GB1427482A - Stripping organic matter - Google Patents
Stripping organic matterInfo
- Publication number
- GB1427482A GB1427482A GB1469774A GB1469774A GB1427482A GB 1427482 A GB1427482 A GB 1427482A GB 1469774 A GB1469774 A GB 1469774A GB 1469774 A GB1469774 A GB 1469774A GB 1427482 A GB1427482 A GB 1427482A
- Authority
- GB
- United Kingdom
- Prior art keywords
- acid
- sulphuric acid
- hydrogen peroxide
- ratio
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000005416 organic matter Substances 0.000 title 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 3
- 235000011149 sulphuric acid Nutrition 0.000 abstract 3
- 239000001117 sulphuric acid Substances 0.000 abstract 3
- 229910052739 hydrogen Inorganic materials 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- FHHJDRFHHWUPDG-UHFFFAOYSA-N peroxysulfuric acid Chemical compound OOS(O)(=O)=O FHHJDRFHHWUPDG-UHFFFAOYSA-N 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 239000011368 organic material Substances 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Abstract
1427482 Persuiphuric acid INTERNATIONAL BUSINESS MACHINES CORP 3 April 1974 [24 May 1973] 14697/74 Heading C1A [Also in Divisions B6 and G2] A liquid for removing organic material from substrates is prepared by mixing sulphuric acid containing at least 95% H 2 SO 4 by weight with an aqueous solution of hydrogen peroxide containing at least 30% H 2 O 2 by weight in such proportions that the ratio of H 2 SO 4 to H 2 O 2 is at least 15 : 1, preferably between 17 : 1 and 35 : 1. The ratio of the H 2 O 2 content to the water content of the sulphuric acid is preferably at least 11:1. The sulphuric acid and hydrogen peroxide react to form Caro acid (H 2 SO 5 ) and water, and the concentration of Caro acid resulting is preferably 3-10%. The liquid is suitable for stripping positive or negative photoresist from a semi-conductor substrate.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19732326447 DE2326447C2 (en) | 1973-05-24 | 1973-05-24 | Process for removing layers of organic material and its use |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1427482A true GB1427482A (en) | 1976-03-10 |
Family
ID=5881998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1469774A Expired GB1427482A (en) | 1973-05-24 | 1974-04-03 | Stripping organic matter |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5231712B2 (en) |
CA (1) | CA1026220A (en) |
DE (1) | DE2326447C2 (en) |
FR (1) | FR2231110B1 (en) |
GB (1) | GB1427482A (en) |
IT (1) | IT1006475B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57186330A (en) * | 1981-05-12 | 1982-11-16 | Matsushita Electronics Corp | Removing method for photoresist |
JPS6053954A (en) * | 1983-09-05 | 1985-03-28 | Oki Electric Ind Co Ltd | Method for washing photomask |
DE3768876D1 (en) * | 1986-08-09 | 1991-05-02 | Micro Image Technology Ltd | COMPOSITION FOR THE PRODUCTION OF INTEGRATED CIRCUITS, APPLICATION AND PRODUCTION METHOD. |
US4872919A (en) * | 1988-01-28 | 1989-10-10 | The Procter & Gamble Company | Method for removing precipitated calcium citrate from juice pasteurization or sterilization equipment |
JPH0294911A (en) * | 1988-09-30 | 1990-04-05 | Toshiba Corp | Manufacture of surface acoustic wave element |
JP3152430B2 (en) * | 1990-10-09 | 2001-04-03 | クロリンエンジニアズ株式会社 | Organic film removal method |
-
1973
- 1973-05-24 DE DE19732326447 patent/DE2326447C2/en not_active Expired
-
1974
- 1974-03-29 FR FR7411895A patent/FR2231110B1/fr not_active Expired
- 1974-04-03 GB GB1469774A patent/GB1427482A/en not_active Expired
- 1974-04-17 IT IT2150574A patent/IT1006475B/en active
- 1974-05-08 CA CA199,318A patent/CA1026220A/en not_active Expired
- 1974-05-15 JP JP5349474A patent/JPS5231712B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2231110A1 (en) | 1974-12-20 |
FR2231110B1 (en) | 1979-02-16 |
DE2326447A1 (en) | 1974-12-12 |
JPS5021681A (en) | 1975-03-07 |
DE2326447C2 (en) | 1986-02-06 |
CA1026220A (en) | 1978-02-14 |
IT1006475B (en) | 1976-09-30 |
JPS5231712B2 (en) | 1977-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |