FR2324707A1 - Solution d'attaque et procede de gravure de pellicules ou feuilles en matiere polymere a base de polyimide - Google Patents

Solution d'attaque et procede de gravure de pellicules ou feuilles en matiere polymere a base de polyimide

Info

Publication number
FR2324707A1
FR2324707A1 FR7623077A FR7623077A FR2324707A1 FR 2324707 A1 FR2324707 A1 FR 2324707A1 FR 7623077 A FR7623077 A FR 7623077A FR 7623077 A FR7623077 A FR 7623077A FR 2324707 A1 FR2324707 A1 FR 2324707A1
Authority
FR
France
Prior art keywords
polyimide
sheets
polymer material
material based
attack solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7623077A
Other languages
English (en)
French (fr)
Other versions
FR2324707B1 (US06650917-20031118-M00005.png
Inventor
Friedrich Brunner
Peter Frasch
Friedrich Schwerdt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2324707A1 publication Critical patent/FR2324707A1/fr
Application granted granted Critical
Publication of FR2324707B1 publication Critical patent/FR2324707B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
FR7623077A 1975-09-18 1976-07-20 Solution d'attaque et procede de gravure de pellicules ou feuilles en matiere polymere a base de polyimide Granted FR2324707A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2541624A DE2541624C2 (de) 1975-09-18 1975-09-18 Wässrige Ätzlösung und Verfahren zum Ätzen von Polymerfilmen oder Folien auf Polyimidbasis

Publications (2)

Publication Number Publication Date
FR2324707A1 true FR2324707A1 (fr) 1977-04-15
FR2324707B1 FR2324707B1 (US06650917-20031118-M00005.png) 1979-09-28

Family

ID=5956791

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7623077A Granted FR2324707A1 (fr) 1975-09-18 1976-07-20 Solution d'attaque et procede de gravure de pellicules ou feuilles en matiere polymere a base de polyimide

Country Status (4)

Country Link
US (1) US4039371A (US06650917-20031118-M00005.png)
JP (1) JPS598293B2 (US06650917-20031118-M00005.png)
DE (1) DE2541624C2 (US06650917-20031118-M00005.png)
FR (1) FR2324707A1 (US06650917-20031118-M00005.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0251347A1 (en) * 1986-04-23 1988-01-07 Koninklijke Philips Electronics N.V. Method of covering a device with a first layer of silicon nitride and with a second layer of a polyimide, and device covered by means of the method
EP0351622A2 (en) * 1988-07-13 1990-01-24 International Business Machines Corporation Wet etching of cured polyimide

