FR2309878A1 - Procede de mesure des etats de surface dans des structures metal-isolation-semi-conducteur et dispositif en resultant - Google Patents
Procede de mesure des etats de surface dans des structures metal-isolation-semi-conducteur et dispositif en resultantInfo
- Publication number
- FR2309878A1 FR2309878A1 FR7606745A FR7606745A FR2309878A1 FR 2309878 A1 FR2309878 A1 FR 2309878A1 FR 7606745 A FR7606745 A FR 7606745A FR 7606745 A FR7606745 A FR 7606745A FR 2309878 A1 FR2309878 A1 FR 2309878A1
- Authority
- FR
- France
- Prior art keywords
- insulation
- semi
- metal
- conductive structures
- measuring surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2637—Circuits therefor for testing other individual devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/572,237 US3995216A (en) | 1975-04-28 | 1975-04-28 | Technique for measuring surface states in metal-insulator-semiconductor structures |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2309878A1 true FR2309878A1 (fr) | 1976-11-26 |
FR2309878B1 FR2309878B1 (fr) | 1979-02-02 |
Family
ID=24286937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7606745A Granted FR2309878A1 (fr) | 1975-04-28 | 1976-03-02 | Procede de mesure des etats de surface dans des structures metal-isolation-semi-conducteur et dispositif en resultant |
Country Status (5)
Country | Link |
---|---|
US (1) | US3995216A (fr) |
JP (1) | JPS5851228B2 (fr) |
DE (1) | DE2615757A1 (fr) |
FR (1) | FR2309878A1 (fr) |
GB (1) | GB1520961A (fr) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4168432A (en) * | 1978-01-16 | 1979-09-18 | Rca Corporation | Method of testing radiation hardness of a semiconductor device |
US4218143A (en) * | 1979-01-22 | 1980-08-19 | The United States Of America As Represented By The Secretary Of The Navy | Lattice matching measurement device |
US4325025A (en) * | 1980-05-22 | 1982-04-13 | International Business Machines Corporation | Automated channel doping measuring circuit |
US4509012A (en) * | 1982-12-30 | 1985-04-02 | Lin Shi Tron | Method for determining the characteristic behavior of a metal-insulator-semiconductor device in a deep depletion mode |
EP0196804B1 (fr) * | 1985-03-11 | 1991-01-23 | Nippon Telegraph And Telephone Corporation | Méthode et appareil pour tester un dispositif électronique intégré |
US4758786A (en) * | 1986-08-06 | 1988-07-19 | Molecular Devices Corporation | Method of analyzing semiconductor systems |
US4812756A (en) * | 1987-08-26 | 1989-03-14 | International Business Machines Corporation | Contactless technique for semicondutor wafer testing |
JP2886176B2 (ja) * | 1989-03-23 | 1999-04-26 | 三菱電機株式会社 | 埋め込みチャネルの物性特性測定法 |
US4942357A (en) * | 1989-08-07 | 1990-07-17 | Eastman Kodak Company | Method of testing a charge-coupled device |
US4978915A (en) * | 1989-11-07 | 1990-12-18 | At&T Bell Laboratories | Method of manufacturing semiconductor devices involving the detection of impurities |
US5023561A (en) * | 1990-05-04 | 1991-06-11 | Solid State Measurements, Inc. | Apparatus and method for non-invasive measurement of electrical properties of a dielectric layer in a semiconductor wafer |
US5216362A (en) * | 1991-10-08 | 1993-06-01 | International Business Machines Corporation | Contactless technique for measuring epitaxial dopant concentration profiles in semiconductor wafers |
JPH06349920A (ja) * | 1993-06-08 | 1994-12-22 | Dainippon Screen Mfg Co Ltd | 半導体ウェハの電荷量測定方法 |
US5500607A (en) * | 1993-12-22 | 1996-03-19 | International Business Machines Corporation | Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer |
KR960026519A (ko) * | 1994-12-31 | 1996-07-22 | 김주용 | 유전체에 대한 신뢰성 측정 방법 |
JP3688467B2 (ja) * | 1997-08-20 | 2005-08-31 | 大日本スクリーン製造株式会社 | 不純物量測定方法および装置 |
US5945832A (en) * | 1998-02-17 | 1999-08-31 | Motorola, Inc. | Structure and method of measuring electrical characteristics of a molecule |
US6101519A (en) * | 1998-06-17 | 2000-08-08 | International Business Machines Corporation | Method for efficiently determining a fermi-dirac integrals |
DE60029483T2 (de) | 1999-10-19 | 2007-02-15 | Solid State Measurements, Inc. | Nicht-invasive elektrische messung von halbleiterscheiben |
US6680621B2 (en) * | 2001-01-26 | 2004-01-20 | Semiconductor Diagnostics, Inc. | Steady state method for measuring the thickness and the capacitance of ultra thin dielectric in the presence of substantial leakage current |
US6597193B2 (en) * | 2001-01-26 | 2003-07-22 | Semiconductor Diagnostics, Inc. | Steady state method for measuring the thickness and the capacitance of ultra thin dielectric in the presence of substantial leakage current |
US7012438B1 (en) * | 2002-07-10 | 2006-03-14 | Kla-Tencor Technologies Corp. | Methods and systems for determining a property of an insulating film |
US7248062B1 (en) | 2002-11-04 | 2007-07-24 | Kla-Tencor Technologies Corp. | Contactless charge measurement of product wafers and control of corona generation and deposition |
US7472322B1 (en) | 2005-05-31 | 2008-12-30 | Integrated Device Technology, Inc. | On-chip interface trap characterization and monitoring |
US20070109003A1 (en) * | 2005-08-19 | 2007-05-17 | Kla-Tencor Technologies Corp. | Test Pads, Methods and Systems for Measuring Properties of a Wafer |
US7929349B2 (en) * | 2007-02-28 | 2011-04-19 | Samsung Electronics Co., Ltd. | Method of operating nonvolatile memory device |
US8018781B2 (en) * | 2007-02-28 | 2011-09-13 | Samsung Electronics, Co., Ltd. | Method of operating nonvolatile memory device |
US20080290889A1 (en) * | 2007-05-24 | 2008-11-27 | Solid State Measurements, Inc. | Method of destructive testing the dielectric layer of a semiconductor wafer or sample |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2209109A1 (fr) * | 1972-12-04 | 1974-06-28 | Ibm |
-
1975
- 1975-04-28 US US05/572,237 patent/US3995216A/en not_active Expired - Lifetime
-
1976
- 1976-03-02 FR FR7606745A patent/FR2309878A1/fr active Granted
- 1976-03-18 GB GB10950/76A patent/GB1520961A/en not_active Expired
- 1976-04-07 JP JP51038336A patent/JPS5851228B2/ja not_active Expired
- 1976-04-10 DE DE19762615757 patent/DE2615757A1/de not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2209109A1 (fr) * | 1972-12-04 | 1974-06-28 | Ibm |
Non-Patent Citations (2)
Title |
---|
ARTICLE: "DIRECT DISPLAY OF ELECTRON BACK TUNNELING IN MNOS MEMORY CAPACITORS" DE YUN) * |
REVUE US "APPLIED PHYSICS LETTERS", VOLUME 23, NO 3, 1-08-1973, PAGES 152-153 * |
Also Published As
Publication number | Publication date |
---|---|
DE2615757A1 (de) | 1976-11-11 |
FR2309878B1 (fr) | 1979-02-02 |
GB1520961A (en) | 1978-08-09 |
US3995216A (en) | 1976-11-30 |
JPS51131667A (en) | 1976-11-16 |
JPS5851228B2 (ja) | 1983-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |