FR2335955A1 - Composant a semiconducteurs de puissance a disques scelles - Google Patents

Composant a semiconducteurs de puissance a disques scelles

Info

Publication number
FR2335955A1
FR2335955A1 FR7637772A FR7637772A FR2335955A1 FR 2335955 A1 FR2335955 A1 FR 2335955A1 FR 7637772 A FR7637772 A FR 7637772A FR 7637772 A FR7637772 A FR 7637772A FR 2335955 A1 FR2335955 A1 FR 2335955A1
Authority
FR
France
Prior art keywords
sealed
power semiconductor
semiconductor component
disc power
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7637772A
Other languages
English (en)
Other versions
FR2335955B3 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2335955A1 publication Critical patent/FR2335955A1/fr
Application granted granted Critical
Publication of FR2335955B3 publication Critical patent/FR2335955B3/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
FR7637772A 1975-12-17 1976-12-15 Composant a semiconducteurs de puissance a disques scelles Granted FR2335955A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752556749 DE2556749A1 (de) 1975-12-17 1975-12-17 Leistungshalbleiterbauelement in scheibenzellenbauweise

Publications (2)

Publication Number Publication Date
FR2335955A1 true FR2335955A1 (fr) 1977-07-15
FR2335955B3 FR2335955B3 (fr) 1979-08-24

Family

ID=5964590

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7637772A Granted FR2335955A1 (fr) 1975-12-17 1976-12-15 Composant a semiconducteurs de puissance a disques scelles

Country Status (5)

Country Link
US (1) US4141030A (fr)
JP (1) JPS5938734B2 (fr)
DE (1) DE2556749A1 (fr)
FR (1) FR2335955A1 (fr)
GB (1) GB1526510A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980000116A1 (fr) * 1978-06-12 1980-01-24 Bbc Brown Boveri & Cie Element semi-conducteur de montage avec enveloppe isolante
WO1980000642A1 (fr) * 1978-09-16 1980-04-03 Bbc Brown Boveri & Cie Dispositif semi-conducteur
EP0017978A1 (fr) * 1979-04-19 1980-10-29 Siemens Aktiengesellschaft Composant semiconducteur muni d'un boîtier en forme de disque

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160992A (en) * 1977-09-14 1979-07-10 Raytheon Company Plural semiconductor devices mounted between plural heat sinks
US4274106A (en) * 1977-11-07 1981-06-16 Mitsubishi Denki Kabushiki Kaisha Explosion proof vibration resistant flat package semiconductor device
JPS5929143B2 (ja) * 1978-01-07 1984-07-18 株式会社東芝 電力用半導体装置
US4402004A (en) * 1978-01-07 1983-08-30 Tokyo Shibaura Denki Kabushiki Kaisha High current press pack semiconductor device having a mesa structure
DE2840400C2 (de) * 1978-09-16 1982-04-08 Brown, Boveri & Cie Ag, 6800 Mannheim Steuerbares Leistungs-Halbleiterbauelement
JPS57180137A (en) * 1981-04-30 1982-11-06 Hitachi Ltd Semicondudtor device
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
JPS59134876A (ja) * 1983-01-20 1984-08-02 Mitsubishi Electric Corp 半導体装置
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
EP0346061A3 (fr) * 1988-06-08 1991-04-03 Fujitsu Limited Dispositif à circuit intégré comprenant une structure d'empaquetage
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5227663A (en) * 1989-12-19 1993-07-13 Lsi Logic Corporation Integral dam and heat sink for semiconductor device assembly
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
DE4110318C2 (de) * 1991-03-28 2001-10-11 Bosch Gmbh Robert Verfahren zum Zusammenlöten zweier Bauteile
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5514327A (en) * 1993-12-14 1996-05-07 Lsi Logic Corporation Powder metal heat sink for integrated circuit devices
US5693981A (en) * 1993-12-14 1997-12-02 Lsi Logic Corporation Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system
SE506348C2 (sv) * 1996-04-01 1997-12-08 Tetra Laval Holdings & Finance Förpackningsmaterialbana för en självbärande förpackningsbehållarvägg jämte av banan tillverkad förpackningsbehållare
JP2000091485A (ja) 1998-07-14 2000-03-31 Denso Corp 半導体装置
US6072240A (en) 1998-10-16 2000-06-06 Denso Corporation Semiconductor chip package
JP4085536B2 (ja) 1998-11-09 2008-05-14 株式会社日本自動車部品総合研究所 電気機器およびその製造方法並びに圧接型半導体装置
US6191023B1 (en) * 1999-11-18 2001-02-20 Taiwan Semiconductor Manufacturing Company Method of improving copper pad adhesion
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
JP4479121B2 (ja) 2001-04-25 2010-06-09 株式会社デンソー 半導体装置の製造方法
US7145254B2 (en) * 2001-07-26 2006-12-05 Denso Corporation Transfer-molded power device and method for manufacturing transfer-molded power device
EP2533275A4 (fr) * 2010-02-01 2016-12-21 Toyota Motor Co Ltd Procédé de fabrication d'un dispositif à semi-conducteurs et dispositif à semi-conducteurs
JP5126278B2 (ja) * 2010-02-04 2013-01-23 株式会社デンソー 半導体装置およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293508A (en) * 1964-04-21 1966-12-20 Int Rectifier Corp Compression connected semiconductor device
US3581163A (en) * 1968-04-09 1971-05-25 Gen Electric High-current semiconductor rectifier assemblies
DE1789005A1 (de) * 1968-09-20 1972-01-20 Siemens Ag Eingekapseltes Halbleiterbauelement mit wenigstens teilweise aus Sintermetall und Kunststoff bestehenden Bauteilen
US3800192A (en) * 1970-08-11 1974-03-26 O Schaerli Semiconductor circuit element with pressure contact means
US3885243A (en) * 1971-06-25 1975-05-20 Bbc Brown Boveri & Cie Semiconductor device
US3852803A (en) * 1973-06-18 1974-12-03 Gen Electric Heat sink cooled power semiconductor device assembly having liquid metal interface

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1980000116A1 (fr) * 1978-06-12 1980-01-24 Bbc Brown Boveri & Cie Element semi-conducteur de montage avec enveloppe isolante
WO1980000642A1 (fr) * 1978-09-16 1980-04-03 Bbc Brown Boveri & Cie Dispositif semi-conducteur
EP0017978A1 (fr) * 1979-04-19 1980-10-29 Siemens Aktiengesellschaft Composant semiconducteur muni d'un boîtier en forme de disque

Also Published As

Publication number Publication date
US4141030A (en) 1979-02-20
FR2335955B3 (fr) 1979-08-24
JPS5279660A (en) 1977-07-04
GB1526510A (en) 1978-09-27
JPS5938734B2 (ja) 1984-09-19
DE2556749A1 (de) 1977-06-23

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