FR2162275A1 - Encapsulated high power semiconductor - with improved heat dissipation - Google Patents
Encapsulated high power semiconductor - with improved heat dissipationInfo
- Publication number
- FR2162275A1 FR2162275A1 FR7144032A FR7144032A FR2162275A1 FR 2162275 A1 FR2162275 A1 FR 2162275A1 FR 7144032 A FR7144032 A FR 7144032A FR 7144032 A FR7144032 A FR 7144032A FR 2162275 A1 FR2162275 A1 FR 2162275A1
- Authority
- FR
- France
- Prior art keywords
- elements
- high power
- electrodes
- power semiconductor
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
Landscapes
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7144032A FR2162275A1 (en) | 1971-12-08 | 1971-12-08 | Encapsulated high power semiconductor - with improved heat dissipation |
| IT32475/72A IT971532B (it) | 1971-12-08 | 1972-12-05 | Perfezionamenti ai dispositivi semiconduttori |
| DE2260217A DE2260217A1 (de) | 1971-12-08 | 1972-12-08 | Halbleitervorrichtung mit hoher leistung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7144032A FR2162275A1 (en) | 1971-12-08 | 1971-12-08 | Encapsulated high power semiconductor - with improved heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2162275A1 true FR2162275A1 (en) | 1973-07-20 |
| FR2162275B1 FR2162275B1 (enExample) | 1974-06-07 |
Family
ID=9087133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7144032A Granted FR2162275A1 (en) | 1971-12-08 | 1971-12-08 | Encapsulated high power semiconductor - with improved heat dissipation |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2260217A1 (enExample) |
| FR (1) | FR2162275A1 (enExample) |
| IT (1) | IT971532B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4188637A (en) * | 1976-07-06 | 1980-02-12 | Licentia Patent-Verwaltungs-G.M.B.H. | Disc-shaped semiconductor device having an annular housing of elastomer material |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56142645A (en) * | 1980-04-07 | 1981-11-07 | Hitachi Ltd | Semiconductor device |
| JPS6060172U (ja) * | 1983-09-13 | 1985-04-26 | 本田技研工業株式会社 | 整流器付トランス装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1486215A (fr) * | 1965-07-09 | 1967-06-23 | Asea Ab | Dispositif à semi-conducteur |
| FR1556831A (enExample) * | 1967-03-23 | 1969-02-07 |
-
1971
- 1971-12-08 FR FR7144032A patent/FR2162275A1/fr active Granted
-
1972
- 1972-12-05 IT IT32475/72A patent/IT971532B/it active
- 1972-12-08 DE DE2260217A patent/DE2260217A1/de active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1486215A (fr) * | 1965-07-09 | 1967-06-23 | Asea Ab | Dispositif à semi-conducteur |
| FR1556831A (enExample) * | 1967-03-23 | 1969-02-07 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4188637A (en) * | 1976-07-06 | 1980-02-12 | Licentia Patent-Verwaltungs-G.M.B.H. | Disc-shaped semiconductor device having an annular housing of elastomer material |
Also Published As
| Publication number | Publication date |
|---|---|
| IT971532B (it) | 1974-05-10 |
| FR2162275B1 (enExample) | 1974-06-07 |
| DE2260217A1 (de) | 1973-06-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |