FR2271899A1 - Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards - Google Patents
Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boardsInfo
- Publication number
- FR2271899A1 FR2271899A1 FR7417547A FR7417547A FR2271899A1 FR 2271899 A1 FR2271899 A1 FR 2271899A1 FR 7417547 A FR7417547 A FR 7417547A FR 7417547 A FR7417547 A FR 7417547A FR 2271899 A1 FR2271899 A1 FR 2271899A1
- Authority
- FR
- France
- Prior art keywords
- jig
- bath
- printed circuit
- replacement
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- 238000005476 soldering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0669—Solder baths with dipping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7417547A FR2271899A1 (en) | 1974-05-20 | 1974-05-20 | Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7417547A FR2271899A1 (en) | 1974-05-20 | 1974-05-20 | Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2271899A1 true FR2271899A1 (en) | 1975-12-19 |
| FR2271899B1 FR2271899B1 (OSRAM) | 1979-09-28 |
Family
ID=9139083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7417547A Granted FR2271899A1 (en) | 1974-05-20 | 1974-05-20 | Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2271899A1 (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2418992A1 (fr) * | 1978-03-03 | 1979-09-28 | Ass Ouvriers Instr Precision | Procede et dispositif pour dessouder des composants fixes sur une carte a circuits imprimes |
| FR2458977A1 (fr) * | 1979-06-13 | 1981-01-02 | Cii Honeywell Bull | Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat |
| FR2565062A1 (fr) * | 1984-05-23 | 1985-11-29 | Cdv Electronic Sa | Machine pour souder ou dessouder des composants sur un circuit electronique ou electrique |
| US4589585A (en) * | 1985-09-23 | 1986-05-20 | Amp Incorporated | Method for replacing contact in a board mounted connector |
-
1974
- 1974-05-20 FR FR7417547A patent/FR2271899A1/fr active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2418992A1 (fr) * | 1978-03-03 | 1979-09-28 | Ass Ouvriers Instr Precision | Procede et dispositif pour dessouder des composants fixes sur une carte a circuits imprimes |
| FR2458977A1 (fr) * | 1979-06-13 | 1981-01-02 | Cii Honeywell Bull | Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat |
| FR2565062A1 (fr) * | 1984-05-23 | 1985-11-29 | Cdv Electronic Sa | Machine pour souder ou dessouder des composants sur un circuit electronique ou electrique |
| US4589585A (en) * | 1985-09-23 | 1986-05-20 | Amp Incorporated | Method for replacing contact in a board mounted connector |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2271899B1 (OSRAM) | 1979-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |