CH596736A5 - - Google Patents

Info

Publication number
CH596736A5
CH596736A5 CH208876A CH208876A CH596736A5 CH 596736 A5 CH596736 A5 CH 596736A5 CH 208876 A CH208876 A CH 208876A CH 208876 A CH208876 A CH 208876A CH 596736 A5 CH596736 A5 CH 596736A5
Authority
CH
Switzerland
Application number
CH208876A
Inventor
Altan Akyuerek
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Publication of CH596736A5 publication Critical patent/CH596736A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
CH208876A 1975-03-14 1976-02-20 CH596736A5 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2511210A DE2511210C3 (de) 1975-03-14 1975-03-14 Verfahren und Vorrichtung zum Tauchlöten von Halbleiterbauelementen

Publications (1)

Publication Number Publication Date
CH596736A5 true CH596736A5 (enExample) 1978-03-15

Family

ID=5941404

Family Applications (1)

Application Number Title Priority Date Filing Date
CH208876A CH596736A5 (enExample) 1975-03-14 1976-02-20

Country Status (5)

Country Link
US (1) US4019671A (enExample)
JP (1) JPS51115772A (enExample)
CH (1) CH596736A5 (enExample)
DE (1) DE2511210C3 (enExample)
FR (1) FR2304176A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57169295A (en) 1981-04-10 1982-10-18 Aiwa Co Method of soldering electric part or like
JPS5731195A (en) * 1980-08-01 1982-02-19 Aiwa Co Method of soldering leadless electric part
US4475682A (en) * 1982-05-04 1984-10-09 The United States Of America As Represented By The United States Department Of Energy Process for reducing series resistance of solar cell metal contact systems with a soldering flux etchant
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
DE8622551U1 (de) * 1986-08-22 1989-09-21 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum Verlöten von elektrischen Schaltungsplatten
NL8701237A (nl) * 1987-05-22 1988-12-16 Soltec Bv Inrichting voor het aanbrengen van geleidend hechtmiddel, zoals soldeer, op een kaart met bedrukte bedrading.
DE4041272C2 (de) * 1990-12-21 1996-12-05 Siemens Ag Wellenlötvorrichtung
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
DE10108023C2 (de) * 2001-02-19 2003-04-17 Air Liquide Gmbh Verfahren zum Löten unter einer Schutzgasatmosphäre und Lötvorrichtung
NL1017843C2 (nl) * 2001-04-12 2002-10-22 Vitronics Soltec B V Inrichting voor selectief solderen.
US8205784B1 (en) * 2011-04-29 2012-06-26 Trane International Inc. Systems and methods for joining metal
DE102020007704A1 (de) * 2020-12-16 2022-06-23 Amsel-Advanced Materials and Surfaces for Environment and Life GmbH Verfahren und Vorrichtung zum Reduzieren von Oberflächen sowie Verwendung des Verfahrens
FR3148201B1 (fr) 2023-04-25 2025-03-14 Psa Automobiles Sa Procédé de commande de trains de roues d'un groupe motopropulseur d’un véhicule automobile
FR3152269B1 (fr) 2023-08-25 2025-07-18 Psa Automobiles Sa Procede de controle dynamique de trains de vehicule automobile a quatre roues motrices, moyen de controle, vehicule et programme sur la base d’un tel procede

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567286A (en) * 1941-10-01 1945-02-07 John Louis Coltman Improvements in or relating to the manufacture of heat exchange devices
DE1235713B (de) * 1965-09-02 1967-03-02 Siemens Ag Vorrichtung zum Tauchloeten elektrischer Anschluesse
DE1514561C3 (de) * 1965-09-06 1975-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum serienmäßigen Herstellen von Halbleiterbauelementen
DE2004320A1 (de) * 1970-01-30 1971-08-05 Siemens Ag Verfahren zum Herstellen eines Halb leiterbauelementes

Also Published As

Publication number Publication date
DE2511210A1 (de) 1976-09-23
JPS51115772A (en) 1976-10-12
DE2511210C3 (de) 1980-03-06
FR2304176B1 (enExample) 1979-08-24
DE2511210B2 (de) 1979-06-28
FR2304176A1 (fr) 1976-10-08
US4019671A (en) 1977-04-26

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Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased