FR2307050B1 - - Google Patents

Info

Publication number
FR2307050B1
FR2307050B1 FR7610257A FR7610257A FR2307050B1 FR 2307050 B1 FR2307050 B1 FR 2307050B1 FR 7610257 A FR7610257 A FR 7610257A FR 7610257 A FR7610257 A FR 7610257A FR 2307050 B1 FR2307050 B1 FR 2307050B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7610257A
Other languages
French (fr)
Other versions
FR2307050A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of FR2307050A1 publication Critical patent/FR2307050A1/fr
Application granted granted Critical
Publication of FR2307050B1 publication Critical patent/FR2307050B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR7610257A 1975-04-08 1976-04-08 Procede de preparation de charges catalytiques pour la metallisation non galvanique Granted FR2307050A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/566,611 US4287253A (en) 1975-04-08 1975-04-08 Catalytic filler for electroless metallization of hole walls

Publications (2)

Publication Number Publication Date
FR2307050A1 FR2307050A1 (fr) 1976-11-05
FR2307050B1 true FR2307050B1 (de) 1979-10-05

Family

ID=24263612

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7610257A Granted FR2307050A1 (fr) 1975-04-08 1976-04-08 Procede de preparation de charges catalytiques pour la metallisation non galvanique

Country Status (13)

Country Link
US (1) US4287253A (de)
JP (1) JPS51123729A (de)
AT (1) AT340738B (de)
AU (1) AU500576B2 (de)
CA (1) CA1067879A (de)
CH (1) CH616454A5 (de)
DE (1) DE2613637C3 (de)
FR (1) FR2307050A1 (de)
GB (1) GB1508518A (de)
IT (1) IT1059409B (de)
NL (1) NL183594C (de)
SE (1) SE7603946L (de)
ZA (1) ZA7645B (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450188A (en) * 1980-04-18 1984-05-22 Shinroku Kawasumi Process for the preparation of precious metal-coated particles
JPS57500568A (de) * 1980-05-12 1982-04-01
DK148327C (da) * 1981-07-24 1985-11-04 Neselco As Pulver til brug ved toer sensibilisering for stroemloes metallisering
DE3130159C2 (de) * 1981-07-30 1987-02-05 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Verfahren zur Herstellung von Leiterplatten
DK153572C (da) * 1982-02-18 1988-12-19 Platonec Aps Pulver til brug ved toer aktivering for stroemloes metallisering, fremgangsmaade til fremstilling deraf samt anvendelse deraf
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
DE3407468A1 (de) * 1984-02-29 1985-08-29 Siemens AG, 1000 Berlin und 8000 München Kunststoffe mit magnetischer abschirmwirkung
US5100714A (en) * 1986-07-24 1992-03-31 Ceramic Packaging, Inc. Metallized ceramic substrate and method therefor
US4859571A (en) * 1986-12-30 1989-08-22 E. I. Du Pont De Nemours And Company Embedded catalyst receptors for metallization of dielectrics
US4737446A (en) * 1986-12-30 1988-04-12 E. I. Du Pont De Nemours And Company Method for making multilayer circuits using embedded catalyst receptors
US4872844A (en) * 1988-07-08 1989-10-10 Amp Incorporated Component-carrying adapter for chip carrier socket
US4871319A (en) * 1988-12-21 1989-10-03 Amp Incorporated Molded circuit board for ribbon cable connector
US5013248A (en) * 1989-09-19 1991-05-07 Amp Incorporated Multicircuit connector assembly
US5002493A (en) * 1989-09-19 1991-03-26 Amp Incorporated Panel mounted electronic assembly
JPH0363295U (de) * 1989-10-18 1991-06-20
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
EP0460548A3 (en) * 1990-06-08 1993-03-24 Amp-Akzo Corporation Printed circuits and base materials precatalyzed for etal deposition
US5264065A (en) * 1990-06-08 1993-11-23 Amp-Akzo Corporation Printed circuits and base materials having low Z-axis thermal expansion
JPH0760821B2 (ja) * 1991-05-17 1995-06-28 インターナショナル・ビジネス・マシーンズ・コーポレイション ポリマー基材の状態調整方法
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
US6517939B1 (en) 1999-09-03 2003-02-11 Engelhard Corporation Noble metal coated substrate pigments
FR2846205B1 (fr) * 2002-10-29 2005-03-11 Oreal Dispositif de conditionnement et d'application comportant un corps contenant des particules
BRPI0612722A2 (pt) * 2005-07-04 2010-11-30 Sued Chemie Ag lamas ou suspensão de silicato estratificado com elevado teor em sólidos, processo para a sua preparação e uso das mesmas
US8172627B2 (en) * 2008-12-03 2012-05-08 Tyco Electronics Corporation Electrical connector with plated plug and receptacle
US9398703B2 (en) 2014-05-19 2016-07-19 Sierra Circuits, Inc. Via in a printed circuit board
US20160278206A1 (en) * 2014-05-19 2016-09-22 Sierra Circuits, Inc. Printed circuit board
US9631279B2 (en) * 2014-05-19 2017-04-25 Sierra Circuits, Inc. Methods for forming embedded traces
US9706667B2 (en) 2014-05-19 2017-07-11 Sierra Circuits, Inc. Via in a printed circuit board
US10573610B2 (en) * 2014-05-19 2020-02-25 Catlam, Llc Method for wafer level packaging
US9380700B2 (en) * 2014-05-19 2016-06-28 Sierra Circuits, Inc. Method for forming traces of a printed circuit board
TWI686115B (zh) * 2014-06-05 2020-02-21 美商凱特聯有限責任公司 嵌入跡線
US9706650B1 (en) * 2016-08-18 2017-07-11 Sierra Circuits, Inc. Catalytic laminate apparatus and method
US10849233B2 (en) 2017-07-10 2020-11-24 Catlam, Llc Process for forming traces on a catalytic laminate
WO2018089798A1 (en) * 2016-11-12 2018-05-17 Sierra Circuits, Inc. Integrated circuit wafer integration with catalytic laminate or adhesive
US9922951B1 (en) 2016-11-12 2018-03-20 Sierra Circuits, Inc. Integrated circuit wafer integration with catalytic laminate or adhesive
US10349520B2 (en) 2017-06-28 2019-07-09 Catlam, Llc Multi-layer circuit board using interposer layer and conductive paste
US10765012B2 (en) 2017-07-10 2020-09-01 Catlam, Llc Process for printed circuit boards using backing foil
US10827624B2 (en) 2018-03-05 2020-11-03 Catlam, Llc Catalytic laminate with conductive traces formed during lamination

