.000 abstract 5
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/09—Mixtures of metallic powders
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C33/00—Making ferrous alloys
- C22C33/02—Making ferrous alloys by powder metallurgy
- C22C33/0207—Using a mixture of prealloyed powders or a master alloy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/1216—Continuous interengaged phases of plural metals, or oriented fiber containing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
La présente invention se rapporte à un élément comprimé composé de particules de poudres métalliques comprimées, caractérisé en ce qu'il comprend 15 à 85 pour cent en volume de particules comprimées d'une première poudre métallique possèdant un coefficient de dilatation thermique moyen inférieur à environ 12 x 10**-6/ degrés C dans l'intervalle de températures allant de 25 degrés C à 400 degrés C, tandis que le reste est composé de particules comprimées d'une deuxième poudre métallique possèdant une résistivité électrique inférieure à 332 microhms-cm, ces particules comprimées des deux poudres étant mélangées de façon pratiquement homogène dans toute la masse de l'élément, la deuxième poudre métallique possédant un coefficient de dilatation thermique à 400 degrés C supérieur à celui de la première poudre métallique, ladite première poudre métallique possèdant une résistivité électrique supérieure à celle de la deuxième poudre métallique, et le degré d'alliage entre les particules de la première poudre métallique et celles de la deuxième poudre métallique étant suffisamment faible pour qu'à 400 degrés C, ledit article possède un coefficient de dilatation thermique inférieur à celui de la deuxième poudre métallique et une résistivité électrique inférieure à celle de la première poudre métallique.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/805,040 US4158719A (en) | 1977-06-09 | 1977-06-09 | Low expansion low resistivity composite powder metallurgy member and method of making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2393640A1 true FR2393640A1 (fr) | 1979-01-05 |
FR2393640B1 FR2393640B1 (fr) | 1982-08-06 |
Family
ID=25190544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR787817382A Granted FR2393640A1 (fr) | 1977-06-09 | 1978-06-09 | Element composite fabrique par la technique de la metallurgie des poudres |
Country Status (6)
Country | Link |
---|---|
US (1) | US4158719A (fr) |
JP (1) | JPS544210A (fr) |
CA (1) | CA1087423A (fr) |
DE (1) | DE2825262A1 (fr) |
FR (1) | FR2393640A1 (fr) |
GB (1) | GB1588208A (fr) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3065931D1 (en) * | 1980-03-03 | 1984-01-26 | Bbc Brown Boveri & Cie | Process for making a memory alloy |
JPS5921032A (ja) * | 1982-07-26 | 1984-02-02 | Sumitomo Electric Ind Ltd | 半導体装置用基板 |
US4752334A (en) * | 1983-12-13 | 1988-06-21 | Scm Metal Products Inc. | Dispersion strengthened metal composites |
US4799955A (en) * | 1987-10-06 | 1989-01-24 | Elkem Metals Company | Soft composite metal powder and method to produce same |
US4894293A (en) * | 1988-03-10 | 1990-01-16 | Texas Instruments Incorporated | Circuit system, a composite metal material for use therein, and a method for making the material |
US4885214A (en) * | 1988-03-10 | 1989-12-05 | Texas Instruments Incorporated | Composite material and methods for making |
US5015533A (en) * | 1988-03-10 | 1991-05-14 | Texas Instruments Incorporated | Member of a refractory metal material of selected shape and method of making |
US4836979A (en) * | 1988-06-14 | 1989-06-06 | Inco Limited | Manufacture of composite structures |
US4956012A (en) * | 1988-10-03 | 1990-09-11 | Newcomer Products, Inc. | Dispersion alloyed hard metal composites |
US5039335A (en) * | 1988-10-21 | 1991-08-13 | Texas Instruments Incorporated | Composite material for a circuit system and method of making |
US5526867A (en) * | 1988-11-10 | 1996-06-18 | Lanxide Technology Company, Lp | Methods of forming electronic packages |
US4994903A (en) * | 1989-12-18 | 1991-02-19 | Texas Instruments Incorporated | Circuit substrate and circuit using the substrate |
US5049184A (en) * | 1990-12-17 | 1991-09-17 | Carpenter Technology Corporation | Method of making a low thermal expansion, high thermal conductivity, composite powder metallurgy member and a member made thereby |
US5292478A (en) * | 1991-06-24 | 1994-03-08 | Ametek, Specialty Metal Products Division | Copper-molybdenum composite strip |
US5614320A (en) * | 1991-07-17 | 1997-03-25 | Beane; Alan F. | Particles having engineered properties |
US5453293A (en) * | 1991-07-17 | 1995-09-26 | Beane; Alan F. | Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects |
US5156923A (en) * | 1992-01-06 | 1992-10-20 | Texas Instruments Incorporated | Heat-transferring circuit substrate with limited thermal expansion and method for making |
DE4217531C1 (de) * | 1992-05-27 | 1993-12-16 | Wieland Werke Ag | Verfahren zur Herstellung schlickergegossener isotroper Verbundwerkstoffe auf Kupferbasis mit geringem thermischem Ausdehnungskoeffizienten und hoher elektrischer Leitfähigkeit sowie deren Verwendung |
