FR2177766B1 - - Google Patents
Info
- Publication number
- FR2177766B1 FR2177766B1 FR7306798A FR7306798A FR2177766B1 FR 2177766 B1 FR2177766 B1 FR 2177766B1 FR 7306798 A FR7306798 A FR 7306798A FR 7306798 A FR7306798 A FR 7306798A FR 2177766 B1 FR2177766 B1 FR 2177766B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/143—Electron beam
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/949—Energy beam treating radiation resist on semiconductor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
- ing And Chemical Polishing (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23787572A | 1972-03-24 | 1972-03-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2177766A1 FR2177766A1 (fr) | 1973-11-09 |
FR2177766B1 true FR2177766B1 (fr) | 1983-06-10 |
Family
ID=22895609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7306798A Expired FR2177766B1 (fr) | 1972-03-24 | 1973-02-20 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3779806A (fr) |
JP (1) | JPS5218097B2 (fr) |
CA (1) | CA1010401A (fr) |
DE (1) | DE2314124C3 (fr) |
FR (1) | FR2177766B1 (fr) |
GB (1) | GB1370403A (fr) |
IT (1) | IT981198B (fr) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4113897A (en) * | 1973-01-29 | 1978-09-12 | Rca Corporation | Smooth groove formation method employing spin coating of negative replica of inscribed disc |
US3893127A (en) * | 1973-09-27 | 1975-07-01 | Rca Corp | Electron beam recording media |
US3934057A (en) * | 1973-12-19 | 1976-01-20 | International Business Machines Corporation | High sensitivity positive resist layers and mask formation process |
US3996393A (en) * | 1974-03-25 | 1976-12-07 | International Business Machines Corporation | Positive polymeric electron beam resists of very great sensitivity |
US3987215A (en) * | 1974-04-22 | 1976-10-19 | International Business Machines Corporation | Resist mask formation process |
US4078098A (en) * | 1974-05-28 | 1978-03-07 | International Business Machines Corporation | High energy radiation exposed positive resist mask process |
US3976524A (en) * | 1974-06-17 | 1976-08-24 | Ibm Corporation | Planarization of integrated circuit surfaces through selective photoresist masking |
US4011351A (en) * | 1975-01-29 | 1977-03-08 | International Business Machines Corporation | Preparation of resist image with methacrylate polymers |
JPS51147324A (en) * | 1975-06-13 | 1976-12-17 | Fujitsu Ltd | Solvent for electronic wire resist |
JPS524834A (en) * | 1975-06-30 | 1977-01-14 | Agency Of Ind Science & Technol | Image formation method through electron beam and resisting agent compo sitions which are used for the methoi |
JPS5271239A (en) * | 1975-12-10 | 1977-06-14 | Matsushita Electric Ind Co Ltd | Electron beam sensitive material |
US4103064A (en) * | 1976-01-09 | 1978-07-25 | Dios, Inc. | Microdevice substrate and method for making micropattern devices |
JPS5293332A (en) * | 1976-02-02 | 1977-08-05 | Agency Of Ind Science & Technol | Polymer materials for electronic irradiation resist |
JPS5350681A (en) * | 1976-10-19 | 1978-05-09 | Matsushita Electric Ind Co Ltd | Solvent for electron beam resist |
JPS5352593A (en) * | 1976-10-26 | 1978-05-13 | Agency Of Ind Science & Technol | Electron rays-sensitive polymer |
EP0016679B1 (fr) * | 1979-03-09 | 1982-06-09 | Thomson-Csf | Substances de photomasquage, leur procédé de préparation, et masque obtenu |
JPS5857734B2 (ja) * | 1979-05-15 | 1983-12-21 | 超エル・エス・アイ技術研究組合 | 皮膜形成方法法 |
US4338392A (en) * | 1979-08-09 | 1982-07-06 | International Business Machines Corporation | Class of E-beam resists based on conducting organic charge transfer salts |
US4312935A (en) * | 1979-08-09 | 1982-01-26 | International Business Machines Corporation | Class of E-beam resists based on conducting organic charge transfer salts |
US4312936A (en) * | 1979-08-09 | 1982-01-26 | International Business Machines Corporation | Class of E-beam resists based on conducting organic charge transfer salts |
JPS5639539A (en) * | 1979-09-07 | 1981-04-15 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Pattern forming method |
US4415653A (en) * | 1981-05-07 | 1983-11-15 | Honeywell Inc. | Method of making sensitive positive electron beam resists |
US4508812A (en) * | 1984-05-03 | 1985-04-02 | Hughes Aircraft Company | Method of applying poly(methacrylic anhydride resist to a semiconductor |
JPS6221151A (ja) * | 1985-07-19 | 1987-01-29 | Matsushita Electric Ind Co Ltd | パタ−ン形成方法 |
JPH0816784B2 (ja) * | 1989-09-27 | 1996-02-21 | 工業技術院物質工学工業技術研究所長 | 感可視光樹脂組成物 |
US6632590B1 (en) | 2000-07-14 | 2003-10-14 | Taiwan Semiconductor Manufacturing Company | Enhance the process window of memory cell line/space dense pattern in sub-wavelength process |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3392051A (en) * | 1964-06-08 | 1968-07-09 | Ibm | Method for forming thin film electrical circuit elements by preferential nucleation techniques |
US3436468A (en) * | 1965-05-28 | 1969-04-01 | Texas Instruments Inc | Plastic bodies having regions of altered chemical structure and method of making same |
US3535137A (en) * | 1967-01-13 | 1970-10-20 | Ibm | Method of fabricating etch resistant masks |
AT301620B (de) * | 1967-10-23 | 1972-08-15 | Siemens Ag | Verfahren zum herstellen einer photolackmaske fuer halbleiterzwecke |
GB1237433A (en) * | 1968-06-06 | 1971-06-30 | Standard Telephones Cables Ltd | Improvements in or relating to photolithographic masks |
US3696742A (en) * | 1969-10-06 | 1972-10-10 | Monsanto Res Corp | Method of making a stencil for screen-printing using a laser beam |
-
1972
- 1972-03-24 US US00237875A patent/US3779806A/en not_active Expired - Lifetime
-
1973
- 1973-01-31 GB GB474473A patent/GB1370403A/en not_active Expired
- 1973-02-08 CA CA163,468A patent/CA1010401A/en not_active Expired
- 1973-02-14 JP JP48017558A patent/JPS5218097B2/ja not_active Expired
- 1973-02-20 FR FR7306798A patent/FR2177766B1/fr not_active Expired
- 1973-03-08 IT IT21308/73A patent/IT981198B/it active
- 1973-03-21 DE DE2314124A patent/DE2314124C3/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2177766A1 (fr) | 1973-11-09 |
CA1010401A (en) | 1977-05-17 |
DE2314124C3 (de) | 1981-06-25 |
JPS4915372A (fr) | 1974-02-09 |
IT981198B (it) | 1974-10-10 |
DE2314124B2 (de) | 1980-11-13 |
GB1370403A (en) | 1974-10-16 |
JPS5218097B2 (fr) | 1977-05-19 |
US3779806A (en) | 1973-12-18 |
DE2314124A1 (de) | 1973-10-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |