FR2244264B1 - - Google Patents

Info

Publication number
FR2244264B1
FR2244264B1 FR7431590A FR7431590A FR2244264B1 FR 2244264 B1 FR2244264 B1 FR 2244264B1 FR 7431590 A FR7431590 A FR 7431590A FR 7431590 A FR7431590 A FR 7431590A FR 2244264 B1 FR2244264 B1 FR 2244264B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7431590A
Other languages
French (fr)
Other versions
FR2244264A1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP48105715A external-priority patent/JPS5910075B2/ja
Priority claimed from JP5895874A external-priority patent/JPS5730301B2/ja
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of FR2244264A1 publication Critical patent/FR2244264A1/fr
Application granted granted Critical
Publication of FR2244264B1 publication Critical patent/FR2244264B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
FR7431590A 1973-09-19 1974-09-18 Expired FR2244264B1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP48105715A JPS5910075B2 (ja) 1973-09-19 1973-09-19 電界効果型トランジスタ
JP5895874A JPS5730301B2 (https=) 1974-05-24 1974-05-24

Publications (2)

Publication Number Publication Date
FR2244264A1 FR2244264A1 (https=) 1975-04-11
FR2244264B1 true FR2244264B1 (https=) 1979-02-16

Family

ID=26399977

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7431590A Expired FR2244264B1 (https=) 1973-09-19 1974-09-18

Country Status (2)

Country Link
US (1) US3946428A (https=)
FR (1) FR2244264B1 (https=)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4150393A (en) * 1975-09-29 1979-04-17 Motorola, Inc. High frequency semiconductor package
JPS5386576A (en) * 1977-01-10 1978-07-31 Nec Corp Package for semiconductor element
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
US4240098A (en) * 1978-09-28 1980-12-16 Exxon Research & Engineering Co. Semiconductor optoelectronic device package
JPS55163850A (en) * 1979-06-08 1980-12-20 Fujitsu Ltd Semiconductor device
US4518982A (en) * 1981-02-27 1985-05-21 Motorola, Inc. High current package with multi-level leads
US4583283A (en) * 1982-03-26 1986-04-22 Motorola, Inc. Electrically isolated semiconductor power device
US4510519A (en) * 1982-03-26 1985-04-09 Motorola, Inc. Electrically isolated semiconductor power device
JPS58190046A (ja) * 1982-04-30 1983-11-05 Fujitsu Ltd 半導体装置
FR2529385B1 (fr) * 1982-06-29 1985-12-13 Thomson Csf Microboitier d'encapsulation de circuits integres logiques fonctionnant en tres haute frequence
FR2536586B1 (fr) * 1982-11-23 1986-01-24 Thomson Csf Module preadapte pour diode hyperfrequence a forte dissipation thermique
US4550333A (en) * 1983-09-13 1985-10-29 Xerox Corporation Light emitting semiconductor mount
US4649416A (en) * 1984-01-03 1987-03-10 Raytheon Company Microwave transistor package
USD288557S (en) 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
DE3567771D1 (en) * 1984-11-02 1989-02-23 Siemens Ag Wave resistance-adapted chip support for a microwave semiconductor
CA1264380C (en) * 1985-01-30 1990-01-09 SEMICONDUCTOR DEVICE BOX WITH INTEGRATED GROUNDING CONDUCTOR AND SIDEWALL
EP0209642A3 (en) * 1985-07-25 1987-04-15 Hewlett-Packard Company Ceramic microcircuit package
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
US4774630A (en) * 1985-09-30 1988-09-27 Microelectronics Center Of North Carolina Apparatus for mounting a semiconductor chip and making electrical connections thereto
JPH0740600B2 (ja) * 1987-04-30 1995-05-01 三菱電機株式会社 半導体装置
US4839716A (en) * 1987-06-01 1989-06-13 Olin Corporation Semiconductor packaging
EP0308749A3 (de) * 1987-09-25 1990-07-11 Siemens Aktiengesellschaft Elektrooptische Baugruppe
JPH0770641B2 (ja) * 1989-03-17 1995-07-31 三菱電機株式会社 半導体パッケージ
JPH0750767B2 (ja) * 1989-09-07 1995-05-31 マツダ株式会社 金属基板を有する集積回路
DE3931634A1 (de) * 1989-09-22 1991-04-04 Telefunken Electronic Gmbh Halbleiterbauelement
JPH03227585A (ja) * 1989-10-30 1991-10-08 Minolta Camera Co Ltd レ−ザ光源ユニット
EP0452752B1 (en) * 1990-04-16 1996-12-18 Fujitsu Limited Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US6172412B1 (en) * 1993-10-08 2001-01-09 Stratedge Corporation High frequency microelectronics package
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
GB2298957A (en) * 1995-03-16 1996-09-18 Oxley Dev Co Ltd Microstrip microwave package
US5714794A (en) * 1995-04-18 1998-02-03 Hitachi Chemical Company, Ltd. Electrostatic protective device
US6301122B1 (en) 1996-06-13 2001-10-09 Matsushita Electric Industrial Co., Ltd. Radio frequency module with thermally and electrically coupled metal film on insulating substrate
SE512710C2 (sv) * 1998-07-08 2000-05-02 Ericsson Telefon Ab L M Kapsel för högeffekttransistorchip för höga frekvenser innefattande en elektriskt och termiskt ledande fläns
US7075174B2 (en) * 2004-02-26 2006-07-11 Agere Systems Inc. Semiconductor packaging techniques for use with non-ceramic packages
KR101243691B1 (ko) * 2004-10-22 2013-03-14 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 열싱크가 향상된 반도체 발광 장치
JP2009123736A (ja) * 2007-11-12 2009-06-04 Nec Corp デバイスの実装構造及びデバイスの実装方法
US8649811B2 (en) * 2010-07-13 2014-02-11 Shiquan Wu Embryo frequency leakage for personalized wireless communication system
EP2500938A1 (en) * 2011-03-17 2012-09-19 Nxp B.V. Package for a semiconductor device, and a method of manufacturing such package
JP6365215B2 (ja) * 2014-10-15 2018-08-01 三菱電機株式会社 半導体装置の製造方法
JP6781021B2 (ja) * 2016-11-29 2020-11-04 モレックス エルエルシー 電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202925C (https=) * 1969-04-30 1900-01-01
BE757968A (fr) * 1969-10-25 1971-04-23 Philips Nv Dispositif a micro-ondes
US3828228A (en) * 1973-03-05 1974-08-06 Hewlett Packard Co Microwave transistor package

Also Published As

Publication number Publication date
FR2244264A1 (https=) 1975-04-11
US3946428A (en) 1976-03-23

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