FR2185915B1 - - Google Patents

Info

Publication number
FR2185915B1
FR2185915B1 FR7218676A FR7218676A FR2185915B1 FR 2185915 B1 FR2185915 B1 FR 2185915B1 FR 7218676 A FR7218676 A FR 7218676A FR 7218676 A FR7218676 A FR 7218676A FR 2185915 B1 FR2185915 B1 FR 2185915B1
Authority
FR
France
Prior art keywords
studs
substrate
wire
component
thermo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7218676A
Other languages
English (en)
French (fr)
Other versions
FR2185915A1 (Direct
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR7218676A priority Critical patent/FR2185915B1/fr
Priority to GB2289373A priority patent/GB1427588A/en
Priority to IT68521/73A priority patent/IT986355B/it
Priority to DE2326861A priority patent/DE2326861A1/de
Publication of FR2185915A1 publication Critical patent/FR2185915A1/fr
Priority to BE150705A priority patent/BE822420A/xx
Application granted granted Critical
Publication of FR2185915B1 publication Critical patent/FR2185915B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
FR7218676A 1972-05-25 1972-05-25 Expired FR2185915B1 (Direct)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR7218676A FR2185915B1 (Direct) 1972-05-25 1972-05-25
GB2289373A GB1427588A (en) 1972-05-25 1973-05-14 Method of connecting electronic micro-components
IT68521/73A IT986355B (it) 1972-05-25 1973-05-24 Procedimento per l interconnessio ne di microcomponenti elettronici
DE2326861A DE2326861A1 (de) 1972-05-25 1973-05-25 Verfahren zum gegenseitigen verbinden von elektronischen mikrobausteinen und nach einem solchen verfahren hergestellte verbindungssubstrate und hybridschaltungen
BE150705A BE822420A (fr) 1972-05-25 1974-11-20 Procede d'interconnexion de microcomposants electroniques et circuits de mise en oeuvre du dit procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7218676A FR2185915B1 (Direct) 1972-05-25 1972-05-25

Publications (2)

Publication Number Publication Date
FR2185915A1 FR2185915A1 (Direct) 1974-01-04
FR2185915B1 true FR2185915B1 (Direct) 1975-08-29

Family

ID=9099096

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7218676A Expired FR2185915B1 (Direct) 1972-05-25 1972-05-25

Country Status (5)

Country Link
BE (1) BE822420A (Direct)
DE (1) DE2326861A1 (Direct)
FR (1) FR2185915B1 (Direct)
GB (1) GB1427588A (Direct)
IT (1) IT986355B (Direct)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3981076A (en) * 1974-11-27 1976-09-21 Commissariat A L'energie Atomique Method of connecting electronic microcomponents
DE3501710A1 (de) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. Leiterplatte mit integralen positioniermitteln
DE19618917C1 (de) * 1996-05-12 1997-10-02 Markus Woelfel Verfahren und Vorrichtung zur Herstellung von drahtgeschriebenen Leiterplatten
DE19705934C2 (de) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Einbringen von drahtförmigen Leiterdrähten in ein Substrat
DE102006037093B3 (de) * 2006-08-07 2008-03-13 Reinhard Ulrich Fügeverfahren und Vorrichtung zum Verlegen von dünnem Draht
DE102007037165A1 (de) 2007-08-07 2009-02-12 Mühlbauer Ag Verfahren und Vorrichtung zum Verlegen von dünnem Draht

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1070248A (en) * 1966-01-31 1967-06-01 Standard Telephones Cables Ltd Electrical wiring assembly
JPS5550399B1 (Direct) * 1970-03-05 1980-12-17
US3710441A (en) * 1970-05-15 1973-01-16 Bunker Ramo Numerically controlled automatic wiring system
US3703033A (en) * 1970-06-22 1972-11-21 Bunker Ramo Combined component and interconnection module and method of making

Also Published As

Publication number Publication date
FR2185915A1 (Direct) 1974-01-04
GB1427588A (en) 1976-03-10
IT986355B (it) 1975-01-30
DE2326861C2 (Direct) 1987-08-27
DE2326861A1 (de) 1973-12-06
BE822420A (fr) 1975-03-14

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Legal Events

Date Code Title Description
ST Notification of lapse