FR2304176A1 - Procede et dispositif de soudage par immersion de composants a semi-conducteurs - Google Patents

Procede et dispositif de soudage par immersion de composants a semi-conducteurs

Info

Publication number
FR2304176A1
FR2304176A1 FR7607283A FR7607283A FR2304176A1 FR 2304176 A1 FR2304176 A1 FR 2304176A1 FR 7607283 A FR7607283 A FR 7607283A FR 7607283 A FR7607283 A FR 7607283A FR 2304176 A1 FR2304176 A1 FR 2304176A1
Authority
FR
France
Prior art keywords
semiconductor components
immersion welding
immersion
welding
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7607283A
Other languages
English (en)
French (fr)
Other versions
FR2304176B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2304176A1 publication Critical patent/FR2304176A1/fr
Application granted granted Critical
Publication of FR2304176B1 publication Critical patent/FR2304176B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
FR7607283A 1975-03-14 1976-03-12 Procede et dispositif de soudage par immersion de composants a semi-conducteurs Granted FR2304176A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2511210A DE2511210C3 (de) 1975-03-14 1975-03-14 Verfahren und Vorrichtung zum Tauchlöten von Halbleiterbauelementen

Publications (2)

Publication Number Publication Date
FR2304176A1 true FR2304176A1 (fr) 1976-10-08
FR2304176B1 FR2304176B1 (enExample) 1979-08-24

Family

ID=5941404

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7607283A Granted FR2304176A1 (fr) 1975-03-14 1976-03-12 Procede et dispositif de soudage par immersion de composants a semi-conducteurs

Country Status (5)

Country Link
US (1) US4019671A (enExample)
JP (1) JPS51115772A (enExample)
CH (1) CH596736A5 (enExample)
DE (1) DE2511210C3 (enExample)
FR (1) FR2304176A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024223999A1 (fr) 2023-04-25 2024-10-31 Stellantis Auto Sas Procédé de commande de trains de roues d'un groupe motopropulseur d'un véhicule automobile
FR3152269A1 (fr) 2023-08-25 2025-02-28 Psa Automobiles Sa Procede de controle dynamique de trains de vehicule automobile a quatre roues motrices, moyen de controle, vehicule et programme sur la base d’un tel procede

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57169295A (en) 1981-04-10 1982-10-18 Aiwa Co Method of soldering electric part or like
JPS5731195A (en) * 1980-08-01 1982-02-19 Aiwa Co Method of soldering leadless electric part
US4475682A (en) * 1982-05-04 1984-10-09 The United States Of America As Represented By The United States Department Of Energy Process for reducing series resistance of solar cell metal contact systems with a soldering flux etchant
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
DE8622551U1 (de) * 1986-08-22 1989-09-21 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum Verlöten von elektrischen Schaltungsplatten
NL8701237A (nl) * 1987-05-22 1988-12-16 Soltec Bv Inrichting voor het aanbrengen van geleidend hechtmiddel, zoals soldeer, op een kaart met bedrukte bedrading.
DE4041272C2 (de) * 1990-12-21 1996-12-05 Siemens Ag Wellenlötvorrichtung
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
DE10108023C2 (de) * 2001-02-19 2003-04-17 Air Liquide Gmbh Verfahren zum Löten unter einer Schutzgasatmosphäre und Lötvorrichtung
NL1017843C2 (nl) * 2001-04-12 2002-10-22 Vitronics Soltec B V Inrichting voor selectief solderen.
US8205784B1 (en) * 2011-04-29 2012-06-26 Trane International Inc. Systems and methods for joining metal
DE102020007704A1 (de) * 2020-12-16 2022-06-23 Amsel-Advanced Materials and Surfaces for Environment and Life GmbH Verfahren und Vorrichtung zum Reduzieren von Oberflächen sowie Verwendung des Verfahrens

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567286A (en) * 1941-10-01 1945-02-07 John Louis Coltman Improvements in or relating to the manufacture of heat exchange devices
DE1235713B (de) * 1965-09-02 1967-03-02 Siemens Ag Vorrichtung zum Tauchloeten elektrischer Anschluesse
DE1514561A1 (de) * 1965-09-06 1969-06-26 Siemens Ag Verfahren zum serienmaessigen Herstellen von Halbleiterbauelementen
CH512823A (de) * 1970-01-30 1971-09-15 Siemens Ag Verfahren zum Herstellen eines Halbleiterbauelementes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567286A (en) * 1941-10-01 1945-02-07 John Louis Coltman Improvements in or relating to the manufacture of heat exchange devices
DE1235713B (de) * 1965-09-02 1967-03-02 Siemens Ag Vorrichtung zum Tauchloeten elektrischer Anschluesse
DE1514561A1 (de) * 1965-09-06 1969-06-26 Siemens Ag Verfahren zum serienmaessigen Herstellen von Halbleiterbauelementen
CH512823A (de) * 1970-01-30 1971-09-15 Siemens Ag Verfahren zum Herstellen eines Halbleiterbauelementes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024223999A1 (fr) 2023-04-25 2024-10-31 Stellantis Auto Sas Procédé de commande de trains de roues d'un groupe motopropulseur d'un véhicule automobile
FR3152269A1 (fr) 2023-08-25 2025-02-28 Psa Automobiles Sa Procede de controle dynamique de trains de vehicule automobile a quatre roues motrices, moyen de controle, vehicule et programme sur la base d’un tel procede
WO2025046174A1 (fr) 2023-08-25 2025-03-06 Stellantis Auto Sas Procede de controle dynamique de trains de vehicule automobile a quatre roues motrices, moyen de controle, vehicule et programme sur la base d'un tel procede

Also Published As

Publication number Publication date
DE2511210A1 (de) 1976-09-23
JPS51115772A (en) 1976-10-12
DE2511210C3 (de) 1980-03-06
FR2304176B1 (enExample) 1979-08-24
DE2511210B2 (de) 1979-06-28
CH596736A5 (enExample) 1978-03-15
US4019671A (en) 1977-04-26

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Legal Events

Date Code Title Description
ST Notification of lapse