FR2182216B1 - - Google Patents

Info

Publication number
FR2182216B1
FR2182216B1 FR7315498A FR7315498A FR2182216B1 FR 2182216 B1 FR2182216 B1 FR 2182216B1 FR 7315498 A FR7315498 A FR 7315498A FR 7315498 A FR7315498 A FR 7315498A FR 2182216 B1 FR2182216 B1 FR 2182216B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7315498A
Other languages
French (fr)
Other versions
FR2182216A1 (zh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2182216A1 publication Critical patent/FR2182216A1/fr
Application granted granted Critical
Publication of FR2182216B1 publication Critical patent/FR2182216B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FR7315498A 1972-04-28 1973-04-27 Expired FR2182216B1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4306172A JPS495265A (zh) 1972-04-28 1972-04-28

Publications (2)

Publication Number Publication Date
FR2182216A1 FR2182216A1 (zh) 1973-12-07
FR2182216B1 true FR2182216B1 (zh) 1977-08-19

Family

ID=12653339

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7315498A Expired FR2182216B1 (zh) 1972-04-28 1973-04-27

Country Status (5)

Country Link
JP (1) JPS495265A (zh)
DE (1) DE2321501A1 (zh)
FR (1) FR2182216B1 (zh)
GB (1) GB1383165A (zh)
NL (1) NL7305945A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255537A (en) * 1975-10-31 1977-05-07 Sumitomo Electric Ind Ltd Chargning device
JPS5421727A (en) * 1977-07-19 1979-02-19 Ricoh Co Ltd Detecting and treating method for wire rupture of corona discharge of copier
DE3840588C1 (en) * 1988-12-02 1990-02-22 Westdeutsche Quarzschmelze Gmbh & Co. Kg, 2054 Geesthacht, De Quartz glass container for the thermal treatment of semiconductor wafers
AUPR174800A0 (en) 2000-11-29 2000-12-21 Australian National University, The Semiconductor processing
KR20040068928A (ko) 2001-11-29 2004-08-02 오리진 에너지 솔라 피티와이 리미티드 반도체 가공 방법
DE102006060195A1 (de) * 2006-12-18 2008-06-26 Jacobs University Bremen Ggmbh Kantenverrundung von Wafern

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3128213A (en) * 1961-07-20 1964-04-07 Int Rectifier Corp Method of making a semiconductor device

Also Published As

Publication number Publication date
GB1383165A (en) 1975-02-05
DE2321501A1 (de) 1973-11-15
JPS495265A (zh) 1974-01-17
FR2182216A1 (zh) 1973-12-07
NL7305945A (zh) 1973-10-30

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