SE404749B - Sett och anordning vid montering av en elektrisk komponent pa ett kretskort - Google Patents

Sett och anordning vid montering av en elektrisk komponent pa ett kretskort

Info

Publication number
SE404749B
SE404749B SE7702690A SE7702690A SE404749B SE 404749 B SE404749 B SE 404749B SE 7702690 A SE7702690 A SE 7702690A SE 7702690 A SE7702690 A SE 7702690A SE 404749 B SE404749 B SE 404749B
Authority
SE
Sweden
Prior art keywords
kit
mounting
electrical component
circuit card
card
Prior art date
Application number
SE7702690A
Other languages
English (en)
Other versions
SE7702690L (sv
Inventor
Sok
Original Assignee
Carneborn Leif Roland
Nilsson Soren Gustav
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carneborn Leif Roland, Nilsson Soren Gustav filed Critical Carneborn Leif Roland
Priority to SE7702690A priority Critical patent/SE404749B/sv
Priority to GB6611/78A priority patent/GB1570672A/en
Priority to DE2809789A priority patent/DE2809789C2/de
Priority to JP2553678A priority patent/JPS53143977A/ja
Priority to FR7807012A priority patent/FR2383579A1/fr
Priority to US05/885,255 priority patent/US4340774A/en
Publication of SE7702690L publication Critical patent/SE7702690L/sv
Publication of SE404749B publication Critical patent/SE404749B/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
SE7702690A 1977-03-10 1977-03-10 Sett och anordning vid montering av en elektrisk komponent pa ett kretskort SE404749B (sv)

Priority Applications (6)

Application Number Priority Date Filing Date Title
SE7702690A SE404749B (sv) 1977-03-10 1977-03-10 Sett och anordning vid montering av en elektrisk komponent pa ett kretskort
GB6611/78A GB1570672A (en) 1977-03-10 1978-02-20 Ectric component method and device for mounting on a circuit board of an el
DE2809789A DE2809789C2 (de) 1977-03-10 1978-03-07 Vorrichtung zum Montieren eines elektrischen Bauelementes auf einer Leiterplatte
JP2553678A JPS53143977A (en) 1977-03-10 1978-03-08 Method of and device for mounting electronic parts at circuit board
FR7807012A FR2383579A1 (fr) 1977-03-10 1978-03-10 Procede et dispositif pour monter un composant electrique sur une plaque de circuit imprime
US05/885,255 US4340774A (en) 1977-03-10 1978-03-10 Device for mounting circuit components on a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7702690A SE404749B (sv) 1977-03-10 1977-03-10 Sett och anordning vid montering av en elektrisk komponent pa ett kretskort

Publications (2)

Publication Number Publication Date
SE7702690L SE7702690L (sv) 1978-09-11
SE404749B true SE404749B (sv) 1978-10-23

Family

ID=20330677

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7702690A SE404749B (sv) 1977-03-10 1977-03-10 Sett och anordning vid montering av en elektrisk komponent pa ett kretskort

Country Status (6)

Country Link
US (1) US4340774A (sv)
JP (1) JPS53143977A (sv)
DE (1) DE2809789C2 (sv)
FR (1) FR2383579A1 (sv)
GB (1) GB1570672A (sv)
SE (1) SE404749B (sv)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573254A (en) * 1984-12-24 1986-03-04 Sperry Corporation Apparatus for maintaining electronic component pin alignment
US5051870A (en) * 1990-06-11 1991-09-24 Companion John A Electronic socket attachment method and identification system
US5021811A (en) * 1990-06-21 1991-06-04 Eastman Kodak Company Recycleable element recycle counter and method
US5203143A (en) * 1992-03-28 1993-04-20 Tempo G Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system
US5524765A (en) * 1994-11-15 1996-06-11 Tempo G Carrier tape packaging system utilizing a layer of gel for retaining small components
US6281695B1 (en) * 1996-12-17 2001-08-28 Robbie M. K. Chung Integrated circuit package pin indicator
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6357594B1 (en) 1998-06-30 2002-03-19 Tempo G Means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US5960961A (en) * 1998-08-03 1999-10-05 Tempo G Tab means to assure ready release of singulated wafer die or integrated circuit chips packed in adhesive backed carrier tapes
US20110247197A1 (en) * 2008-01-09 2011-10-13 Feinics Amatech Teoranta Forming channels for an antenna wire of a transponder
WO2010036790A1 (en) * 2008-09-25 2010-04-01 Illinois Tool Works Inc. Devices and methods for handling microelectronic assemblies
CN101859164A (zh) * 2009-04-10 2010-10-13 鸿富锦精密工业（深圳）有限公司 电脑主板及其排线连接座

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA549530A (en) * 1957-12-03 Y. Wright Thomas Guide key adapter for miniature radio tubes
US3522483A (en) * 1968-07-02 1970-08-04 Burroughs Corp Display tube mounting arrangement
US3721941A (en) * 1971-11-03 1973-03-20 Narco Scientific Ind Multiple socket connector apparatus
US3989338A (en) * 1974-11-08 1976-11-02 Gosser Robert B Push-pin assembly method and construction

Also Published As

Publication number Publication date
JPS53143977A (en) 1978-12-14
FR2383579A1 (fr) 1978-10-06
SE7702690L (sv) 1978-09-11
DE2809789A1 (de) 1978-09-21
GB1570672A (en) 1980-07-02
DE2809789C2 (de) 1982-04-22
FR2383579B3 (sv) 1980-11-28
US4340774A (en) 1982-07-20

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