FR2376520A1 - Diode semiconductrice et ensemble comprenant une telle diode - Google Patents

Diode semiconductrice et ensemble comprenant une telle diode

Info

Publication number
FR2376520A1
FR2376520A1 FR7639707A FR7639707A FR2376520A1 FR 2376520 A1 FR2376520 A1 FR 2376520A1 FR 7639707 A FR7639707 A FR 7639707A FR 7639707 A FR7639707 A FR 7639707A FR 2376520 A1 FR2376520 A1 FR 2376520A1
Authority
FR
France
Prior art keywords
diode
crystal
semiconductive
electrodes
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7639707A
Other languages
English (en)
Other versions
FR2376520B1 (fr
Inventor
Jacques Thillays
Gerard Robert David
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7639707A priority Critical patent/FR2376520A1/fr
Publication of FR2376520A1 publication Critical patent/FR2376520A1/fr
Application granted granted Critical
Publication of FR2376520B1 publication Critical patent/FR2376520B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermistors And Varistors (AREA)

Abstract

Diode semiconductrice présentant une résistance de fuite contrôlée, en polarisation inverse. Diode caractérisée en ce qu'un film de conductibilité électrique limitée revêt, au moins partiellement, son enveloppe extérieure. Application notamment à la constitution d'ensembles de diodes en série utilisables dans le domaine des hyperfrequences.
FR7639707A 1976-12-31 1976-12-31 Diode semiconductrice et ensemble comprenant une telle diode Granted FR2376520A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7639707A FR2376520A1 (fr) 1976-12-31 1976-12-31 Diode semiconductrice et ensemble comprenant une telle diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7639707A FR2376520A1 (fr) 1976-12-31 1976-12-31 Diode semiconductrice et ensemble comprenant une telle diode

Publications (2)

Publication Number Publication Date
FR2376520A1 true FR2376520A1 (fr) 1978-07-28
FR2376520B1 FR2376520B1 (fr) 1981-10-16

Family

ID=9181793

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7639707A Granted FR2376520A1 (fr) 1976-12-31 1976-12-31 Diode semiconductrice et ensemble comprenant une telle diode

Country Status (1)

Country Link
FR (1) FR2376520A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0065443A1 (fr) * 1981-05-19 1982-11-24 Thomson-Csf Boîtier d'encapsulation pour semiconducteur de puissance fonctionnant dans une gamme de fréquences de 2 à 20 GHz
FR2529386A1 (fr) * 1982-06-29 1983-12-30 Inf Milit Spatiale Aeronaut Boitier de circuit electronique comportant un condensateur
EP0218849A1 (fr) * 1985-09-12 1987-04-22 Siemens Aktiengesellschaft Bande de support pour un circuit à montage sur film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0065443A1 (fr) * 1981-05-19 1982-11-24 Thomson-Csf Boîtier d'encapsulation pour semiconducteur de puissance fonctionnant dans une gamme de fréquences de 2 à 20 GHz
FR2506520A1 (fr) * 1981-05-19 1982-11-26 Thomson Csf Boitier d'encapsulation pour semiconducteur de puissance fonctionnant dans une gamme de frequences de 2 a 20 ghz
FR2529386A1 (fr) * 1982-06-29 1983-12-30 Inf Milit Spatiale Aeronaut Boitier de circuit electronique comportant un condensateur
EP0218849A1 (fr) * 1985-09-12 1987-04-22 Siemens Aktiengesellschaft Bande de support pour un circuit à montage sur film

Also Published As

Publication number Publication date
FR2376520B1 (fr) 1981-10-16

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Legal Events

Date Code Title Description
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ST Notification of lapse