US4321122A
(en)
*
|
1980-03-31 |
1982-03-23 |
Eastman Kodak Company |
Apparatus for forming electrical contact with an analysis slide
|
JPS57101769A
(en)
*
|
1980-10-30 |
1982-06-24 |
Everett Charles Inc |
Translation apparatus and test mount apparatus and manufacture of translation apparatus
|
US4423376A
(en)
*
|
1981-03-20 |
1983-12-27 |
International Business Machines Corporation |
Contact probe assembly having rotatable contacting probe elements
|
DE3123627A1
(de)
*
|
1981-06-15 |
1982-12-30 |
Siemens AG, 1000 Berlin und 8000 München |
Vorrichtung zum gleichzeitigen kontaktieren mehrerer eng beisammenliegender pruefpunkte, insbesondere von rasterfeldern
|
DE3337915A1
(de)
*
|
1982-10-21 |
1984-05-24 |
Feinmetall Gmbh, 7033 Herrenberg |
Kontaktiervorrichtung
|
GB2146849B
(en)
*
|
1983-09-17 |
1987-08-05 |
Marconi Instruments Ltd |
Electrical test probe head assembly
|
GB8417646D0
(en)
*
|
1984-07-11 |
1984-08-15 |
Smiths Industries Plc |
Electrical contacts
|
US4686608A
(en)
*
|
1985-07-19 |
1987-08-11 |
General Dynamics, Electronics Division |
Electronic equipment rack interconnection system
|
DE3773904D1
(de)
*
|
1987-03-27 |
1991-11-21 |
Ibm Deutschland |
Kontaktsonden-anordnung zur elektrischen verbindung einer pruefeinrichtung mit den kreisfoermigen anschlussflaechen eines prueflings.
|
US5033977A
(en)
*
|
1987-10-13 |
1991-07-23 |
Minnesota Mining & Manufacturing Co. |
Electrical connector and fixture for four-sided integrated circuit device
|
JP2554746B2
(ja)
*
|
1989-07-04 |
1996-11-13 |
山一電機株式会社 |
コンタクト
|
US5175496A
(en)
*
|
1990-08-31 |
1992-12-29 |
Cray Research, Inc. |
Dual contact beam assembly for an IC test fixture
|
US5207585A
(en)
*
|
1990-10-31 |
1993-05-04 |
International Business Machines Corporation |
Thin interface pellicle for dense arrays of electrical interconnects
|
US5137456A
(en)
*
|
1991-11-04 |
1992-08-11 |
International Business Machines Corporation |
High density, separable connector and contact for use therein
|
US5230632A
(en)
*
|
1991-12-19 |
1993-07-27 |
International Business Machines Corporation |
Dual element electrical contact and connector assembly utilizing same
|
US5415559A
(en)
*
|
1992-05-18 |
1995-05-16 |
Japan Aviation Electronics Industry, Ltd. |
Electrical connector having a plurality of contact pin springs
|
US5314355A
(en)
*
|
1992-06-01 |
1994-05-24 |
Xerox Corporation |
Coplainer sliding electrical connector
|
US5237743A
(en)
*
|
1992-06-19 |
1993-08-24 |
International Business Machines Corporation |
Method of forming a conductive end portion on a flexible circuit member
|
US5248262A
(en)
*
|
1992-06-19 |
1993-09-28 |
International Business Machines Corporation |
High density connector
|
US5297967A
(en)
*
|
1992-10-13 |
1994-03-29 |
International Business Machines Corporation |
Electrical interconnector with helical contacting portion and assembly using same
|
US20050062492A1
(en)
*
|
2001-08-03 |
2005-03-24 |
Beaman Brian Samuel |
High density integrated circuit apparatus, test probe and methods of use thereof
|
US5371654A
(en)
*
|
1992-10-19 |
1994-12-06 |
International Business Machines Corporation |
Three dimensional high performance interconnection package
|
GB2276043A
(en)
*
|
1993-03-03 |
1994-09-14 |
Centalic Tech Dev Ltd |
Contact probe for testing electrical equipment
|
US20030048108A1
(en)
*
|
1993-04-30 |
2003-03-13 |
Beaman Brian Samuel |
Structural design and processes to control probe position accuracy in a wafer test probe assembly
|
US20020053734A1
(en)
|
1993-11-16 |
2002-05-09 |
Formfactor, Inc. |
Probe card assembly and kit, and methods of making same
|
US5800184A
(en)
*
|
1994-03-08 |
1998-09-01 |
International Business Machines Corporation |
High density electrical interconnect apparatus and method
|
US5534784A
(en)
*
|
1994-05-02 |
1996-07-09 |
Motorola, Inc. |
Method for probing a semiconductor wafer
|
US5632631A
(en)
|
1994-06-07 |
1997-05-27 |
Tessera, Inc. |
Microelectronic contacts with asperities and methods of making same
|
US6232789B1
(en)
|
1997-05-28 |
2001-05-15 |
Cascade Microtech, Inc. |
Probe holder for low current measurements
|
US5686843A
(en)
*
|
1995-06-30 |
1997-11-11 |
International Business Machines Corporation |
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
|
US5597317A
(en)
*
|
1995-08-11 |
1997-01-28 |
W. L. Gore & Associates, Inc. |
Surface mating electrical connector
|
KR100212169B1
(ko)
*
|
1996-02-13 |
1999-08-02 |
오쿠보 마사오 |
프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리
|
US8033838B2
(en)
|
1996-02-21 |
2011-10-11 |
Formfactor, Inc. |
Microelectronic contact structure
|
US5691467A
(en)
*
|
1996-06-28 |
1997-11-25 |
International Business Machines Corporation |
Method for mapping surfaces adapted for receiving electrical components
|
US5914613A
(en)
|
1996-08-08 |
1999-06-22 |
Cascade Microtech, Inc. |
Membrane probing system with local contact scrub
|
US5759048A
(en)
*
|
1996-12-11 |
1998-06-02 |
The Whitaker Corporation |
Board to board connector
|
WO1998030914A1
(fr)
*
|
1997-01-13 |
1998-07-16 |
Peter Hoang Nguyen |
Ensemble sonde de detection de contact pour essais de dispositifs electriques
|
US7714235B1
(en)
|
1997-05-06 |
2010-05-11 |
Formfactor, Inc. |
Lithographically defined microelectronic contact structures
|
JPH11125645A
(ja)
*
|
1997-10-21 |
1999-05-11 |
Mitsubishi Electric Corp |
垂直針型プローブカードおよびその製造方法
|
TW392074B
(en)
*
|
1997-11-05 |
2000-06-01 |
Feinmetall Gmbh |
Test head for microstructures with interface
|
US6411112B1
(en)
|
1998-02-19 |
2002-06-25 |
International Business Machines Corporation |
Off-axis contact tip and dense packing design for a fine pitch probe
|
US6181144B1
(en)
|
1998-02-25 |
2001-01-30 |
Micron Technology, Inc. |
Semiconductor probe card having resistance measuring circuitry and method fabrication
|
US6337577B1
(en)
|
1998-05-11 |
2002-01-08 |
Micron Technology, Inc. |
Interconnect and system for testing bumped semiconductor components with on-board multiplex circuitry for expanding tester resources
|
US6677776B2
(en)
*
|
1998-05-11 |
2004-01-13 |
Micron Technology, Inc. |
Method and system having switching network for testing semiconductor components on a substrate
|
US6246250B1
(en)
|
1998-05-11 |
2001-06-12 |
Micron Technology, Inc. |
Probe card having on-board multiplex circuitry for expanding tester resources
|
US6024579A
(en)
*
|
1998-05-29 |
2000-02-15 |
The Whitaker Corporation |
Electrical connector having buckling beam contacts
|
US6256882B1
(en)
|
1998-07-14 |
2001-07-10 |
Cascade Microtech, Inc. |
Membrane probing system
|
US6297657B1
(en)
|
1999-01-11 |
2001-10-02 |
Wentworth Laboratories, Inc. |
Temperature compensated vertical pin probing device
