FR2182216A1 - - Google Patents
Info
- Publication number
- FR2182216A1 FR2182216A1 FR7315498A FR7315498A FR2182216A1 FR 2182216 A1 FR2182216 A1 FR 2182216A1 FR 7315498 A FR7315498 A FR 7315498A FR 7315498 A FR7315498 A FR 7315498A FR 2182216 A1 FR2182216 A1 FR 2182216A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4306172A JPS495265A (zh) | 1972-04-28 | 1972-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2182216A1 true FR2182216A1 (zh) | 1973-12-07 |
FR2182216B1 FR2182216B1 (zh) | 1977-08-19 |
Family
ID=12653339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7315498A Expired FR2182216B1 (zh) | 1972-04-28 | 1973-04-27 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS495265A (zh) |
DE (1) | DE2321501A1 (zh) |
FR (1) | FR2182216B1 (zh) |
GB (1) | GB1383165A (zh) |
NL (1) | NL7305945A (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5255537A (en) * | 1975-10-31 | 1977-05-07 | Sumitomo Electric Ind Ltd | Chargning device |
JPS5421727A (en) * | 1977-07-19 | 1979-02-19 | Ricoh Co Ltd | Detecting and treating method for wire rupture of corona discharge of copier |
DE3840588C1 (en) * | 1988-12-02 | 1990-02-22 | Westdeutsche Quarzschmelze Gmbh & Co. Kg, 2054 Geesthacht, De | Quartz glass container for the thermal treatment of semiconductor wafers |
AUPR174800A0 (en) | 2000-11-29 | 2000-12-21 | Australian National University, The | Semiconductor processing |
KR20040068928A (ko) | 2001-11-29 | 2004-08-02 | 오리진 에너지 솔라 피티와이 리미티드 | 반도체 가공 방법 |
DE102006060195A1 (de) * | 2006-12-18 | 2008-06-26 | Jacobs University Bremen Ggmbh | Kantenverrundung von Wafern |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3128213A (en) * | 1961-07-20 | 1964-04-07 | Int Rectifier Corp | Method of making a semiconductor device |
-
1972
- 1972-04-28 JP JP4306172A patent/JPS495265A/ja active Pending
-
1973
- 1973-04-27 FR FR7315498A patent/FR2182216B1/fr not_active Expired
- 1973-04-27 NL NL7305945A patent/NL7305945A/xx unknown
- 1973-04-27 DE DE19732321501 patent/DE2321501A1/de active Pending
- 1973-04-30 GB GB2048273A patent/GB1383165A/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3128213A (en) * | 1961-07-20 | 1964-04-07 | Int Rectifier Corp | Method of making a semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
GB1383165A (en) | 1975-02-05 |
DE2321501A1 (de) | 1973-11-15 |
FR2182216B1 (zh) | 1977-08-19 |
JPS495265A (zh) | 1974-01-17 |
NL7305945A (zh) | 1973-10-30 |