FR2383241A1 - Procede de depot multicouche par evaporation sous vide - Google Patents

Procede de depot multicouche par evaporation sous vide

Info

Publication number
FR2383241A1
FR2383241A1 FR7806618A FR7806618A FR2383241A1 FR 2383241 A1 FR2383241 A1 FR 2383241A1 FR 7806618 A FR7806618 A FR 7806618A FR 7806618 A FR7806618 A FR 7806618A FR 2383241 A1 FR2383241 A1 FR 2383241A1
Authority
FR
France
Prior art keywords
source
substrate
vapors
sources
straight line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7806618A
Other languages
English (en)
Other versions
FR2383241B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2383241A1 publication Critical patent/FR2383241A1/fr
Application granted granted Critical
Publication of FR2383241B1 publication Critical patent/FR2383241B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Procédé de dépôt multicouche sous vide sur un substrat fixé à un porte-substrats rotatif par évaporations successives à partir de deux sources de vapeurs. On dispose l'une des sources de vapeurs Q à l'intérieur d'un cône engendré sur le côté de cette source par révolution autour de l'axe de rotation 0-0' du porte-substrats, d'une droit reliant l'autre source P à l'extrémité du substrat la plus distante de la source P, et l'on place l'autre source P à l'extérieur du cône engendré par révolution, autour de l'axe 0-0', d'une droite reliant la source P à l'extrémité du substrat la plus voisine de la source Q. On obtient ainsi deux couches déposées dont la première présente un motif débordant le motif de la seconde couche, ceci en une seule opération Application par exemple, à la réalisation de motifs de câblage Cr-Au, NiCr-Au ou Cr-Cu dans des circuits intégrés.
FR7806618A 1977-03-09 1978-03-08 Procede de depot multicouche par evaporation sous vide Granted FR2383241A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2476577A JPS53110367A (en) 1977-03-09 1977-03-09 Multi-layer film evaporation method

Publications (2)

Publication Number Publication Date
FR2383241A1 true FR2383241A1 (fr) 1978-10-06
FR2383241B1 FR2383241B1 (fr) 1980-04-18

Family

ID=12147241

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7806618A Granted FR2383241A1 (fr) 1977-03-09 1978-03-08 Procede de depot multicouche par evaporation sous vide

Country Status (6)

Country Link
JP (1) JPS53110367A (fr)
CA (1) CA1105333A (fr)
DE (1) DE2810316C3 (fr)
FR (1) FR2383241A1 (fr)
GB (1) GB1570777A (fr)
NL (1) NL7802611A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2587040A1 (fr) * 1985-09-11 1987-03-13 Sharp Kk Appareil de croissance epitaxiale par faisceaux moleculaires

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144597A (ja) * 1986-12-09 1988-06-16 古河電気工業株式会社 基板上に部分膜及び多層膜を連続的に形成する方法
US7229669B2 (en) * 2003-11-13 2007-06-12 Honeywell International Inc. Thin-film deposition methods and apparatuses
CN102877026B (zh) * 2012-09-27 2014-12-24 中国科学院长春光学精密机械与物理研究所 多层膜器件真空沉积装置
CN110331364B (zh) * 2019-08-02 2021-05-07 深圳市华星光电半导体显示技术有限公司 蒸镀金属掩膜板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2676114A (en) * 1951-06-08 1954-04-20 Libbey Owens Ford Glass Co Method of producing graded coatings
US2875505A (en) * 1952-12-11 1959-03-03 Bell Telephone Labor Inc Semiconductor translating device
US2906637A (en) * 1953-05-19 1959-09-29 Electronique Soc Gen Method of forming a film a short distance from a surface
FR1319182A (fr) * 1961-04-13 1963-02-22 Western Electric Co Procédé et appareil pour fabriquer des organes semi-conducteurs
GB1056678A (en) * 1963-08-01 1967-01-25 Hitachi Ltd Improvements relating to cryosars
DE1272680B (de) * 1963-09-16 1968-07-11 Halbleiterwerk Frankfurt Oder Vorrichtung zum Vakuumaufdampfen von Schichten auf eine grosse Anzahl von mit Masken abgedeckten Unterlagen

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1521536A (en) * 1923-08-21 1924-12-30 Samuel A Holmes Crutch chair

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2676114A (en) * 1951-06-08 1954-04-20 Libbey Owens Ford Glass Co Method of producing graded coatings
US2875505A (en) * 1952-12-11 1959-03-03 Bell Telephone Labor Inc Semiconductor translating device
US2906637A (en) * 1953-05-19 1959-09-29 Electronique Soc Gen Method of forming a film a short distance from a surface
FR1319182A (fr) * 1961-04-13 1963-02-22 Western Electric Co Procédé et appareil pour fabriquer des organes semi-conducteurs
GB1056678A (en) * 1963-08-01 1967-01-25 Hitachi Ltd Improvements relating to cryosars
DE1272680B (de) * 1963-09-16 1968-07-11 Halbleiterwerk Frankfurt Oder Vorrichtung zum Vakuumaufdampfen von Schichten auf eine grosse Anzahl von mit Masken abgedeckten Unterlagen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2587040A1 (fr) * 1985-09-11 1987-03-13 Sharp Kk Appareil de croissance epitaxiale par faisceaux moleculaires

Also Published As

Publication number Publication date
DE2810316A1 (de) 1978-09-14
JPS53110367A (en) 1978-09-27
NL7802611A (nl) 1978-09-12
CA1105333A (fr) 1981-07-21
GB1570777A (en) 1980-07-09
JPS5751260B2 (fr) 1982-11-01
DE2810316C3 (de) 1981-07-09
FR2383241B1 (fr) 1980-04-18
DE2810316B2 (de) 1980-08-14

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