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6747339B1 (en) * 1978-11-20 2004-06-08 Hitachi, Ltd. Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate
US5391915A (en) * 1978-11-20 1995-02-21 Hatachi, Ltd. Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate
US4369090A (en) * 1980-11-06 1983-01-18 Texas Instruments Incorporated Process for etching sloped vias in polyimide insulators
US4411735A (en) * 1982-05-06 1983-10-25 National Semiconductor Corporation Polymeric insulation layer etching process and composition
JPS60152294A (ja) * 1984-01-20 1985-08-10 Fuji Electric Co Ltd インバ−タの復電時処理方式
US4693780A (en) * 1985-02-22 1987-09-15 Siemens Aktiengesellschaft Electrical isolation and leveling of patterned surfaces
JPS61207183A (ja) * 1985-03-08 1986-09-13 Daikin Ind Ltd 空気調和機のインバ−タ保護装置
JPS6298496U (US06650917-20031118-M00005.png) * 1985-12-12 1987-06-23
DE3728348A1 (de) * 1987-08-25 1989-03-09 Siemens Ag Mehrlagenverdrahtung fuer hoechstintegrierte halbleiterbauelemente
JPH02144987A (ja) * 1988-11-26 1990-06-04 Sumitomo Metal Mining Co Ltd プリント配線板の製造方法
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5981454A (en) * 1993-06-21 1999-11-09 Ekc Technology, Inc. Post clean treatment composition comprising an organic acid and hydroxylamine
US6546939B1 (en) 1990-11-05 2003-04-15 Ekc Technology, Inc. Post clean treatment
US5227008A (en) * 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
DE4210486C1 (US06650917-20031118-M00005.png) * 1992-03-31 1993-05-06 Gesellschaft Fuer Schwerionenforschung Mbh, 6100 Darmstadt, De
US5348627A (en) * 1993-05-12 1994-09-20 Georgia Tech Reserach Corporation Process and system for the photoelectrochemical etching of silicon in an anhydrous environment
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
KR100372995B1 (ko) * 1994-05-24 2003-03-31 히다치 가세고교 가부시끼가이샤 반도체기판위에목적하는패턴의수지막을형성하는방법,반도체칩,반도체패키지,및레지스트상박리액
KR100360394B1 (ko) * 1995-12-20 2003-01-24 삼성전자 주식회사 반도체기판의세정방법및이에사용되는세정액
US6372415B1 (en) * 1997-10-30 2002-04-16 Kao Corporation Resist developer
US6100343A (en) * 1998-11-03 2000-08-08 Beholz Technology, L.L.C. Process for producing paintable polymeric articles
US6211468B1 (en) 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
TWI221946B (en) 1999-01-07 2004-10-11 Kao Corp Resist developer
US6177357B1 (en) 1999-04-30 2001-01-23 3M Innovative Properties Company Method for making flexible circuits
US6277799B1 (en) * 1999-06-25 2001-08-21 International Business Machines Corporation Aqueous cleaning of paste residue
US6653265B2 (en) * 2001-06-20 2003-11-25 Cornell Research Foundation, Inc. Removable marking system
US9245804B2 (en) 2012-10-23 2016-01-26 Nxp B.V. Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP)
US20140110826A1 (en) * 2012-10-23 2014-04-24 Nxp B.V. Backside protection for a wafer-level chip scale package (wlcsp)
JP6895600B2 (ja) * 2014-02-25 2021-06-30 東京エレクトロン株式会社 現像可能な底部反射防止コーティングおよび着色インプラントレジストのための化学増幅方法および技術
TWI808618B (zh) * 2022-01-20 2023-07-11 大陸商廣東則成科技有限公司 用於嵌入式晶片的封裝製程

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2374213A (en) * 1945-04-24 Cleansing compositions
DE1769778A1 (de) * 1968-07-11 1971-12-30 Degussa Verfahren zur Vorbehandlung von Kunststoffen zum Zwecke der haftfesten Metallisierung
DE1922047C3 (de) * 1969-04-30 1978-03-30 Henkel Kgaa, 4000 Duesseldorf Nachspülmittel für gewaschene Wäsche
US3770528A (en) * 1971-09-29 1973-11-06 Martin Processing Co Inc Method for the surface treatment of polyimide materials
DE2216085A1 (de) * 1972-04-01 1973-10-11 Staff & Schwarz Gmbh Verbindungsvorrichtung fuer stromverteilerschienen
US3773463A (en) * 1972-04-18 1973-11-20 Sybron Corp Lubricating, antistat and dye leveling agent and process for textile materials
US3958059A (en) * 1973-10-01 1976-05-18 The Procter & Gamble Company Fabric treatment composition
US3871930A (en) * 1973-12-19 1975-03-18 Texas Instruments Inc Method of etching films made of polyimide based polymers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE US "IBM TECHNICAL DISCLOSURE BULLETIN", VOL. 15, NO. 9, FEVRIER 1973 "POLYMER PASSIVATION OF INTEGRATED CIRCUITS" PAR R.J. CLARK ET AL.) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0251347A1 (en) * 1986-04-23 1988-01-07 Koninklijke Philips Electronics N.V. Method of covering a device with a first layer of silicon nitride and with a second layer of a polyimide, and device covered by means of the method
EP0351622A2 (en) * 1988-07-13 1990-01-24 International Business Machines Corporation Wet etching of cured polyimide
EP0351622A3 (en) * 1988-07-13 1990-06-27 International Business Machines Corporation Wet etching of cured polyimide

Also Published As

Publication number Publication date
FR2324707B1 (US06650917-20031118-M00005.png) 1979-09-28
JPS598293B2 (ja) 1984-02-23
DE2541624A1 (de) 1977-03-24
DE2541624C2 (de) 1982-09-16
JPS5259678A (en) 1977-05-17
US4039371A (en) 1977-08-02

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Legal Events

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ST Notification of lapse