|
US6163162A
(en)
*
|
1999-01-11 |
2000-12-19 |
Wentworth Laboratories, Inc. |
Temperature compensated vertical pin probing device
|
US6404211B2
(en)
|
1999-02-11 |
2002-06-11 |
International Business Machines Corporation |
Metal buckling beam probe
|
US6419500B1
(en)
|
1999-03-08 |
2002-07-16 |
Kulicke & Soffa Investment, Inc. |
Probe assembly having floatable buckling beam probes and apparatus for abrading the same
|
US6255602B1
(en)
|
1999-03-15 |
2001-07-03 |
Wentworth Laboratories, Inc. |
Multiple layer electrical interface
|
US6196866B1
(en)
|
1999-04-30 |
2001-03-06 |
International Business Machines Corporation |
Vertical probe housing
|
US6578264B1
(en)
|
1999-06-04 |
2003-06-17 |
Cascade Microtech, Inc. |
Method for constructing a membrane probe using a depression
|
US6838890B2
(en)
*
|
2000-02-25 |
2005-01-04 |
Cascade Microtech, Inc. |
Membrane probing system
|
US6529021B1
(en)
|
2000-04-25 |
2003-03-04 |
International Business Machines Corporation |
Self-scrub buckling beam probe
|
DE20114544U1
(de)
|
2000-12-04 |
2002-02-21 |
Cascade Microtech Inc |
Wafersonde
|
US7064564B2
(en)
*
|
2001-02-01 |
2006-06-20 |
Antares Contech, Inc. |
Bundled probe apparatus for multiple terminal contacting
|
WO2003052435A1
(fr)
|
2001-08-21 |
2003-06-26 |
Cascade Microtech, Inc. |
Systeme de detection a membrane
|
US6977515B2
(en)
*
|
2001-09-20 |
2005-12-20 |
Wentworth Laboratories, Inc. |
Method for forming photo-defined micro electrical contacts
|
US6906540B2
(en)
*
|
2001-09-20 |
2005-06-14 |
Wentworth Laboratories, Inc. |
Method for chemically etching photo-defined micro electrical contacts
|
EP1509776A4
(fr)
|
2002-05-23 |
2010-08-18 |
Cascade Microtech Inc |
Sonde d'essai d'un dispositif soumis essai
|
US6724205B1
(en)
|
2002-11-13 |
2004-04-20 |
Cascade Microtech, Inc. |
Probe for combined signals
|
JP2004342466A
(ja)
*
|
2003-05-15 |
2004-12-02 |
Yamaichi Electronics Co Ltd |
半導体装置用ソケットの組立方法
|
US7057404B2
(en)
|
2003-05-23 |
2006-06-06 |
Sharp Laboratories Of America, Inc. |
Shielded probe for testing a device under test
|
JP4197659B2
(ja)
*
|
2003-05-30 |
2008-12-17 |
富士通マイクロエレクトロニクス株式会社 |
電子部品用コンタクタ及びこれを用いた試験方法
|
DE60312692T2
(de)
*
|
2003-10-13 |
2007-12-06 |
Technoprobe S.P.A, Cernusco Lombardone |
Prüfkopf mit vertikalen Prüfnadeln für integrierte Halbleitergeräte
|
CN100595598C
(zh)
|
2003-11-14 |
2010-03-24 |
温特沃斯实验室公司 |
带有集成装配辅助装置的模头
|
JP2007517231A
(ja)
|
2003-12-24 |
2007-06-28 |
カスケード マイクロテック インコーポレイテッド |
アクティブ・ウェハプローブ
|
TWI266057B
(en)
*
|
2004-02-05 |
2006-11-11 |
Ind Tech Res Inst |
Integrated probe card and the packaging method
|
US9476911B2
(en)
|
2004-05-21 |
2016-10-25 |
Microprobe, Inc. |
Probes with high current carrying capability and laser machining methods
|
US9097740B2
(en)
*
|
2004-05-21 |
2015-08-04 |
Formfactor, Inc. |
Layered probes with core
|
US7659739B2
(en)
*
|
2006-09-14 |
2010-02-09 |
Micro Porbe, Inc. |
Knee probe having reduced thickness section for control of scrub motion
|
USRE43503E1
(en)
|
2006-06-29 |
2012-07-10 |
Microprobe, Inc. |
Probe skates for electrical testing of convex pad topologies
|
US7733101B2
(en)
*
|
2004-05-21 |
2010-06-08 |
Microprobe, Inc. |
Knee probe having increased scrub motion
|
US7759949B2
(en)
|
2004-05-21 |
2010-07-20 |
Microprobe, Inc. |
Probes with self-cleaning blunt skates for contacting conductive pads
|
US8988091B2
(en)
*
|
2004-05-21 |
2015-03-24 |
Microprobe, Inc. |
Multiple contact probes
|
JP4980903B2
(ja)
|
2004-07-07 |
2012-07-18 |
カスケード マイクロテック インコーポレイテッド |
膜懸垂プローブを具えるプローブヘッド
|
US7252514B2
(en)
*
|
2004-09-02 |
2007-08-07 |
International Business Machines Corporation |
High density space transformer and method of fabricating same
|
DE202005021435U1
(de)
|
2004-09-13 |
2008-02-28 |
Cascade Microtech, Inc., Beaverton |
Doppelseitige Prüfaufbauten
|
US20060066328A1
(en)
*
|
2004-09-30 |
2006-03-30 |
Probelogic, Inc. |
Buckling beam probe test assembly
|
US7656172B2
(en)
|
2005-01-31 |
2010-02-02 |
Cascade Microtech, Inc. |
System for testing semiconductors
|
US7535247B2
(en)
|
2005-01-31 |
2009-05-19 |
Cascade Microtech, Inc. |
Interface for testing semiconductors
|
CN100446355C
(zh)
*
|
2005-02-03 |
2008-12-24 |
旺矽科技股份有限公司 |
微接触元件
|
JP2006226702A
(ja)
*
|
2005-02-15 |
2006-08-31 |
Nidec-Read Corp |
基板検査用治具、基板検査装置及び検査用接触子
|
CZ2007783A3
(cs)
*
|
2005-04-12 |
2008-04-02 |
Technoprobe, S.P.A. |
Kontaktní sonda pro testovací hlavu, která má svislé sondy, pro polovodicová integrovaná elektronická zarízení
|
US7449899B2
(en)
|
2005-06-08 |
2008-11-11 |
Cascade Microtech, Inc. |
Probe for high frequency signals
|
JP5080459B2
(ja)
|
2005-06-13 |
2012-11-21 |
カスケード マイクロテック インコーポレイテッド |
広帯域能動/受動差動信号プローブ
|
US7271606B1
(en)
*
|
2005-08-04 |
2007-09-18 |
National Semiconductor Corporation |
Spring-based probe pin that allows kelvin testing
|
JP4823617B2
(ja)
*
|
2005-09-09 |
2011-11-24 |
日本発條株式会社 |
導電性接触子および導電性接触子の製造方法
|
US7649367B2
(en)
*
|
2005-12-07 |
2010-01-19 |
Microprobe, Inc. |
Low profile probe having improved mechanical scrub and reduced contact inductance
|
TWI284209B
(en)
|
2005-12-30 |
2007-07-21 |
Ind Tech Res Inst |
A method of fabricating vertical probe head
|
US7312617B2
(en)
|
2006-03-20 |
2007-12-25 |
Microprobe, Inc. |
Space transformers employing wire bonds for interconnections with fine pitch contacts
|
DE202007018733U1
(de)
|
2006-06-09 |
2009-03-26 |
Cascade Microtech, Inc., Beaverton |
Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
|
US7443186B2
(en)
|
2006-06-12 |
2008-10-28 |
Cascade Microtech, Inc. |
On-wafer test structures for differential signals
|
US7403028B2
(en)
|
2006-06-12 |
2008-07-22 |
Cascade Microtech, Inc. |
Test structure and probe for differential signals
|
US7723999B2
(en)
|
2006-06-12 |
2010-05-25 |
Cascade Microtech, Inc. |
Calibration structures for differential signal probing
|
US7764072B2
(en)
|
2006-06-12 |
2010-07-27 |
Cascade Microtech, Inc. |
Differential signal probing system
|
US7786740B2
(en)
*
|
2006-10-11 |
2010-08-31 |
Astria Semiconductor Holdings, Inc. |
Probe cards employing probes having retaining portions for potting in a potting region
|
US8907689B2
(en)
*
|
2006-10-11 |
2014-12-09 |
Microprobe, Inc. |
Probe retention arrangement
|
TWI332086B
(en)
*
|
2006-10-24 |
2010-10-21 |
Ind Tech Res Inst |
Multi-layer electric probe and fabricating method
|
US8264248B2
(en)
*
|
2007-03-30 |
2012-09-11 |
Dsl Labs, Inc. |
Micro probe assembly
|
US7514948B2
(en)
*
|
2007-04-10 |
2009-04-07 |
Microprobe, Inc. |
Vertical probe array arranged to provide space transformation
|
US7876114B2
(en)
|
2007-08-08 |
2011-01-25 |
Cascade Microtech, Inc. |
Differential waveguide probe
|
TWI360182B
(en)
*
|
