FR2209216A1 - - Google Patents
Info
- Publication number
- FR2209216A1 FR2209216A1 FR7338736A FR7338736A FR2209216A1 FR 2209216 A1 FR2209216 A1 FR 2209216A1 FR 7338736 A FR7338736 A FR 7338736A FR 7338736 A FR7338736 A FR 7338736A FR 2209216 A1 FR2209216 A1 FR 2209216A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Magnetic Heads (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31100672A | 1972-11-30 | 1972-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2209216A1 true FR2209216A1 (zh) | 1974-06-28 |
FR2209216B1 FR2209216B1 (zh) | 1977-09-30 |
Family
ID=23204973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7338736A Expired FR2209216B1 (zh) | 1972-11-30 | 1973-10-23 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5733703B2 (zh) |
FR (1) | FR2209216B1 (zh) |
GB (1) | GB1441781A (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2388064A1 (fr) * | 1977-04-18 | 1978-11-17 | Philips Nv | Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede |
FR2495192A1 (fr) * | 1980-12-03 | 1982-06-04 | Memorex Corp | Procede de formation de dessins metalliques en couches minces par attaque chimique, notamment pour tetes d'enregistrement magnetique |
EP0088869A2 (en) * | 1982-03-15 | 1983-09-21 | International Business Machines Corporation | Thin film techniques for fabricating narrow track ferrite heads |
CN114173510A (zh) * | 2021-12-08 | 2022-03-11 | 上海交通大学 | 一种具有空气隔热层的微型多层隔热结构及其制备和应用 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5580819A (en) * | 1978-12-14 | 1980-06-18 | Mitsubishi Electric Corp | Manufacture of thin film magnetic head |
JPS5691494A (en) * | 1979-12-25 | 1981-07-24 | Nippon Electric Co | Method of forming conductor pattern |
JPS5766523A (en) * | 1980-10-13 | 1982-04-22 | Hitachi Ltd | Thin-film magnetic head |
JPS57164413A (en) * | 1981-03-31 | 1982-10-09 | Fujitsu Ltd | Manufacture of thin film magnetic head |
JPS5819716A (ja) * | 1981-07-27 | 1983-02-04 | Hitachi Ltd | 薄膜磁気ヘツドおよびその製造方法 |
GB2213325B (en) * | 1987-12-04 | 1992-01-02 | Marconi Electronic Devices | A method of forming electrical conductors |
JPH05235173A (ja) * | 1992-02-24 | 1993-09-10 | Nec Corp | 半導体装置及びその製造方法 |
JPH06215329A (ja) * | 1992-11-18 | 1994-08-05 | Mitsumi Electric Co Ltd | 微細導電パターンの形成方法 |
JPH0644531A (ja) * | 1993-02-24 | 1994-02-18 | Hitachi Ltd | 薄膜磁気ヘッド |
JPH07273118A (ja) * | 1994-03-28 | 1995-10-20 | Toshiba Corp | 配線、電極の形成方法 |
CN114501833B (zh) * | 2020-10-23 | 2024-05-14 | 深南电路股份有限公司 | 线路板上阻焊层的加工方法 |
CN112993087A (zh) * | 2021-03-02 | 2021-06-18 | 苏州太阳井新能源有限公司 | 一种光伏电池电极的制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3154450A (en) * | 1960-01-27 | 1964-10-27 | Bendix Corp | Method of making mesas for diodes by etching |
US3474021A (en) * | 1966-01-12 | 1969-10-21 | Ibm | Method of forming openings using sequential sputtering and chemical etching |
CH482306A (de) * | 1967-08-04 | 1969-11-30 | Western Electric Co | Verfahren zur Herstellung einer mit Kontakten versehenen Halbleiter-Anordnung |
-
1973
- 1973-10-23 FR FR7338736A patent/FR2209216B1/fr not_active Expired
- 1973-10-26 JP JP12004673A patent/JPS5733703B2/ja not_active Expired
- 1973-10-29 GB GB5028773A patent/GB1441781A/en not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3154450A (en) * | 1960-01-27 | 1964-10-27 | Bendix Corp | Method of making mesas for diodes by etching |
US3474021A (en) * | 1966-01-12 | 1969-10-21 | Ibm | Method of forming openings using sequential sputtering and chemical etching |
CH482306A (de) * | 1967-08-04 | 1969-11-30 | Western Electric Co | Verfahren zur Herstellung einer mit Kontakten versehenen Halbleiter-Anordnung |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2388064A1 (fr) * | 1977-04-18 | 1978-11-17 | Philips Nv | Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede |
FR2495192A1 (fr) * | 1980-12-03 | 1982-06-04 | Memorex Corp | Procede de formation de dessins metalliques en couches minces par attaque chimique, notamment pour tetes d'enregistrement magnetique |
EP0088869A2 (en) * | 1982-03-15 | 1983-09-21 | International Business Machines Corporation | Thin film techniques for fabricating narrow track ferrite heads |
EP0088869A3 (en) * | 1982-03-15 | 1986-02-05 | International Business Machines Corporation | Thin film techniques for fabricating narrow track ferrite heads |
CN114173510A (zh) * | 2021-12-08 | 2022-03-11 | 上海交通大学 | 一种具有空气隔热层的微型多层隔热结构及其制备和应用 |
CN114173510B (zh) * | 2021-12-08 | 2022-12-13 | 上海交通大学 | 一种具有空气隔热层的微型多层隔热结构及其制备和应用 |
Also Published As
Publication number | Publication date |
---|---|
FR2209216B1 (zh) | 1977-09-30 |
GB1441781A (en) | 1976-07-07 |
JPS5733703B2 (zh) | 1982-07-19 |
JPS4983868A (zh) | 1974-08-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |