JPS5730301B2 - - Google Patents
Info
- Publication number
- JPS5730301B2 JPS5730301B2 JP5895874A JP5895874A JPS5730301B2 JP S5730301 B2 JPS5730301 B2 JP S5730301B2 JP 5895874 A JP5895874 A JP 5895874A JP 5895874 A JP5895874 A JP 5895874A JP S5730301 B2 JPS5730301 B2 JP S5730301B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5895874A JPS5730301B2 (https=) | 1974-05-24 | 1974-05-24 | |
| US05/506,872 US3946428A (en) | 1973-09-19 | 1974-09-17 | Encapsulation package for a semiconductor element |
| FR7431590A FR2244264B1 (https=) | 1973-09-19 | 1974-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5895874A JPS5730301B2 (https=) | 1974-05-24 | 1974-05-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50151470A JPS50151470A (https=) | 1975-12-05 |
| JPS5730301B2 true JPS5730301B2 (https=) | 1982-06-28 |
Family
ID=13099338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5895874A Expired JPS5730301B2 (https=) | 1973-09-19 | 1974-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5730301B2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5979501U (ja) * | 1982-11-18 | 1984-05-29 | いすゞ自動車株式会社 | 排気タ−ビン過給機 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2425175A1 (fr) * | 1978-05-03 | 1979-11-30 | Thomson Csf | Composant hybride d'amplification en tres haute frequence et amplificateur comportant un tel composant |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143722Y2 (https=) * | 1971-10-11 | 1976-10-23 |
-
1974
- 1974-05-24 JP JP5895874A patent/JPS5730301B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5979501U (ja) * | 1982-11-18 | 1984-05-29 | いすゞ自動車株式会社 | 排気タ−ビン過給機 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50151470A (https=) | 1975-12-05 |