2007-10-05 |
2012-03-11 |
Ind Tech Res Inst |
Method for making a conductive film
|
US7671610B2
(en)
*
|
2007-10-19 |
2010-03-02 |
Microprobe, Inc. |
Vertical guided probe array providing sideways scrub motion
|
US8723546B2
(en)
*
|
2007-10-19 |
2014-05-13 |
Microprobe, Inc. |
Vertical guided layered probe
|
US8310259B2
(en)
|
2008-02-01 |
2012-11-13 |
International Business Machines Corporation |
Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections
|
EP2110673A1
(fr)
*
|
2008-04-17 |
2009-10-21 |
Technoprobe S.p.A |
Tête d'essai à aiguilles verticales équipé avec des moyens d'arrêtes pour éviter leur échappement en dehors de respectives trous de guidages
|
DE102008023761B9
(de)
|
2008-05-09 |
2012-11-08 |
Feinmetall Gmbh |
Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
|
TWI377624B
(en)
|
2008-05-13 |
2012-11-21 |
Ind Tech Res Inst |
Conducting film structure, fabrication method thereof, and conducting film type probe device for ic
|
US8230593B2
(en)
*
|
2008-05-29 |
2012-07-31 |
Microprobe, Inc. |
Probe bonding method having improved control of bonding material
|
US7888957B2
(en)
|
2008-10-06 |
2011-02-15 |
Cascade Microtech, Inc. |
Probing apparatus with impedance optimized interface
|
US8410806B2
(en)
|
2008-11-21 |
2013-04-02 |
Cascade Microtech, Inc. |
Replaceable coupon for a probing apparatus
|
TWI399812B
(zh)
*
|
2008-12-29 |
2013-06-21 |
Ind Tech Res Inst |
導電膜結構及其製法與導電膜式積體電路針測裝置
|
US8073019B2
(en)
*
|
2009-03-02 |
2011-12-06 |
Jian Liu |
810 nm ultra-short pulsed fiber laser
|
US9702904B2
(en)
*
|
2011-03-21 |
2017-07-11 |
Formfactor, Inc. |
Non-linear vertical leaf spring
|
JP2013064678A
(ja)
*
|
2011-09-20 |
2013-04-11 |
Renesas Electronics Corp |
半導体集積回路装置の製造方法
|
US8836356B2
(en)
|
2011-12-12 |
2014-09-16 |
International Business Machines Corporation |
Vertical probe assembly with air channel
|
US8994393B2
(en)
|
2012-09-06 |
2015-03-31 |
International Business Machines Corporation |
High-frequency cobra probe
|
US10359447B2
(en)
*
|
2012-10-31 |
2019-07-23 |
Formfactor, Inc. |
Probes with spring mechanisms for impeding unwanted movement in guide holes
|
US9599657B2
(en)
|
2013-01-03 |
2017-03-21 |
Globalfoundries Inc. |
High power radio frequency (RF) in-line wafer testing
|
TW201537181A
(zh)
*
|
2014-03-25 |
2015-10-01 |
Mpi Corp |
垂直式探針裝置及使用於該垂直式探針裝置之支撐柱
|
JP2018513389A
(ja)
|
2015-03-13 |
2018-05-24 |
テクノプローベ エス.ピー.エー. |
様々な動作状態での試験ヘッドでのプローブ保持を適正化し、各々のガイドホールでのスライドを改善するバーチカルプローブをもつ試験ヘッド
|
JP2018179721A
(ja)
*
|
2017-04-12 |
2018-11-15 |
株式会社日本マイクロニクス |
電気的接続装置
|
TWI626454B
(zh)
*
|
2017-11-20 |
2018-06-11 |
|
Probe device and method of manufacturing same
|
US11454650B2
(en)
*
|
2018-07-18 |
2022-09-27 |
Nidec-Read Corporation |
Probe, inspection jig, inspection device, and method for manufacturing probe
|
US11768227B1
(en)
|
2019-02-22 |
2023-09-26 |
Microfabrica Inc. |
Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
|
US11761982B1
(en)
|
2019-12-31 |
2023-09-19 |
Microfabrica Inc. |
Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
|
US11867721B1
(en)
|
2019-12-31 |
2024-01-09 |
Microfabrica Inc. |
Probes with multiple springs, methods for making, and methods for using
|
US11774467B1
(en)
|
2020-09-01 |
2023-10-03 |
Microfabrica Inc. |
Method of in situ modulation of structural material properties and/or template shape
|