FR2348575A1 - Procede de montage d'un composant semi-conducteur actif sur un support dissipatif pour utilisation en hyperfrequence et dispositifs obtenus par ledit procede - Google Patents

Procede de montage d'un composant semi-conducteur actif sur un support dissipatif pour utilisation en hyperfrequence et dispositifs obtenus par ledit procede

Info

Publication number
FR2348575A1
FR2348575A1 FR7611441A FR7611441A FR2348575A1 FR 2348575 A1 FR2348575 A1 FR 2348575A1 FR 7611441 A FR7611441 A FR 7611441A FR 7611441 A FR7611441 A FR 7611441A FR 2348575 A1 FR2348575 A1 FR 2348575A1
Authority
FR
France
Prior art keywords
support
slice
hyperfrequency
mounting
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7611441A
Other languages
English (en)
French (fr)
Other versions
FR2348575B1 (show.php
Inventor
Antoine Guillemin
Georges Maze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7611441A priority Critical patent/FR2348575A1/fr
Publication of FR2348575A1 publication Critical patent/FR2348575A1/fr
Application granted granted Critical
Publication of FR2348575B1 publication Critical patent/FR2348575B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H10P50/691—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12043—Photo diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
FR7611441A 1976-04-16 1976-04-16 Procede de montage d'un composant semi-conducteur actif sur un support dissipatif pour utilisation en hyperfrequence et dispositifs obtenus par ledit procede Granted FR2348575A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7611441A FR2348575A1 (fr) 1976-04-16 1976-04-16 Procede de montage d'un composant semi-conducteur actif sur un support dissipatif pour utilisation en hyperfrequence et dispositifs obtenus par ledit procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7611441A FR2348575A1 (fr) 1976-04-16 1976-04-16 Procede de montage d'un composant semi-conducteur actif sur un support dissipatif pour utilisation en hyperfrequence et dispositifs obtenus par ledit procede

Publications (2)

Publication Number Publication Date
FR2348575A1 true FR2348575A1 (fr) 1977-11-10
FR2348575B1 FR2348575B1 (show.php) 1978-08-25

Family

ID=9171986

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7611441A Granted FR2348575A1 (fr) 1976-04-16 1976-04-16 Procede de montage d'un composant semi-conducteur actif sur un support dissipatif pour utilisation en hyperfrequence et dispositifs obtenus par ledit procede

Country Status (1)

Country Link
FR (1) FR2348575A1 (show.php)

Also Published As

Publication number Publication date
FR2348575B1 (show.php) 1978-08-25

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Legal Events

Date Code Title Description
CL Concession to grant licences
ST Notification of lapse