FR2349255A1 - Plaquette de circuit et son procede de fabrication - Google Patents

Plaquette de circuit et son procede de fabrication

Info

Publication number
FR2349255A1
FR2349255A1 FR7712302A FR7712302A FR2349255A1 FR 2349255 A1 FR2349255 A1 FR 2349255A1 FR 7712302 A FR7712302 A FR 7712302A FR 7712302 A FR7712302 A FR 7712302A FR 2349255 A1 FR2349255 A1 FR 2349255A1
Authority
FR
France
Prior art keywords
metallisation
mask
circuit board
sandblasted
conducting paths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7712302A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Wise Inc
Original Assignee
Circuit Wise Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Wise Inc filed Critical Circuit Wise Inc
Publication of FR2349255A1 publication Critical patent/FR2349255A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
FR7712302A 1976-04-22 1977-04-22 Plaquette de circuit et son procede de fabrication Withdrawn FR2349255A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US67935276A 1976-04-22 1976-04-22

Publications (1)

Publication Number Publication Date
FR2349255A1 true FR2349255A1 (fr) 1977-11-18

Family

ID=24726584

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7712302A Withdrawn FR2349255A1 (fr) 1976-04-22 1977-04-22 Plaquette de circuit et son procede de fabrication

Country Status (5)

Country Link
JP (1) JPS52151866A (de)
CA (1) CA1075825A (de)
DE (1) DE2715875A1 (de)
FR (1) FR2349255A1 (de)
IT (1) IT1086737B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361193A2 (de) * 1988-09-30 1990-04-04 Siemens Aktiengesellschaft Leiterplatte mit einem spritzgegossenen Substrat

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823496A (ja) * 1981-08-04 1983-02-12 日本電気株式会社 プラスチツク筐体への電気回路パタ−ン形成方法
JPS5854693A (ja) * 1981-09-29 1983-03-31 セイコー京葉工業株式会社 回路基板及び製造法
JPS58186994A (ja) * 1982-04-23 1983-11-01 三菱電機株式会社 印刷配線板の製造方法
JPS58186993A (ja) * 1982-04-23 1983-11-01 三菱電機株式会社 印刷配線板の製造方法
US4604799A (en) * 1982-09-03 1986-08-12 John Fluke Mfg. Co., Inc. Method of making molded circuit board
US4597177A (en) * 1984-01-03 1986-07-01 International Business Machines Corporation Fabricating contacts for flexible module carriers
DE58903799D1 (de) * 1988-09-30 1993-04-22 Siemens Ag Leiterplatte mit einem spritzgegossenen substrat.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0361193A2 (de) * 1988-09-30 1990-04-04 Siemens Aktiengesellschaft Leiterplatte mit einem spritzgegossenen Substrat
EP0361193A3 (en) * 1988-09-30 1990-06-27 Siemens Aktiengesellschaft Circuit board with an injection-moulded substrate

Also Published As

Publication number Publication date
CA1075825A (en) 1980-04-15
IT1086737B (it) 1985-05-31
JPS52151866A (en) 1977-12-16
DE2715875A1 (de) 1977-11-10

Similar Documents

Publication Publication Date Title
ES381986A1 (es) Metodo para formar una pelicula compuesta sobre un sustrato.
FR2349255A1 (fr) Plaquette de circuit et son procede de fabrication
JPS5681694A (en) Manufacture of porous copper thin film
JPS5359739A (en) Electrostatic powder coating and its equipment
GB2017416A (en) Circuit board manufacturing method
JPS563690A (en) High speed through-hole plating method
JPS5322365A (en) Resin mold type semiconductor device and its production
JPS53124130A (en) Manufacture of amorphous alloy
JPS56129349A (en) Method of manufacturing airtight terminal
JPS5264285A (en) Production of compositemetal layer of integrated circuit device
JPS5748895A (en) Diaphragm plate for entire surface drive type speaker
GB1337338A (en) Process for making printed circuit boards and products obtained by said process
JPS53142337A (en) Manufacture of copper through hole plate
JPS53146936A (en) Insulator plating method
JPS5417977A (en) Method of plating polyurethane foam
GB1536772A (en) Selectively solder-plated printed circuit boards
JPS53119228A (en) Production of perforated plated metal foil
JPS5742735A (en) Production of synthetic resin molded article
JPS5219297A (en) Method of manufacturing a metal film resistor
JPS5387849A (en) Preparation of electroforming matrix for use in the production of outerblade of electric razor
JPS5561030A (en) Preparation of mask
JPS5380161A (en) Electrode formation of semiconductor
JPS52144078A (en) Laminates
JPS55154555A (en) Plating method for ferrite magnet
JPS54160526A (en) Manufacture of printing distributing board embedded with metal core having contact plug

Legal Events

Date Code Title Description
ST Notification of lapse