FR2245779B1 - - Google Patents

Info

Publication number
FR2245779B1
FR2245779B1 FR7334821A FR7334821A FR2245779B1 FR 2245779 B1 FR2245779 B1 FR 2245779B1 FR 7334821 A FR7334821 A FR 7334821A FR 7334821 A FR7334821 A FR 7334821A FR 2245779 B1 FR2245779 B1 FR 2245779B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7334821A
Other versions
FR2245779A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Original Assignee
Alcatel CIT SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel CIT SA filed Critical Alcatel CIT SA
Priority to FR7334821A priority Critical patent/FR2245779B1/fr
Publication of FR2245779A1 publication Critical patent/FR2245779A1/fr
Application granted granted Critical
Publication of FR2245779B1 publication Critical patent/FR2245779B1/fr
Application status is Expired legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228Gas flow assisted PVD deposition
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325Electric arc evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes, e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055Arc discharge
FR7334821A 1973-09-28 1973-09-28 Expired FR2245779B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7334821A FR2245779B1 (fr) 1973-09-28 1973-09-28

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
FR7334821A FR2245779B1 (fr) 1973-09-28 1973-09-28
CH1203474A CH579639A5 (fr) 1973-09-28 1974-09-04
BE1006169A BE819665A (fr) 1973-09-28 1974-09-09 Procede et dispositif de depot rapide d'oxydes en couches minces et adherentes sur des supports plastiques
DE19742444898 DE2444898C2 (fr) 1973-09-28 1974-09-19
US05/507,845 US4006340A (en) 1973-09-28 1974-09-20 Device for the rapid depositing of oxides in thin layers which adhere well to plastic supports
IT6988274A IT1020867B (it) 1973-09-28 1974-09-25 Procedimento e dispositivo per il deposito rapido di ossidi in stra ti sottili ed aderenti su supporti plastici
NL7412748A NL7412748A (nl) 1973-09-28 1974-09-26 Werkwijze en inrichting voor het neerslaan van n in dunne, hechtende lagen op een kunst- rager.
GB4192174A GB1478687A (en) 1973-09-28 1974-09-26 Method and a device for the rapid deposition of oxydes in thin layers
JP11065274A JPS5735269B2 (fr) 1973-09-28 1974-09-27

Publications (2)

Publication Number Publication Date
FR2245779A1 FR2245779A1 (fr) 1975-04-25
FR2245779B1 true FR2245779B1 (fr) 1978-02-10

Family

ID=9125687

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7334821A Expired FR2245779B1 (fr) 1973-09-28 1973-09-28

Country Status (9)

Country Link
US (1) US4006340A (fr)
JP (1) JPS5735269B2 (fr)
BE (1) BE819665A (fr)
CH (1) CH579639A5 (fr)
DE (1) DE2444898C2 (fr)
FR (1) FR2245779B1 (fr)
GB (1) GB1478687A (fr)
IT (1) IT1020867B (fr)
NL (1) NL7412748A (fr)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU71343A1 (fr) * 1974-11-22 1976-03-17
JPS52113380A (en) * 1976-03-19 1977-09-22 Koito Mfg Co Ltd Process for preparing film shorn with a hottwire cutter
US4078097A (en) * 1976-07-09 1978-03-07 International Prototypes, Inc. Metallic coating process
US4158589A (en) * 1977-12-30 1979-06-19 International Business Machines Corporation Negative ion extractor for a plasma etching apparatus
US4328257B1 (fr) * 1979-11-26 1987-09-01
GB2085482B (en) * 1980-10-06 1985-03-06 Optical Coating Laboratory Inc Forming thin film oxide layers using reactive evaporation techniques
DE3331707C2 (fr) * 1983-09-02 1988-12-22 Leybold Ag, 6450 Hanau, De
US6784033B1 (en) 1984-02-15 2004-08-31 Semiconductor Energy Laboratory Co., Ltd. Method for the manufacture of an insulated gate field effect semiconductor device
US5780313A (en) 1985-02-14 1998-07-14 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating semiconductor device
US4783361A (en) * 1984-09-10 1988-11-08 Ovonic Synthetic Materials Company, Inc. Coated lenses
JPH0752718B2 (ja) * 1984-11-26 1995-06-05 株式会社半導体エネルギー研究所 薄膜形成方法
US6786997B1 (en) 1984-11-26 2004-09-07 Semiconductor Energy Laboratory Co., Ltd. Plasma processing apparatus
US6984595B1 (en) 1984-11-26 2006-01-10 Semiconductor Energy Laboratory Co., Ltd. Layer member forming method
US4606929A (en) * 1984-12-20 1986-08-19 Petrakov Vladimir P Method of ionized-plasma spraying and apparatus for performing same
CA1272662A (fr) * 1985-03-26 1990-08-14 Canon Kabushiki Kaisha Methode et dispositif de controle du debit de fines particules
DE3513892A1 (de) * 1985-04-17 1986-10-23 Plasmainvent Ag Cr(pfeil abwaerts)2(pfeil abwaerts)o(pfeil abwaerts)3(pfeil abwaerts)-schutzschicht und verfahren zu deren herstellung
CA1272661A (fr) * 1985-05-11 1990-08-14 Yuji Chiba Appareil reacteur
US6673722B1 (en) 1985-10-14 2004-01-06 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD system under magnetic field
US6230650B1 (en) 1985-10-14 2001-05-15 Semiconductor Energy Laboratory Co., Ltd. Microwave enhanced CVD system under magnetic field
US4875810A (en) * 1985-10-21 1989-10-24 Canon Kabushiki Kaisha Apparatus for controlling fine particle flow
NL8701530A (nl) * 1987-06-30 1989-01-16 Stichting Fund Ond Material Werkwijze voor het behandelen van oppervlakken van substraten met behulp van een plasma en reactor voor het uitvoeren van die werkwijze.
DE4126216B4 (de) * 1991-08-08 2004-03-11 Unaxis Deutschland Holding Gmbh Vorrichtung für Dünnschichtverfahren zur Behandlung großflächiger Substrate
FR2681472B1 (fr) 1991-09-18 1993-10-29 Commissariat A Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
US5421889A (en) * 1993-06-29 1995-06-06 Tokyo Electron Limited Method and apparatus for inverting samples in a process
US5653811A (en) * 1995-07-19 1997-08-05 Chan; Chung System for the plasma treatment of large area substrates
FR2748851B1 (fr) * 1996-05-15 1998-08-07 Commissariat Energie Atomique Procede de realisation d'une couche mince de materiau semiconducteur
US6039834A (en) 1997-03-05 2000-03-21 Applied Materials, Inc. Apparatus and methods for upgraded substrate processing system with microwave plasma source
US6291313B1 (en) 1997-05-12 2001-09-18 Silicon Genesis Corporation Method and device for controlled cleaving process
US20070122997A1 (en) * 1998-02-19 2007-05-31 Silicon Genesis Corporation Controlled process and resulting device
US6010579A (en) 1997-05-12 2000-01-04 Silicon Genesis Corporation Reusable substrate for thin film separation
US6033974A (en) * 1997-05-12 2000-03-07 Silicon Genesis Corporation Method for controlled cleaving process
US6027988A (en) * 1997-05-28 2000-02-22 The Regents Of The University Of California Method of separating films from bulk substrates by plasma immersion ion implantation
US6548382B1 (en) * 1997-07-18 2003-04-15 Silicon Genesis Corporation Gettering technique for wafers made using a controlled cleaving process
US6103599A (en) * 1997-07-25 2000-08-15 Silicon Genesis Corporation Planarizing technique for multilayered substrates
FR2773261B1 (fr) 1997-12-30 2000-01-28 Commissariat Energie Atomique Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions
US6228176B1 (en) 1998-02-11 2001-05-08 Silicon Genesis Corporation Contoured platen design for plasma immerson ion implantation
US6051073A (en) * 1998-02-11 2000-04-18 Silicon Genesis Corporation Perforated shield for plasma immersion ion implantation
US6274459B1 (en) 1998-02-17 2001-08-14 Silicon Genesis Corporation Method for non mass selected ion implant profile control
US6291326B1 (en) 1998-06-23 2001-09-18 Silicon Genesis Corporation Pre-semiconductor process implant and post-process film separation
US6458723B1 (en) 1999-06-24 2002-10-01 Silicon Genesis Corporation High temperature implant apparatus
US6500732B1 (en) 1999-08-10 2002-12-31 Silicon Genesis Corporation Cleaving process to fabricate multilayered substrates using low implantation doses
US6263941B1 (en) 1999-08-10 2001-07-24 Silicon Genesis Corporation Nozzle for cleaving substrates
WO2001011930A2 (fr) * 1999-08-10 2001-02-15 Silicon Genesis Corporation Procede de clivage permettant de fabriquer des substrats multicouche a l'aide de faibles doses d'implantation
US6221740B1 (en) 1999-08-10 2001-04-24 Silicon Genesis Corporation Substrate cleaving tool and method
EP1148037A1 (fr) * 2000-04-19 2001-10-24 Blösch Holding AG Procédé pour la fabrication d'une couche antireflective sur glace de montre
DE10104615A1 (de) * 2001-02-02 2002-08-14 Bosch Gmbh Robert Verfahren zur Erzeugung einer Funktionsbeschichtung mit einer HF-ICP-Plasmastrahlquelle
FR2823599B1 (fr) 2001-04-13 2004-12-17 Commissariat Energie Atomique Substrat demomtable a tenue mecanique controlee et procede de realisation
US8187377B2 (en) * 2002-10-04 2012-05-29 Silicon Genesis Corporation Non-contact etch annealing of strained layers
FR2848336B1 (fr) * 2002-12-09 2005-10-28 Commissariat Energie Atomique Procede de realisation d'une structure contrainte destinee a etre dissociee
FR2856844B1 (fr) * 2003-06-24 2006-02-17 Commissariat Energie Atomique Circuit integre sur puce de hautes performances
FR2857953B1 (fr) 2003-07-21 2006-01-13 Commissariat Energie Atomique Structure empilee, et procede pour la fabriquer
FR2861497B1 (fr) * 2003-10-28 2006-02-10 Soitec Silicon On Insulator Procede de transfert catastrophique d'une couche fine apres co-implantation
US7354815B2 (en) * 2003-11-18 2008-04-08 Silicon Genesis Corporation Method for fabricating semiconductor devices using strained silicon bearing material
FR2889887B1 (fr) * 2005-08-16 2007-11-09 Commissariat Energie Atomique Procede de report d'une couche mince sur un support
US7811900B2 (en) * 2006-09-08 2010-10-12 Silicon Genesis Corporation Method and structure for fabricating solar cells using a thick layer transfer process
US8993410B2 (en) 2006-09-08 2015-03-31 Silicon Genesis Corporation Substrate cleaving under controlled stress conditions
FR2910179B1 (fr) * 2006-12-19 2009-03-13 Commissariat Energie Atomique PROCEDE DE FABRICATION DE COUCHES MINCES DE GaN PAR IMPLANTATION ET RECYCLAGE D'UN SUBSTRAT DE DEPART
US8007718B1 (en) 2007-05-11 2011-08-30 SDCmaterials, Inc. System for and method of processing bone material using supercritical fluids
FR2922359B1 (fr) * 2007-10-12 2009-12-18 Commissariat Energie Atomique Procede de fabrication d'une structure micro-electronique impliquant un collage moleculaire
US8575059B1 (en) 2007-10-15 2013-11-05 SDCmaterials, Inc. Method and system for forming plug and play metal compound catalysts
FR2925221B1 (fr) * 2007-12-17 2010-02-19 Commissariat Energie Atomique Procede de transfert d'une couche mince
US9362439B2 (en) * 2008-05-07 2016-06-07 Silicon Genesis Corporation Layer transfer of films utilizing controlled shear region
US8330126B2 (en) * 2008-08-25 2012-12-11 Silicon Genesis Corporation Race track configuration and method for wafering silicon solar substrates
US8293619B2 (en) 2008-08-28 2012-10-23 Silicon Genesis Corporation Layer transfer of films utilizing controlled propagation
US8329557B2 (en) * 2009-05-13 2012-12-11 Silicon Genesis Corporation Techniques for forming thin films by implantation with reduced channeling
FR2947098A1 (fr) * 2009-06-18 2010-12-24 Commissariat Energie Atomique Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince
US8652992B2 (en) 2009-12-15 2014-02-18 SDCmaterials, Inc. Pinning and affixing nano-active material
US8803025B2 (en) * 2009-12-15 2014-08-12 SDCmaterials, Inc. Non-plugging D.C. plasma gun
US9126191B2 (en) 2009-12-15 2015-09-08 SDCmaterials, Inc. Advanced catalysts for automotive applications
US8669202B2 (en) 2011-02-23 2014-03-11 SDCmaterials, Inc. Wet chemical and plasma methods of forming stable PtPd catalysts
US9511352B2 (en) 2012-11-21 2016-12-06 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
US9156025B2 (en) 2012-11-21 2015-10-13 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
CN105592921A (zh) 2013-07-25 2016-05-18 Sdc材料公司 用于催化转化器的洗涂层和经涂覆基底及其制造和使用方法
WO2015061477A1 (fr) 2013-10-22 2015-04-30 SDCmaterials, Inc. Conception de catalyseurs pour moteurs à combustion diesel de grande puissance
US9517448B2 (en) 2013-10-22 2016-12-13 SDCmaterials, Inc. Compositions of lean NOx trap (LNT) systems and methods of making and using same
WO2015143225A1 (fr) 2014-03-21 2015-09-24 SDCmaterials, Inc. Compositions pour systèmes d'adsorption de nox passive (pna) et leurs procédés de fabrication et d'utilisation

