FR2124488B1 - - Google Patents

Info

Publication number
FR2124488B1
FR2124488B1 FR7203793A FR7203793A FR2124488B1 FR 2124488 B1 FR2124488 B1 FR 2124488B1 FR 7203793 A FR7203793 A FR 7203793A FR 7203793 A FR7203793 A FR 7203793A FR 2124488 B1 FR2124488 B1 FR 2124488B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7203793A
Other languages
French (fr)
Other versions
FR2124488A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2124488A1 publication Critical patent/FR2124488A1/fr
Application granted granted Critical
Publication of FR2124488B1 publication Critical patent/FR2124488B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W74/012—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H10W72/20—
    • H10W74/15—
    • H10W72/07236—
    • H10W72/856—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR7203793A 1971-02-05 1972-02-04 Expired FR2124488B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101601.A NL158025B (nl) 1971-02-05 1971-02-05 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.

Publications (2)

Publication Number Publication Date
FR2124488A1 FR2124488A1 (enExample) 1972-09-22
FR2124488B1 true FR2124488B1 (enExample) 1975-10-24

Family

ID=19812418

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7203793A Expired FR2124488B1 (enExample) 1971-02-05 1972-02-04

Country Status (10)

Country Link
US (1) US3811183A (enExample)
JP (1) JPS5137145B1 (enExample)
AU (1) AU463626B2 (enExample)
CA (1) CA964381A (enExample)
DE (1) DE2202337C3 (enExample)
FR (1) FR2124488B1 (enExample)
GB (1) GB1362603A (enExample)
HK (1) HK59176A (enExample)
IT (1) IT951756B (enExample)
NL (1) NL158025B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US5087961A (en) * 1987-01-28 1992-02-11 Lsi Logic Corporation Semiconductor device package
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
US5469333A (en) * 1993-05-05 1995-11-21 International Business Machines Corporation Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads
US5311059A (en) * 1992-01-24 1994-05-10 Motorola, Inc. Backplane grounding for flip-chip integrated circuit
FR2704691B1 (fr) * 1993-04-30 1995-06-02 Commissariat Energie Atomique Procédé d'enrobage de composants électroniques hybrides par billes sur un substrat.
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
US5756395A (en) * 1995-08-18 1998-05-26 Lsi Logic Corporation Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US6137125A (en) * 1995-12-21 2000-10-24 The Whitaker Corporation Two layer hermetic-like coating for on-wafer encapsulatuon of GaAs MMIC's having flip-chip bonding capabilities
JPH1032221A (ja) * 1996-07-12 1998-02-03 Nec Corp プリント配線基板
JP3431406B2 (ja) * 1996-07-30 2003-07-28 株式会社東芝 半導体パッケージ装置
US6132850A (en) * 1996-11-25 2000-10-17 Raytheon Company Reworkable, thermally-conductive adhesives for electronic assemblies
US6074895A (en) * 1997-09-23 2000-06-13 International Business Machines Corporation Method of forming a flip chip assembly
JP4239310B2 (ja) * 1998-09-01 2009-03-18 ソニー株式会社 半導体装置の製造方法
JP2000091285A (ja) * 1998-09-08 2000-03-31 Disco Abrasive Syst Ltd 半導体物品の研削方法
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
JP4423379B2 (ja) * 2008-03-25 2010-03-03 合同会社先端配線材料研究所 銅配線、半導体装置および銅配線の形成方法
KR20100104911A (ko) * 2009-03-19 2010-09-29 삼성전자주식회사 반도체 패키지
USD941799S1 (en) * 2020-04-28 2022-01-25 Guangzhou OPSMEN Tech.Co., Ltd Electronic earmuff headphone
USD1024004S1 (en) * 2021-10-22 2024-04-23 Guangzhou OPSMEN Tech. Co., Ltd Electronic hearing protector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3285802A (en) * 1962-03-01 1966-11-15 Owens Illinois Inc Glass aerosol bottles and method for making same
US3297186A (en) * 1962-07-24 1967-01-10 Owens Illinois Inc Transparent glass container and method of making same
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
DE1298637B (de) * 1964-03-06 1969-07-03 Itt Ind Gmbh Deutsche Verfahren zur serienmaessigen maschinellen Kontaktierung von Halbleiterbauelementelektroden
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same

Also Published As

Publication number Publication date
DE2202337C3 (de) 1980-01-24
NL158025B (nl) 1978-09-15
DE2202337B2 (de) 1979-05-10
DE2202337A1 (de) 1972-08-17
AU3853972A (en) 1973-08-09
JPS5137145B1 (enExample) 1976-10-14
HK59176A (en) 1976-10-01
AU463626B2 (en) 1975-07-10
FR2124488A1 (enExample) 1972-09-22
CA964381A (en) 1975-03-11
IT951756B (it) 1973-07-10
GB1362603A (en) 1974-08-07
US3811183A (en) 1974-05-21
NL7101601A (enExample) 1972-08-08

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Legal Events

Date Code Title Description
ST Notification of lapse