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1975-12-31 |
1977-07-29 |
Honeywell Bull Soc Ind |
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JPS575887Y2
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1976-08-23 |
1982-02-03 |
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JPS54114565U
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1978-01-31 |
1979-08-11 |
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1978-07-26 |
1980-11-18 |
Western Electric Company, Inc. |
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1978-07-26 |
1981-08-18 |
Western Electric Co., Inc. |
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JPS5521128A
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1978-08-02 |
1980-02-15 |
Hitachi Ltd |
Lead frame used for semiconductor device and its assembling
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1978-09-28 |
1980-03-25 |
The United States Of America As Represented By The Secretary Of The Army |
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1979-09-19 |
1986-09-02 |
Motorola, Inc. |
Semiconductor chip with direct-bonded external leadframe
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1980-08-05 |
1982-03-11 |
GAO Gesellschaft für Automation und Organisation mbH, 8000 München |
Traegerelement fuer einen ic-baustein
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JPS56110660U
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1980-12-23 |
1981-08-27 |
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1982-04-05 |
1983-06-28 |
Fairchild Camera & Instrument Corp. |
Lead format for tape automated bonding
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1982-06-29 |
1985-12-13 |
Thomson Csf |
Microboitier d'encapsulation de circuits integres logiques fonctionnant en tres haute frequence
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1982-09-03 |
1985-01-01 |
General Motors Corporation |
Lead frame for molded integrated circuit package
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1982-10-05 |
1985-11-05 |
Mayo Foundation |
Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
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1985-03-11 |
1989-02-14 |
Olin Corporation |
Hermetically sealed semiconductor package
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1986-01-31 |
1988-01-26 |
Olin Corporation |
Interconnect tape for use in tape automated bonding
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1986-04-14 |
1987-05-05 |
Gte Products Corporation |
Segmented lead frame strip for IC chip carrier
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1986-07-22 |
1988-04-12 |
Olin Corporation |
Thermode design for tab and method of use
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1986-09-02 |
1989-03-28 |
Dennis Richard K |
Process for connecting lead frame to semiconductor device
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1986-09-02 |
1988-08-23 |
Dennis Richard K |
Lead frame for semi-conductor device and process of connecting same
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JPS63148670A
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1986-12-12 |
1988-06-21 |
Texas Instr Japan Ltd |
リ−ドフレ−ム材
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1987-04-06 |
1988-11-08 |
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1987-04-06 |
1989-07-11 |
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Lead frame for semi-conductor device
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1987-06-24 |
1992-08-11 |
Akita Electronics Co. Ltd. |
Lead connections means for stacked tab packaged IC chips
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1987-06-24 |
1997-03-22 |
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1988-03-22 |
1990-11-09 |
Bull Sa |
Support de circuit integre de haute densite et appareil d'etamage selectif des conducteurs du support
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1988-05-02 |
1989-09-19 |
Delco Electronics Corporation |
Interconnection lead with redundant bonding regions
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1990-09-24 |
2007-04-03 |
Tessera, Inc. |
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1993-06-03 |
1999-04-05 |
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1997-10-15 |
2001-02-15 |
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1999-01-25 |
2001-04-03 |
International Business Machines Corporation |
Built-in inspection template for a printed circuit
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1999-05-07 |
2004-04-27 |
Seagate Technology Llc |
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2000-02-23 |
2002-04-16 |
International Business Machines Corporation |
Chip scale package with direct attachment of chip to lead frame
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2000-05-31 |
2003-05-06 |
宮崎沖電気株式会社 |
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2002-03-01 |
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2003-02-21 |
2005-08-16 |
Sylva Industries Ltd. |
Combined electrical connector and radiator for high current applications
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2003-09-05 |
2010-01-06 |
キヤノン株式会社 |
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2005-08-12 |
2006-10-16 |
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2007-10-16 |
2014-02-07 |
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2010-07-29 |
2013-08-28 |
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2012-02-21 |
2014-08-12 |
Peiching Ling |
Light emitting diode package and method of fabricating the same
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2014-04-25 |
2015-11-05 |
Infineon Technologies Ag |
Sensorvorrichtung und Verfahren zum Herstellen einer Sensorvorrichtung
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