FR2216077A1 - - Google Patents

Info

Publication number
FR2216077A1
FR2216077A1 FR7403420A FR7403420A FR2216077A1 FR 2216077 A1 FR2216077 A1 FR 2216077A1 FR 7403420 A FR7403420 A FR 7403420A FR 7403420 A FR7403420 A FR 7403420A FR 2216077 A1 FR2216077 A1 FR 2216077A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7403420A
Other versions
FR2216077B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of FR2216077A1 publication Critical patent/FR2216077A1/fr
Application granted granted Critical
Publication of FR2216077B1 publication Critical patent/FR2216077B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Surface Treatment Of Glass (AREA)
FR7403420A 1973-02-02 1974-02-01 Expired FR2216077B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732305188 DE2305188A1 (de) 1973-02-02 1973-02-02 Verfahren zur herstellung von polierten halbleiteroberflaechen

Publications (2)

Publication Number Publication Date
FR2216077A1 true FR2216077A1 (fr) 1974-08-30
FR2216077B1 FR2216077B1 (fr) 1976-04-30

Family

ID=5870787

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7403420A Expired FR2216077B1 (fr) 1973-02-02 1974-02-01

Country Status (6)

Country Link
JP (1) JPS49111580A (fr)
DE (1) DE2305188A1 (fr)
FR (1) FR2216077B1 (fr)
GB (1) GB1449702A (fr)
IT (1) IT1002811B (fr)
NL (1) NL7401454A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0276959A2 (fr) * 1987-01-26 1988-08-03 Canon Kabushiki Kaisha Procédé pour produire un article cristallin
EP0355913A1 (fr) * 1988-08-16 1990-02-28 Koninklijke Philips Electronics N.V. Procédé pour la réalisation d'un dispositif
EP0357205A1 (fr) * 1988-07-28 1990-03-07 Fujitsu Limited Liquide de polissage pour polir un substrat semi-conducteur et procédé de polissage
EP0401147A2 (fr) * 1989-03-07 1990-12-05 International Business Machines Corporation Procédé pour le polissage chémico-mécanique d'un substrat d'un composant électronique, et composition de polissage pour ce procédé

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2538855A1 (de) * 1975-09-01 1977-03-10 Wacker Chemitronic Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid
JPS5531582A (en) * 1978-08-15 1980-03-05 Ibm Free polishing device
DE3517665A1 (de) * 1985-05-15 1986-11-20 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum polieren von siliciumscheiben
JPS6287242A (ja) * 1985-05-29 1987-04-21 Nippon Shokubai Kagaku Kogyo Co Ltd 安定な金属酸化物系ゾル組成物
DE3545383A1 (de) * 1985-12-20 1987-07-02 Wacker Chemitronic Verfahren zum eindiffundieren von wasserstoff in halbleiter-, insbesondere siliciumscheiben
JPS62162462A (ja) * 1986-01-10 1987-07-18 Rohm Co Ltd ウエハ表面仕上方法
JPH01153262A (ja) * 1987-12-10 1989-06-15 Mitsubishi Metal Corp 鏡面研磨方法
US5226930A (en) * 1988-06-03 1993-07-13 Monsanto Japan, Ltd. Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same
JPH0236067A (ja) * 1988-07-25 1990-02-06 Toshiba Corp 研磨方法及びその装置
US6533832B2 (en) 1998-06-26 2003-03-18 Cabot Microelectronics Corporation Chemical mechanical polishing slurry and method for using same
CN102822308B (zh) 2010-03-29 2014-12-03 旭硝子株式会社 研磨剂、研磨方法及半导体集成电路装置的制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3385682A (en) * 1965-04-29 1968-05-28 Sprague Electric Co Method and reagent for surface polishing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3385682A (en) * 1965-04-29 1968-05-28 Sprague Electric Co Method and reagent for surface polishing

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
REVUE US "ELECTROCHEMICAL TECHNOLOGY" VOLUME 6,MARS-AVRIL 1968,"SILICON PLANAR CHEMICAL POLISHING",J.REGH ET G.A.SILVEY,PAGES 155-158. *
REVUE US "JOURNAL OF THE ELECTROCHEMICAL SOCIETY",VOLUME 114,SEPTEMBRE 1967"A WATER-AMINE- COMPLEXING AGENT SYSTEM FOR ETCHING SILICON",R.M.FINNE ET D.L.KLEIN,PAGES 965-970.) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0276959A2 (fr) * 1987-01-26 1988-08-03 Canon Kabushiki Kaisha Procédé pour produire un article cristallin
EP0276959B1 (fr) * 1987-01-26 1999-09-22 Canon Kabushiki Kaisha Procédé pour produire un article cristallin
EP0357205A1 (fr) * 1988-07-28 1990-03-07 Fujitsu Limited Liquide de polissage pour polir un substrat semi-conducteur et procédé de polissage
EP0355913A1 (fr) * 1988-08-16 1990-02-28 Koninklijke Philips Electronics N.V. Procédé pour la réalisation d'un dispositif
EP0401147A2 (fr) * 1989-03-07 1990-12-05 International Business Machines Corporation Procédé pour le polissage chémico-mécanique d'un substrat d'un composant électronique, et composition de polissage pour ce procédé
EP0401147A3 (fr) * 1989-03-07 1991-12-04 International Business Machines Corporation Procédé pour le polissage chémico-mécanique d'un substrat d'un composant électronique, et composition de polissage pour ce procédé

Also Published As

Publication number Publication date
JPS49111580A (fr) 1974-10-24
NL7401454A (fr) 1974-08-06
FR2216077B1 (fr) 1976-04-30
GB1449702A (en) 1976-09-15
IT1002811B (it) 1976-05-20
DE2305188A1 (de) 1974-08-08

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Legal Events

Date Code Title Description
ST Notification of lapse