FR2309039B1 - - Google Patents

Info

Publication number
FR2309039B1
FR2309039B1 FR7611730A FR7611730A FR2309039B1 FR 2309039 B1 FR2309039 B1 FR 2309039B1 FR 7611730 A FR7611730 A FR 7611730A FR 7611730 A FR7611730 A FR 7611730A FR 2309039 B1 FR2309039 B1 FR 2309039B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7611730A
Other versions
FR2309039A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of FR2309039A1 publication Critical patent/FR2309039A1/fr
Application granted granted Critical
Publication of FR2309039B1 publication Critical patent/FR2309039B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Recrystallisation Techniques (AREA)
  • Element Separation (AREA)
FR7611730A 1975-04-21 1976-04-21 Dispositif semi-conducteur et procede pour realiser dans celui-ci une couche semi-isolante en silicium Granted FR2309039A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50048379A JPS51123562A (en) 1975-04-21 1975-04-21 Production method of semiconductor device

Publications (2)

Publication Number Publication Date
FR2309039A1 FR2309039A1 (fr) 1976-11-19
FR2309039B1 true FR2309039B1 (fr) 1980-05-09

Family

ID=12801674

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7611730A Granted FR2309039A1 (fr) 1975-04-21 1976-04-21 Dispositif semi-conducteur et procede pour realiser dans celui-ci une couche semi-isolante en silicium

Country Status (7)

Country Link
US (1) US4081292A (fr)
JP (1) JPS51123562A (fr)
CA (1) CA1059241A (fr)
DE (1) DE2617398A1 (fr)
FR (1) FR2309039A1 (fr)
GB (1) GB1532456A (fr)
NL (1) NL7604238A (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2627855A1 (de) * 1976-06-22 1977-12-29 Siemens Ag Halbleiterbauelement mit wenigstens zwei, einen pn-uebergang bildenden zonen unterschiedlichen leitungstyps sowie verfahren zu dessen herstellung
US4178191A (en) * 1978-08-10 1979-12-11 Rca Corp. Process of making a planar MOS silicon-on-insulating substrate device
US4197144A (en) * 1978-09-21 1980-04-08 General Electric Company Method for improving writing of information in memory targets
US4420765A (en) * 1981-05-29 1983-12-13 Rca Corporation Multi-layer passivant system
DE3138960A1 (de) * 1981-09-30 1983-04-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zur erzeugung elektrisch leitender schichten
JPS58101439A (ja) * 1981-12-12 1983-06-16 Toshiba Corp 半導体装置の製造方法
JPS5935425A (ja) * 1982-08-23 1984-02-27 Toshiba Corp 半導体装置の製造方法
US4679308A (en) * 1984-12-14 1987-07-14 Honeywell Inc. Process for controlling mobile ion contamination in semiconductor devices
JPH0640577B2 (ja) * 1985-05-27 1994-05-25 沖電気工業株式会社 半導体装置の製造方法
US4634473A (en) * 1985-09-09 1987-01-06 Rca Corporation Method for fabricating a radiation hardened oxide having structural damage
JPH0750693B2 (ja) * 1985-12-02 1995-05-31 日本テキサス・インスツルメンツ株式会社 酸化シリコン膜の製造方法
US4732867A (en) * 1986-11-03 1988-03-22 General Electric Company Method of forming alignment marks in sapphire
US5591661A (en) * 1992-04-07 1997-01-07 Shiota; Philip Method for fabricating devices for electrostatic discharge protection and voltage references, and the resulting structures
JPH0786515A (ja) * 1993-09-16 1995-03-31 Nec Corp ポリシリコン抵抗体の形成方法
US5882961A (en) * 1995-09-11 1999-03-16 Motorola, Inc. Method of manufacturing semiconductor device with reduced charge trapping
US5672522A (en) * 1996-03-05 1997-09-30 Trw Inc. Method for making selective subcollector heterojunction bipolar transistors
US5677562A (en) * 1996-05-14 1997-10-14 General Instrument Corporation Of Delaware Planar P-N junction semiconductor structure with multilayer passivation
SE509780C2 (sv) * 1997-07-04 1999-03-08 Ericsson Telefon Ab L M Bipolär effekttransistor och framställningsförfarande
JP5195186B2 (ja) * 2008-09-05 2013-05-08 三菱電機株式会社 半導体装置の製造方法
CN105097570B (zh) * 2014-05-21 2017-12-19 北大方正集团有限公司 钝化层制造方法及高压半导体功率器件
KR20220047028A (ko) 2020-10-08 2022-04-15 삼성전자주식회사 집적회로 장치 및 그 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533857A (en) * 1967-11-29 1970-10-13 Hughes Aircraft Co Method of restoring crystals damaged by irradiation
US3897274A (en) * 1971-06-01 1975-07-29 Texas Instruments Inc Method of fabricating dielectrically isolated semiconductor structures
CH549285A (de) * 1972-12-14 1974-05-15 Ibm Verfahren zum herstellen amorpher halbleiterschichten.
US3871067A (en) * 1973-06-29 1975-03-18 Ibm Method of manufacturing a semiconductor device
US3900345A (en) * 1973-08-02 1975-08-19 Motorola Inc Thin low temperature epi regions by conversion of an amorphous layer
JPS532552B2 (fr) * 1974-03-30 1978-01-28

Also Published As

Publication number Publication date
FR2309039A1 (fr) 1976-11-19
DE2617398A1 (de) 1976-11-04
US4081292A (en) 1978-03-28
GB1532456A (en) 1978-11-15
CA1059241A (fr) 1979-07-24
NL7604238A (nl) 1976-10-25
JPS51123562A (en) 1976-10-28

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Legal Events

Date Code Title Description
ST Notification of lapse