FR2231110A1 - - Google Patents

Info

Publication number
FR2231110A1
FR2231110A1 FR7411895A FR7411895A FR2231110A1 FR 2231110 A1 FR2231110 A1 FR 2231110A1 FR 7411895 A FR7411895 A FR 7411895A FR 7411895 A FR7411895 A FR 7411895A FR 2231110 A1 FR2231110 A1 FR 2231110A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7411895A
Other languages
French (fr)
Other versions
FR2231110B1 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2231110A1 publication Critical patent/FR2231110A1/fr
Application granted granted Critical
Publication of FR2231110B1 publication Critical patent/FR2231110B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Weting (AREA)
FR7411895A 1973-05-24 1974-03-29 Expired FR2231110B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732326447 DE2326447C2 (de) 1973-05-24 1973-05-24 Verfahren zum Entfernen von Schichten aus organischem Material und seine Verwendung

Publications (2)

Publication Number Publication Date
FR2231110A1 true FR2231110A1 (de) 1974-12-20
FR2231110B1 FR2231110B1 (de) 1979-02-16

Family

ID=5881998

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7411895A Expired FR2231110B1 (de) 1973-05-24 1974-03-29

Country Status (6)

Country Link
JP (1) JPS5231712B2 (de)
CA (1) CA1026220A (de)
DE (1) DE2326447C2 (de)
FR (1) FR2231110B1 (de)
GB (1) GB1427482A (de)
IT (1) IT1006475B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256284A2 (de) * 1986-08-09 1988-02-24 Micro-Image Technology Limited Zusammensetzung für die Herstellung von integrierten Schaltungen, Anwendungs- und Herstellungsmethode
EP0504431A1 (de) * 1990-10-09 1992-09-23 CHLORINE ENGINEERS CORP., Ltd. Verfahren zum entfernen organischer überzüge

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186330A (en) * 1981-05-12 1982-11-16 Matsushita Electronics Corp Removing method for photoresist
JPS6053954A (ja) * 1983-09-05 1985-03-28 Oki Electric Ind Co Ltd フォトマスク洗浄方法
US4872919A (en) * 1988-01-28 1989-10-10 The Procter & Gamble Company Method for removing precipitated calcium citrate from juice pasteurization or sterilization equipment
JPH0294911A (ja) * 1988-09-30 1990-04-05 Toshiba Corp 弾性表面波素子の製造方法

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
MANUFACTURING" H.G.GLARK, PAGES 25-31.) *
REVUE GB MICROELECTRONICS, VOL. 3, NO. 10, 1971, "APPLICATION OF PHOTORESISTS IN SEMICONDUCTOR *
REVUE SOLID STATE TECHNOLOGY, VOL. 13,NO. 6, JUIN 1970, "AUTOMATIC PLASMA MACHINES FOR *
STRIPPING PHOTORESIST", R.L.BERSIN, PAGES 39-45. *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0256284A2 (de) * 1986-08-09 1988-02-24 Micro-Image Technology Limited Zusammensetzung für die Herstellung von integrierten Schaltungen, Anwendungs- und Herstellungsmethode
EP0256284A3 (en) * 1986-08-09 1989-02-08 Micro-Image Technology Limited Composition for use in the production of integrated circuits and method for its preparation and use
US4917122A (en) * 1986-08-09 1990-04-17 Micro-Image Technology Limited Compositions for use in the production of integrated circuits and method for its preparation and use
EP0504431A1 (de) * 1990-10-09 1992-09-23 CHLORINE ENGINEERS CORP., Ltd. Verfahren zum entfernen organischer überzüge
EP0504431A4 (en) * 1990-10-09 1993-03-10 Chlorine Engineers Corp., Ltd. Method of removing organic coating

Also Published As

Publication number Publication date
FR2231110B1 (de) 1979-02-16
DE2326447A1 (de) 1974-12-12
JPS5021681A (de) 1975-03-07
DE2326447C2 (de) 1986-02-06
GB1427482A (en) 1976-03-10
CA1026220A (en) 1978-02-14
IT1006475B (it) 1976-09-30
JPS5231712B2 (de) 1977-08-16

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Legal Events

Date Code Title Description
ST Notification of lapse