US5310520A (en) * | 1993-01-29 | 1994-05-10 | Texas Instruments Incorporated | Circuit system, a composite material for use therein, and a method of making the material |
US5413751A (en) * | 1993-04-14 | 1995-05-09 | Frank J. Polese | Method for making heat-dissipating elements for micro-electronic devices |
US5654587A (en) * | 1993-07-15 | 1997-08-05 | Lsi Logic Corporation | Stackable heatsink structure for semiconductor devices |
US5423899A (en) * | 1993-07-16 | 1995-06-13 | Newcomer Products, Inc. | Dispersion alloyed hard metal composites and method for producing same |
US5514327A (en) * | 1993-12-14 | 1996-05-07 | Lsi Logic Corporation | Powder metal heat sink for integrated circuit devices |
US5693981A (en) * | 1993-12-14 | 1997-12-02 | Lsi Logic Corporation | Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system |
US5814536A (en) * | 1995-12-27 | 1998-09-29 | Lsi Logic Corporation | Method of manufacturing powdered metal heat sinks having increased surface area |
US5686676A (en) * | 1996-05-07 | 1997-11-11 | Brush Wellman Inc. | Process for making improved copper/tungsten composites |
DE19729677B4 (de) * | 1997-07-11 | 2006-05-18 | Curamik Electronics Gmbh | Gehäuse für Halbleiterbauelemente, insbesondere für Leistungshalbleiterbauelemente |
US6509590B1 (en) | 1998-07-20 | 2003-01-21 | Micron Technology, Inc. | Aluminum-beryllium alloys for air bridges |
FR2784691B1 (fr) * | 1998-10-16 | 2000-12-29 | Eurotungstene Poudres | Poudre metallique prealliee micronique a base de metaux de transition 3d |
JP3479738B2 (ja) * | 1998-11-16 | 2003-12-15 | 株式会社アライドマテリアル | 半導体パッケージと、それに用いる放熱基板の製造方法 |
US7262130B1 (en) | 2000-01-18 | 2007-08-28 | Micron Technology, Inc. | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals |
US6420262B1 (en) | 2000-01-18 | 2002-07-16 | Micron Technology, Inc. | Structures and methods to enhance copper metallization |
US7211512B1 (en) | 2000-01-18 | 2007-05-01 | Micron Technology, Inc. | Selective electroless-plated copper metallization |
US6423629B1 (en) * | 2000-05-31 | 2002-07-23 | Kie Y. Ahn | Multilevel copper interconnects with low-k dielectrics and air gaps |
US6674167B1 (en) * | 2000-05-31 | 2004-01-06 | Micron Technology, Inc. | Multilevel copper interconnect with double passivation |
KR100594602B1 (ko) * | 2003-04-28 | 2006-06-30 | 히다치 훈마츠 야킨 가부시키가이샤 | 구리 기재 저열팽창 고열전도 부재의 제조 방법 |
US20080165442A1 (en) * | 2006-11-08 | 2008-07-10 | Wenshan Cai | System, method and apparatus for cloaking |
JP6334325B2 (ja) * | 2014-08-29 | 2018-05-30 | 日本冶金工業株式会社 | バイメタル用低熱膨張合金 |
US11130201B2 (en) * | 2014-09-05 | 2021-09-28 | Ametek, Inc. | Nickel-chromium alloy and method of making the same |
CN113322397B (zh) * | 2021-05-27 | 2022-04-12 | 宁波金田铜业(集团)股份有限公司 | 一种折弯性能优异的粉末冶金铜铁合金带材的制备方法 |
CN116666229A (zh) * | 2023-08-02 | 2023-08-29 | 西安畅榜电子科技有限公司 | 一种芯片框及其加工方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1136174A (fr) * | 1954-11-30 | 1957-05-10 | Birmingham Small Arms Co Ltd | Fabrication d'agglomérés de poudre métallique |
US3685134A (en) * | 1970-05-15 | 1972-08-22 | Mallory & Co Inc P R | Method of making electrical contact materials |
US4021205A (en) * | 1975-06-11 | 1977-05-03 | Teikoku Piston Ring Co. Ltd. | Sintered powdered ferrous alloy article and process for producing the alloy article |
US4032301A (en) * | 1973-09-13 | 1977-06-28 | Siemens Aktiengesellschaft | Composite metal as a contact material for vacuum switches |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3120436A (en) * | 1961-03-23 | 1964-02-04 | Presmet Corp | Powdered metal article and method of making |
US3652261A (en) * | 1969-06-25 | 1972-03-28 | American Metal Climax Inc | Iron powder infiltrant |
DE2142708C3 (de) * | 1971-08-26 | 1978-11-09 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zur Nachbehandlung von Sinterkörpern aus Eisen, Kupfer und Zinn |
-
1977
- 1977-06-09 US US05/805,040 patent/US4158719A/en not_active Expired - Lifetime
-
1978
- 1978-05-31 GB GB24734/78A patent/GB1588208A/en not_active Expired
- 1978-06-06 CA CA304,871A patent/CA1087423A/fr not_active Expired
- 1978-06-08 JP JP6838278A patent/JPS544210A/ja active Granted
- 1978-06-08 DE DE19782825262 patent/DE2825262A1/de not_active Ceased
- 1978-06-09 FR FR787817382A patent/FR2393640A1/fr active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1136174A (fr) * | 1954-11-30 | 1957-05-10 | Birmingham Small Arms Co Ltd | Fabrication d'agglomérés de poudre métallique |
US3685134A (en) * | 1970-05-15 | 1972-08-22 | Mallory & Co Inc P R | Method of making electrical contact materials |
US4032301A (en) * | 1973-09-13 | 1977-06-28 | Siemens Aktiengesellschaft | Composite metal as a contact material for vacuum switches |
US4021205A (en) * | 1975-06-11 | 1977-05-03 | Teikoku Piston Ring Co. Ltd. | Sintered powdered ferrous alloy article and process for producing the alloy article |
Also Published As
Publication number | Publication date |
---|---|
GB1588208A (en) | 1981-04-15 |
JPS5634602B2 (fr) | 1981-08-11 |
US4158719A (en) | 1979-06-19 |
FR2393640B1 (fr) | 1982-08-06 |
DE2825262A1 (de) | 1978-12-21 |
JPS544210A (en) | 1979-01-12 |
CA1087423A (fr) | 1980-10-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |