FR2118752A5 - - Google Patents

Info

Publication number
FR2118752A5
FR2118752A5 FR7145450A FR7145450A FR2118752A5 FR 2118752 A5 FR2118752 A5 FR 2118752A5 FR 7145450 A FR7145450 A FR 7145450A FR 7145450 A FR7145450 A FR 7145450A FR 2118752 A5 FR2118752 A5 FR 2118752A5
Authority
FR
France
Prior art keywords
green ceramic
ceramic
printed
conductor
ceramic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7145450A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of FR2118752A5 publication Critical patent/FR2118752A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7145450A 1970-12-18 1971-12-17 Expired FR2118752A5 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11302670 1970-12-18

Publications (1)

Publication Number Publication Date
FR2118752A5 true FR2118752A5 (enExample) 1972-07-28

Family

ID=14601569

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7145450A Expired FR2118752A5 (enExample) 1970-12-18 1971-12-17

Country Status (3)

Country Link
DE (1) DE2162488A1 (enExample)
FR (1) FR2118752A5 (enExample)
GB (1) GB1369627A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2303443A1 (fr) * 1975-03-03 1976-10-01 Hughes Aircraft Co Microcircuit hybride de grande surface et son procede de realisation
EP0035438A3 (en) * 1980-02-26 1981-09-23 Thomson-Csf Method for the hermetic encapsulation of very high frequency electronic components comprising the making of metallic traverses, and device made by such a method
US4372037A (en) 1975-03-03 1983-02-08 Hughes Aircraft Company Large area hybrid microcircuit assembly
FR2517503A1 (fr) * 1981-11-30 1983-06-03 Nippon Electric Co Substrat comportant un motif constitue d'un alliage d'or, d'un metal noble et d'un metal de base, le motif etant isole par des oxydes des metaux nobles et de base
US4410874A (en) 1975-03-03 1983-10-18 Hughes Aircraft Company Large area hybrid microcircuit assembly
EP0100817A3 (en) * 1982-08-05 1986-01-22 Olin Corporation Improved hermetically sealed semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2199182A (en) * 1986-12-18 1988-06-29 Marconi Electronic Devices Multilayer circuit arrangement
EP3671161B1 (de) 2018-12-21 2025-01-29 Exentis Knowledge GmbH Formkörper sowie verfahren zur herstellung eines formkörpers
EP3671160B1 (de) 2018-12-21 2024-07-31 Exentis Knowledge GmbH Formkörper sowie verfahren zur herstellung eines formkörpers
EP3671159B1 (de) * 2018-12-21 2022-12-21 Exentis Knowledge GmbH Körper hergestellt durch additives herstellungsverfahren und verfahren zur herstellung des körpers

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2303443A1 (fr) * 1975-03-03 1976-10-01 Hughes Aircraft Co Microcircuit hybride de grande surface et son procede de realisation
US4372037A (en) 1975-03-03 1983-02-08 Hughes Aircraft Company Large area hybrid microcircuit assembly
US4410874A (en) 1975-03-03 1983-10-18 Hughes Aircraft Company Large area hybrid microcircuit assembly
EP0035438A3 (en) * 1980-02-26 1981-09-23 Thomson-Csf Method for the hermetic encapsulation of very high frequency electronic components comprising the making of metallic traverses, and device made by such a method
US4404745A (en) 1980-02-26 1983-09-20 Thomson-Csf Process for sealing VHF component in case
FR2517503A1 (fr) * 1981-11-30 1983-06-03 Nippon Electric Co Substrat comportant un motif constitue d'un alliage d'or, d'un metal noble et d'un metal de base, le motif etant isole par des oxydes des metaux nobles et de base
EP0100817A3 (en) * 1982-08-05 1986-01-22 Olin Corporation Improved hermetically sealed semiconductor casing
US4656499A (en) * 1982-08-05 1987-04-07 Olin Corporation Hermetically sealed semiconductor casing

Also Published As

Publication number Publication date
GB1369627A (en) 1974-10-09
DE2162488A1 (de) 1972-07-06

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Legal Events

Date Code Title Description
ST Notification of lapse