FR2383579A1 - Procede et dispositif pour monter un composant electrique sur une plaque de circuit imprime - Google Patents

Procede et dispositif pour monter un composant electrique sur une plaque de circuit imprime

Info

Publication number
FR2383579A1
FR2383579A1 FR7807012A FR7807012A FR2383579A1 FR 2383579 A1 FR2383579 A1 FR 2383579A1 FR 7807012 A FR7807012 A FR 7807012A FR 7807012 A FR7807012 A FR 7807012A FR 2383579 A1 FR2383579 A1 FR 2383579A1
Authority
FR
France
Prior art keywords
circuit board
printed circuit
electrical component
contact pins
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7807012A
Other languages
English (en)
Other versions
FR2383579B3 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NILSSON SOREN GUSTAV
Original Assignee
NILSSON SOREN GUSTAV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NILSSON SOREN GUSTAV filed Critical NILSSON SOREN GUSTAV
Publication of FR2383579A1 publication Critical patent/FR2383579A1/fr
Application granted granted Critical
Publication of FR2383579B3 publication Critical patent/FR2383579B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Suivant ce procédé pour fixer un composant électrique comportant un corps ayant des broches de contact, sur une plaque de circuit imprimé, dans lequel ledit corps ou un organe de support pour ce corps, comportant des broches de contact correspondantes, est mis en place par l'engagement des broches de contact dans des trous correspondants prévus dans la plaque de circuit par une première face de celle-ci et dans lequel le câblage des composants sur le circuit est effectué par l'intermédiaire des broches de contact faisant saillie hors de la face opposée de la plaque de circuit imprimé, on fixe le corps ou un organe de support pour celui-ci au moyen d'une plaque en une matière isolante, présentant un agencement de trous, une forme et une surface correspondant à celles du composant ou de son organe de support, appliquée sur les broches faisant saillie hors de l'autre face de la plaque de circuit imprimé.
FR7807012A 1977-03-10 1978-03-10 Procede et dispositif pour monter un composant electrique sur une plaque de circuit imprime Granted FR2383579A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7702690A SE404749B (sv) 1977-03-10 1977-03-10 Sett och anordning vid montering av en elektrisk komponent pa ett kretskort

Publications (2)

Publication Number Publication Date
FR2383579A1 true FR2383579A1 (fr) 1978-10-06
FR2383579B3 FR2383579B3 (fr) 1980-11-28

Family

ID=20330677

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7807012A Granted FR2383579A1 (fr) 1977-03-10 1978-03-10 Procede et dispositif pour monter un composant electrique sur une plaque de circuit imprime

Country Status (6)

Country Link
US (1) US4340774A (fr)
JP (1) JPS53143977A (fr)
DE (1) DE2809789C2 (fr)
FR (1) FR2383579A1 (fr)
GB (1) GB1570672A (fr)
SE (1) SE404749B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573254A (en) * 1984-12-24 1986-03-04 Sperry Corporation Apparatus for maintaining electronic component pin alignment
US5051870A (en) * 1990-06-11 1991-09-24 Companion John A Electronic socket attachment method and identification system
US5021811A (en) * 1990-06-21 1991-06-04 Eastman Kodak Company Recycleable element recycle counter and method
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US6281695B1 (en) * 1996-12-17 2001-08-28 Robbie M. K. Chung Integrated circuit package pin indicator
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6357594B1 (en) 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US20110247197A1 (en) * 2008-01-09 2011-10-13 Feinics Amatech Teoranta Forming channels for an antenna wire of a transponder
US9048272B2 (en) * 2008-09-25 2015-06-02 Illinois Tool Works Inc. Devices and method for handling microelectronics assemblies
CN101859164A (zh) * 2009-04-10 2010-10-13 鸿富锦精密工业（深圳）有限公司 电脑主板及其排线连接座

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA549530A (fr) * 1957-12-03 Y. Wright Thomas Adapteur de clef guide pour lampes de radio miniature
US3522483A (en) * 1968-07-02 1970-08-04 Burroughs Corp Display tube mounting arrangement
US3721941A (en) * 1971-11-03 1973-03-20 Narco Scientific Ind Multiple socket connector apparatus
US3989338A (en) * 1974-11-08 1976-11-02 Gosser Robert B Push-pin assembly method and construction

Also Published As

Publication number Publication date
DE2809789A1 (de) 1978-09-21
SE7702690L (sv) 1978-09-11
SE404749B (sv) 1978-10-23
DE2809789C2 (de) 1982-04-22
JPS53143977A (en) 1978-12-14
GB1570672A (en) 1980-07-02
FR2383579B3 (fr) 1980-11-28
US4340774A (en) 1982-07-20

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