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2690402A (en) * 1952-04-01 1954-09-28 Gen Am Transport Processes of chemical nickel plating of nonmetallic bodies
IT567854A (de) * 1956-04-11
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor
US3318711A (en) * 1964-04-02 1967-05-09 Sel Rex Corp Immersion plating process for the deposition of copper
US3399268A (en) * 1966-06-07 1968-08-27 Photocircuits Corp Chemical metallization and products produced thereby
US3600330A (en) * 1967-01-03 1971-08-17 Photocircuits Division Of Koli Metallization of insulating substrates
DE1615961A1 (de) * 1967-04-12 1970-06-25 Degussa Verfahren zur Herstellung von gedruckten Schaltungen
US3628999A (en) * 1970-03-05 1971-12-21 Frederick W Schneble Jr Plated through hole printed circuit boards
US3635761A (en) * 1970-05-05 1972-01-18 Mobil Oil Corp Electroless deposition of metals
DE2111136A1 (de) * 1971-03-09 1972-09-28 Kalle Ag Verfahren zur Herstellung von metallisierten Formkoerpern aus makromolekularem Material
US3928663A (en) * 1974-04-01 1975-12-23 Amp Inc Modified hectorite for electroless plating

Also Published As

Publication number Publication date
DE2613637C3 (de) 1979-03-08
NL7603624A (nl) 1976-10-12
AU500576B2 (en) 1979-05-24
JPS51123729A (en) 1976-10-28
NL183594B (nl) 1988-07-01
ZA7645B (en) 1976-12-29
DE2613637B2 (de) 1978-07-20
CH616454A5 (de) 1980-03-31
IT1059409B (it) 1982-05-31
AT340738B (de) 1977-12-27
US4287253A (en) 1981-09-01
DE2613637A1 (de) 1976-10-14
NL183594C (nl) 1988-12-01
GB1508518A (en) 1978-04-26
SE7603946L (sv) 1976-10-09
FR2307050A1 (fr) 1976-11-05
AU1077576A (en) 1977-08-11
CA1067879A (en) 1979-12-11
JPS5734344B2 (de) 1982-07-22
ATA232776A (de) 1977-04-15

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse