FR2126289B1 - - Google Patents

Info

Publication number
FR2126289B1
FR2126289B1 FR7205936A FR7205936A FR2126289B1 FR 2126289 B1 FR2126289 B1 FR 2126289B1 FR 7205936 A FR7205936 A FR 7205936A FR 7205936 A FR7205936 A FR 7205936A FR 2126289 B1 FR2126289 B1 FR 2126289B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7205936A
Other languages
French (fr)
Other versions
FR2126289A1 (cg-RX-API-DMAC7.html
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OI Glass Inc
Original Assignee
Owens Illinois Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Owens Illinois Inc filed Critical Owens Illinois Inc
Publication of FR2126289A1 publication Critical patent/FR2126289A1/fr
Application granted granted Critical
Publication of FR2126289B1 publication Critical patent/FR2126289B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0018—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/20—Materials for coating a single layer on glass
    • C03C2217/25—Metals
    • C03C2217/251—Al, Cu, Mg or noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Glass Compositions (AREA)
FR7205936A 1971-02-23 1972-02-22 Expired FR2126289B1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00118201A US3802892A (en) 1971-02-23 1971-02-23 Glasses suitable for production of copper-coated glass-ceramics

Publications (2)

Publication Number Publication Date
FR2126289A1 FR2126289A1 (cg-RX-API-DMAC7.html) 1972-10-06
FR2126289B1 true FR2126289B1 (cg-RX-API-DMAC7.html) 1975-06-13

Family

ID=22377109

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7205936A Expired FR2126289B1 (cg-RX-API-DMAC7.html) 1971-02-23 1972-02-22

Country Status (6)

Country Link
US (1) US3802892A (cg-RX-API-DMAC7.html)
BE (1) BE779648A (cg-RX-API-DMAC7.html)
DE (1) DE2205482A1 (cg-RX-API-DMAC7.html)
FR (1) FR2126289B1 (cg-RX-API-DMAC7.html)
IT (1) IT948398B (cg-RX-API-DMAC7.html)
NL (1) NL7202357A (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3854919A (en) * 1971-07-23 1974-12-17 Owens Illinois Inc Method of forming transparent glass ceramic with compression layer
JPS5324966B2 (cg-RX-API-DMAC7.html) * 1972-12-25 1978-07-24
FR2234239B1 (cg-RX-API-DMAC7.html) * 1973-06-25 1977-02-18 Ishizuka Glass
NL7416556A (nl) * 1974-12-19 1976-06-22 Philips Nv Aansmelting aan metalen deel met koperen oppervlak.
JPS5912624B2 (ja) * 1975-05-24 1984-03-24 石塚硝子 （株） 高温用断熱材とその製造方法
US4224068A (en) * 1978-09-14 1980-09-23 General Motors Corporation Method of making distributor rotor electrode containing dielectric bodies for suppressing radio frequency interference
US4414281A (en) * 1982-02-16 1983-11-08 Corning Glass Works Glass-ceramic articles having metallic surfaces
GB8327949D0 (en) * 1983-10-19 1983-11-23 Holmes A Glass ceramic materials
FR2575331B1 (fr) * 1984-12-21 1987-06-05 Labo Electronique Physique Boitier pour composant electronique
US4836837A (en) * 1987-11-16 1989-06-06 Owens-Corning Fiberglas Corporation Metal coated glass fibers
JP2000508290A (ja) * 1996-04-09 2000-07-04 ボーテック・コーポレイション フライアッシュからのセラミックタイルの製造
US6030681A (en) * 1997-07-10 2000-02-29 Raychem Corporation Magnetic disk comprising a substrate with a cermet layer on a porcelain
US6391809B1 (en) * 1999-12-30 2002-05-21 Corning Incorporated Copper alumino-silicate glasses
US8181483B2 (en) * 2007-06-01 2012-05-22 Schott Ag Processes for preparing electrically-conductive glass-ceramics
US8241395B2 (en) * 2007-06-11 2012-08-14 Schott Corporation Glass-ceramic membranes
US9139465B2 (en) * 2009-08-04 2015-09-22 Lehigh University Conductive doped metal-glass compositions and methods

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1496540B1 (de) * 1963-02-27 1970-08-06 Ishizuka Glass Verfahren zur Erzeugung von UEberzuegen aus metallischem Kupfer und/oder Silber auf entglasten keramischen Formkoerpern

Also Published As

Publication number Publication date
NL7202357A (cg-RX-API-DMAC7.html) 1972-08-25
BE779648A (fr) 1972-08-22
FR2126289A1 (cg-RX-API-DMAC7.html) 1972-10-06
IT948398B (it) 1973-05-30
US3802892A (en) 1974-04-09
DE2205482A1 (de) 1972-09-07

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Legal Events

Date Code Title Description
ST Notification of lapse