FR2261351A1 - - Google Patents
Info
- Publication number
- FR2261351A1 FR2261351A1 FR7501951A FR7501951A FR2261351A1 FR 2261351 A1 FR2261351 A1 FR 2261351A1 FR 7501951 A FR7501951 A FR 7501951A FR 7501951 A FR7501951 A FR 7501951A FR 2261351 A1 FR2261351 A1 FR 2261351A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US443406A US3875029A (en) | 1974-02-19 | 1974-02-19 | Plating bath for electrodeposition of bright tin and tin-lead alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2261351A1 true FR2261351A1 (en:Method) | 1975-09-12 |
| FR2261351B1 FR2261351B1 (en:Method) | 1979-09-28 |
Family
ID=23760674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7501951A Expired FR2261351B1 (en:Method) | 1974-02-19 | 1975-01-22 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3875029A (en:Method) |
| JP (1) | JPS581195B2 (en:Method) |
| BR (1) | BR7500985A (en:Method) |
| CA (1) | CA1046976A (en:Method) |
| ES (1) | ES434856A1 (en:Method) |
| FR (1) | FR2261351B1 (en:Method) |
| SE (1) | SE419104B (en:Method) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3977949A (en) * | 1975-07-07 | 1976-08-31 | Columbia Chemical Corporation | Acidic plating bath and additives for electrodeposition of bright tin |
| US4207148A (en) * | 1975-11-28 | 1980-06-10 | Minnesota Mining And Manufacturing Company | Electroplating bath for the electrodeposition of tin and tin/cadmium deposits |
| US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
| US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
| US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
| US4263106A (en) * | 1979-12-31 | 1981-04-21 | Bell Telephone Laboratories, Incorporated | Solder plating process |
| US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
| US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
| SE8204505L (sv) * | 1981-09-08 | 1983-03-09 | Occidental Chem Co | Elektropletering for avsettning av tenn-blylegeringar pa olika underlag |
| US5094726B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US5066367B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| JPS59500475A (ja) * | 1982-03-15 | 1984-03-22 | ジ−・エス・ピ−・メタルズ・アンド・ケミカルズ・コ−ポレイシヨン | キレ−ト化金属 |
| US4586990A (en) * | 1982-03-15 | 1986-05-06 | Gsp Metals & Chemicals Corporation | Chelating metals |
| US4530741A (en) * | 1984-07-12 | 1985-07-23 | Columbia Chemical Corporation | Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin |
| US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| US4816070A (en) * | 1985-08-29 | 1989-03-28 | Techo Instruments Investments Ltd. | Use of immersion tin and alloys as a bonding medium for multilayer circuits |
| US4880507A (en) * | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
| US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| WO1992004484A1 (en) * | 1989-04-20 | 1992-03-19 | Tokin Corporation | Electroplating bath using organic solvent for plating permanent magnet of r2t14b intermetallic compound |
| US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
| US5698087A (en) * | 1992-03-11 | 1997-12-16 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US5545440A (en) * | 1994-12-05 | 1996-08-13 | At&T Global Information Solutions Company (Aka Ncr Corporation) | Method and apparatus for polymer coating of substrates |
| US5597469A (en) * | 1995-02-13 | 1997-01-28 | International Business Machines Corporation | Process for selective application of solder to circuit packages |
| US5814202A (en) * | 1997-10-14 | 1998-09-29 | Usx Corporation | Electrolytic tin plating process with reduced sludge production |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL124247C (en:Method) * | 1963-08-28 | |||
| NL128321C (en:Method) * | 1965-02-13 | |||
| US3785939A (en) * | 1970-10-22 | 1974-01-15 | Conversion Chem Corp | Tin/lead plating bath and method |
-
1974
- 1974-02-19 US US443406A patent/US3875029A/en not_active Expired - Lifetime
- 1974-12-31 CA CA217,157A patent/CA1046976A/en not_active Expired
-
1975
- 1975-01-22 FR FR7501951A patent/FR2261351B1/fr not_active Expired
- 1975-02-17 SE SE7501711A patent/SE419104B/xx not_active IP Right Cessation
- 1975-02-18 BR BR985/75A patent/BR7500985A/pt unknown
- 1975-02-19 ES ES434856A patent/ES434856A1/es not_active Expired
- 1975-02-19 JP JP50019994A patent/JPS581195B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| SE419104B (sv) | 1981-07-13 |
| AU7620874A (en) | 1976-06-10 |
| JPS50118934A (en:Method) | 1975-09-18 |
| BR7500985A (pt) | 1976-11-16 |
| CA1046976A (en) | 1979-01-23 |
| SE7501711L (en:Method) | 1975-08-20 |
| JPS581195B2 (ja) | 1983-01-10 |
| FR2261351B1 (en:Method) | 1979-09-28 |
| ES434856A1 (es) | 1976-12-01 |
| DE2506158A1 (de) | 1975-08-21 |
| DE2506158B2 (de) | 1976-12-02 |
| US3875029A (en) | 1975-04-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property | ||
| ST | Notification of lapse |