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1033392A (en) * 1962-06-20 1966-06-22 Atomic Energy Authority Uk Improvements in or relating to induction coupled plasma generators
FR1358425A (fr) * 1963-01-22 1964-04-17 Traitements Electrolytiques & Perfectionnement au chalumeau à plasma haute fréquence
GB1275261A (en) * 1968-06-04 1972-05-24 Atomic Energy Authority Uk Improvements in or relating to non thermionic cathode slow discharge devices
BE766345A (fr) * 1971-04-27 1971-09-16 Universitaire De L Etat A Mons Dispositif pour fabriquer des couches minces de substances minerales.

Also Published As

Publication number Publication date
GB1478687A (en) 1977-07-06
JPS5735269B2 (fr) 1982-07-28
CH579639A5 (fr) 1976-09-15
DE2444898A1 (de) 1975-04-10
BE819665A (fr) 1975-03-10
FR2245779A1 (fr) 1975-04-25
NL7412748A (nl) 1975-04-02
BE819665A1 (fr)
DE2444898C2 (fr) 1982-04-15
JPS5061470A (fr) 1975-05-27
US4006340A (en) 1977-02-01
IT1020867B (it) 1977-12-30

Similar Documents

Publication Publication Date Title
AU464454B2 (fr)
AU452681B2 (fr)
AU463921B2 (fr)
AU442884B2 (fr)
AU466403B2 (fr)
AU467397B2 (fr)
AU456993B2 (fr)
AR197627A1 (fr)
AU466464B2 (fr)
AU449998B2 (fr)
AU467368B2 (fr)
AU466727B2 (fr)
AU454375B2 (fr)
AU466933B2 (fr)
AU457116B2 (fr)
AU464595B2 (fr)
AU465144B2 (fr)
AU461694B2 (fr)
AR201229Q (fr)
AU466995B2 (fr)
AU464174B2 (fr)
AU464297B2 (fr)
AU443753B2 (fr)
AU465767B2 (fr)
AU455339B2 (fr)

Legal Events

Date Code Title Description
ST Notification of lapse