FR2271899A1 - Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards - Google Patents

Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards

Info

Publication number
FR2271899A1
FR2271899A1 FR7417547A FR7417547A FR2271899A1 FR 2271899 A1 FR2271899 A1 FR 2271899A1 FR 7417547 A FR7417547 A FR 7417547A FR 7417547 A FR7417547 A FR 7417547A FR 2271899 A1 FR2271899 A1 FR 2271899A1
Authority
FR
France
Prior art keywords
jig
bath
printed circuit
replacement
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7417547A
Other languages
English (en)
Other versions
FR2271899B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BODRON DANIEL FR
Original Assignee
BODRON DANIEL FR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BODRON DANIEL FR filed Critical BODRON DANIEL FR
Priority to FR7417547A priority Critical patent/FR2271899A1/fr
Publication of FR2271899A1 publication Critical patent/FR2271899A1/fr
Application granted granted Critical
Publication of FR2271899B1 publication Critical patent/FR2271899B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0486Replacement and removal of components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
FR7417547A 1974-05-20 1974-05-20 Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards Granted FR2271899A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7417547A FR2271899A1 (en) 1974-05-20 1974-05-20 Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7417547A FR2271899A1 (en) 1974-05-20 1974-05-20 Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards

Publications (2)

Publication Number Publication Date
FR2271899A1 true FR2271899A1 (en) 1975-12-19
FR2271899B1 FR2271899B1 (fr) 1979-09-28

Family

ID=9139083

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7417547A Granted FR2271899A1 (en) 1974-05-20 1974-05-20 Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards

Country Status (1)

Country Link
FR (1) FR2271899A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2418992A1 (fr) * 1978-03-03 1979-09-28 Ass Ouvriers Instr Precision Procede et dispositif pour dessouder des composants fixes sur une carte a circuits imprimes
FR2458977A1 (fr) * 1979-06-13 1981-01-02 Cii Honeywell Bull Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat
FR2565062A1 (fr) * 1984-05-23 1985-11-29 Cdv Electronic Sa Machine pour souder ou dessouder des composants sur un circuit electronique ou electrique
US4589585A (en) * 1985-09-23 1986-05-20 Amp Incorporated Method for replacing contact in a board mounted connector

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2418992A1 (fr) * 1978-03-03 1979-09-28 Ass Ouvriers Instr Precision Procede et dispositif pour dessouder des composants fixes sur une carte a circuits imprimes
FR2458977A1 (fr) * 1979-06-13 1981-01-02 Cii Honeywell Bull Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat
FR2565062A1 (fr) * 1984-05-23 1985-11-29 Cdv Electronic Sa Machine pour souder ou dessouder des composants sur un circuit electronique ou electrique
US4589585A (en) * 1985-09-23 1986-05-20 Amp Incorporated Method for replacing contact in a board mounted connector

Also Published As

Publication number Publication date
FR2271899B1 (fr) 1979-09-28

Similar Documents

Publication Publication Date Title
KR880009545A (ko) 자동 장착장치
DE3582945D1 (de) Produkttraeger fuer leiterplatten.
GB1521782A (en) Printed circuit board electrical component mounting method and apparatus
CA1010982A (en) Automatic assembly apparatus for inserting electronic connecting pins to and/or for mounting electronic parts on printed circuit boards
DE3870811D1 (de) Vorrichtung und verfahren zum bestuecken von leiterplatten mit bauelementen.
DE3583760D1 (de) Einrichtung fuer die handbestueckung von leiterplatten.
DK0839091T3 (da) Apparatur til at holde og opstramme en stencil
ATE7868T1 (de) Vorrichtung zum ausloeten elektronischer bauteile aus leiterplatten.
ATE81209T1 (de) Geraet zum pruefen von leiterplatten.
ATE90830T1 (de) Verfahren und vorrichtung zum tauchbeloten von leiterplatten.
WO1998052399A1 (fr) Dispositif et procede servant a monter des composants electroniques
DE3851745D1 (de) Gerät zum Einstellen einer Schaltungsplatte.
KR950030759A (ko) 전자부품실장장치 및 전자부품실장방법
FR2271899A1 (en) Jig and solder bath - for rapid removal and replacement of electronic components on printed circuit boards
DE68927532D1 (de) Gerät zur Inspektion von gedruckten Schaltungen mit Bauteilen, die auf der Oberfläche montiert sind.
ES270692A1 (es) Metodo para insertar mecanicamente partes componentes electricas en una placa de montaje perforada
GB1517247A (en) Soldering apparatus for soldering electronic component leads to conductors on a printed circuit board
DE69109253T2 (de) Verfahren und Vorrichtung zum Nivellieren von Lötzinn auf Leiterplatten.
DE69013976D1 (de) Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten.
ATE69652T1 (de) Vorrichtung zur selbsttaetigen ueberpruefung von auf flaechen zu montierenden komponenten.
ATE70925T1 (de) Mehretagiger leiterplatten-klemmenblock.
ATE111682T1 (de) Verfahren und anordnung zum auflöten von oberflächenbefestigbaren bausteinen auf leiterplatten.
DE3381079D1 (de) Verfahren und vorrichtung zum geraderichten und ausrichten von anschlussdraehten sowie zur pruefung des elektrischen funktionierens von bauelementen.
JPS525488A (en) Method of and apparatus for inserting socket contact
GB2017540A (en) Electronic Component Automatic Insertion System and Apparatus

Legal Events

Date Code Title Description
ST Notification of lapse