FR2258002A1 - - Google Patents

Info

Publication number
FR2258002A1
FR2258002A1 FR7500823A FR7500823A FR2258002A1 FR 2258002 A1 FR2258002 A1 FR 2258002A1 FR 7500823 A FR7500823 A FR 7500823A FR 7500823 A FR7500823 A FR 7500823A FR 2258002 A1 FR2258002 A1 FR 2258002A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7500823A
Other languages
French (fr)
Other versions
FR2258002B1 (ja
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2258002A1 publication Critical patent/FR2258002A1/fr
Application granted granted Critical
Publication of FR2258002B1 publication Critical patent/FR2258002B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR7500823A 1974-01-14 1975-01-13 Expired FR2258002B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742401613 DE2401613A1 (de) 1974-01-14 1974-01-14 Halbleitervorrichtung

Publications (2)

Publication Number Publication Date
FR2258002A1 true FR2258002A1 (ja) 1975-08-08
FR2258002B1 FR2258002B1 (ja) 1978-12-08

Family

ID=5904759

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7500823A Expired FR2258002B1 (ja) 1974-01-14 1975-01-13

Country Status (5)

Country Link
JP (1) JPS50104572A (ja)
DE (1) DE2401613A1 (ja)
FR (1) FR2258002B1 (ja)
GB (1) GB1465650A (ja)
IT (1) IT1028249B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0026967A2 (en) * 1979-07-31 1981-04-15 Fujitsu Limited A method of manufacturing a semiconductor device using a thermosetting resin film

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929339A1 (de) * 1978-07-24 1980-02-14 Citizen Watch Co Ltd Halbleiteranordnung
JPS5632731A (en) * 1979-08-27 1981-04-02 Fujitsu Ltd Semiconductor device
JPS5661130A (en) * 1979-10-25 1981-05-26 Fuji Electric Co Ltd Semiconductor device
JPS5736835A (en) * 1980-08-15 1982-02-27 Nec Corp Semiconductor device
JPS5739736U (ja) * 1980-08-18 1982-03-03
JPS5740956A (en) * 1980-08-25 1982-03-06 Fujitsu Ltd Semiconductor device
JPS5975648A (ja) * 1982-10-23 1984-04-28 Nippon Precision Saakitsutsu Kk 半導体装置およびその製造方法
FR2544132B1 (fr) * 1983-04-08 1986-11-21 Telecommunications Sa Detecteur photoconducteur en immersion optique
JPS601846A (ja) * 1983-06-18 1985-01-08 Toshiba Corp 多層配線構造の半導体装置とその製造方法
DE3327960A1 (de) * 1983-08-03 1985-02-14 Telefunken electronic GmbH, 7100 Heilbronn Halbleiteranordnung in einem isolierstoffgehaeuse
DE3415817A1 (de) * 1984-04-27 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zum abdecken der vorderseite eines mit bauelementstrukturen versehenen substrates
DE4123900A1 (de) * 1991-07-18 1993-01-21 Siemens Ag Schutzschicht fuer wafer
DE4435120C2 (de) * 1994-09-30 2000-08-03 Siemens Ag Schutzschicht für Wafer und Verfahren zu deren Herstellung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0026967A2 (en) * 1979-07-31 1981-04-15 Fujitsu Limited A method of manufacturing a semiconductor device using a thermosetting resin film
EP0026967A3 (en) * 1979-07-31 1983-04-27 Fujitsu Limited A method of manufacturing a semiconductor device using a thermosetting resin film

Also Published As

Publication number Publication date
IT1028249B (it) 1979-01-30
DE2401613A1 (de) 1975-07-17
FR2258002B1 (ja) 1978-12-08
GB1465650A (en) 1977-02-23
JPS50104572A (ja) 1975-08-18

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Legal Events

Date Code Title Description
ST Notification of lapse